DIN EN 60191-6-4
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003
active, Most Current
| Organization: | DIN |
| Publication Date: | 1 January 2004 |
| Status: | active |
| Page Count: | 20 |
| ICS Code (Electrical and electronics engineering drawings): | 01.100.25 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
DIN EN 60191-6-4
January 1, 2004
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003
A description is not available for this item.
May 1, 2002
Mechanical standardization of semiconductor devices - Part 6-4: BGA (Ball Grid Array) package measuring method (IEC 47D/469/CDV:2001); German version prEN 60191-6-4:2001
A description is not available for this item.