DIN EN 60068-2-58
Environmental testing - Part 2-58: Test - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 91/963/CD:2011)
inactive, Most Current
Organization: | DIN |
Publication Date: | 1 July 2011 |
Status: | inactive |
Page Count: | 54 |
ICS Code (Environmental testing): | 19.040 |
Document History
DIN EN 60068-2-58
July 1, 2011
Environmental testing - Part 2-58: Test - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 91/963/CD:2011)
A description is not available for this item.