Standard: ECIA - EIA CB 11

SURFACE MOUNTING OF MULTILAYER CERAMIC CHIP CAPACITORS, GUIDELINES FOR

This standard is available for individual purchase.

or unlock this standard with a subscription to IHS Standards Expert

IHS Standards Expert subscription, simplifies and expedites the process for finding and managing standards by giving you access to standards from over 370 standards developing organizations (SDOs).

FEATURES & BENEFITS
  • Maximize product development and R&D with direct access to over 1.6 million standards
  • Discover new markets: Identify unmet needs and discover next-generation technologies
  • Improve quality by leveraging consistent standards to meet customer and market requirements
  • Minimize risk: Mitigate liability and better understand compliance regulations
  • Boost efficiency: Speed up research, capture and reuse expertise
For additional product information, visit the IHS Standards Expert page.

HOW TO SUBSCRIBE
For more information or a custom quote, visit the IHS Contact Us page for regional contact information.
Scope:

SCOPE AND INTRODUCTION

This document provides guidelines for the use of multilayer ceramic chip capacitors, their design and construction as well as handling, mounting .and connection requirements. Use of chip capacitors to construct hybrid microcircuits is a mature technology in widespread use. The use of capacitor chips on printed wiring or printed circuit boards as well as other larger area substrates such as ceramic or porcelainized-steel, is a comparatively new technology generally referred to as SMT, surface mount technology.

The physical and mechanical aspects of -the chip and its use are the primary subjects of this document. Included is a review of the design and materials employed in the chip's construction, as well as the material and process requirements for their mounting and interconnection by soldering.

Guidelines for the selection and use of these chips based on electrical ratings, values and performance characteristics are given in ELA specification EIA-198-C, Ceramic Dielectric Capacitors.

Note that this document concentrates and directs its information to the mounting and interconnection of chips by soldering.

PURPOSE

'The information is provided to assist the user's various engineering and manufacturing personnel in the making of informed choices in regard to these chip capacitors; their selection, specification and circuit assembly processing.

Organization: Electronic Components Industry Association
Document Number: eia cb 11
Publish Date: 1986-01-01
Page Count: 56
Available Languages: EN
DOD Adopted: NO
ANSI Approved: NO
Most Recent Revision: YES
Current Version: YES
Status: Active

Standards That Reference This Standard

Showing 1 of 1.


Advertisement
Advertisement
Advertisement
Advertisement