Standard: ECIA - 540GA00

BLANK DETAIL SPECIFICATION FOR BURN-IN SOCKETS FOR CHIP CARRIER PACKAGES WITH MOLDED CARRIER RINGS FOR USE IN ELECTRONIC EQUIPMENT

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Scope:

The Burn-In Sockets of assessed quality covered by this Detail Specification shall have:

a) Maximum enclosure (maximum length, width, and height dimensions).

b) A working voltage not exceeding _ volts (rms).

c) Current not exceeding _ ampere per pin.

OBJECT

The object of this Detail Specification is to provide all information required for the identification and quality assessment of the Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings. The sockets have solder tail leads. The information contained herein or by reference, is complete and sufficient for inspection purposes.

Organization: Electronic Components Industry Association
Document Number: 540ga00
Publish Date: 1993-01-01
Page Count: 19
Available Languages: EN
DOD Adopted: NO
ANSI Approved: NO
Most Recent Revision: YES
Current Version: YES
Status: Inactive

Document History

Document # Change Type Update Date Revision Status
EIA-540GA00 Change Type: REAF Update Date: 1993-01-01 Revision: 93 Status: INAC

This Standard References

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