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IPC - IPC-C-1000 - IPC ESSENTIAL DOCUMENT COLLECTION FOR BOARD DESIGN, ASSEMBLY AND MANUFACTURE - TO PURCHASE HARDCOPY COMPILATION, CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE. STANDARDS FROM THIS COMPILATION ARE AVAILABLE AS INDIVIDUAL DOCUMENTS IN IHS STANDARDS EXPERT. SEE DETAILS FOR ADDITIONAL INFORMATION. Organization: IPC
Date: 2008-06-01
Description: IPC-C-1000 is a hardcopy compilation of IPC documents that includes all of the C-10X segment collections, plus selected additional documents.
IPC - IPC-PD-335 - ELECTRONIC PACKAGING HANDBOOK Organization: IPC
Date: 1989-12-01
Description: Purpose of the IPC Electronic Packaging HandbookThe purpose of this Electronic Packaging Handbook is to provide the appropriate insight and flows into the multifaceted topic of electronic packaging.
IPC - IPC-2251 - DESIGN GUIDE FOR THE PACKAGING OF HIGH SPEED ELECTRONIC CIRCUITS Organization: IPC
Date: 2003-11-01
Description: References to manufacturers of these tools may be found on the IPC Web site (www.ipc.org).
IPC - IPC-T-50 - TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS Organization: IPC
Date: 2015-05-01
Description: Terms which have a specialized meaning or usage within a single IPC document may be defined differently within that document.
IPC - IPC-T-50 CHINESE - TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS Organization: IPC
Date: 2008-07-01
Description: Terms which have a specialized meaning or usage within a single IPC document should be defined within that document. Commonly used English language terms which do not change meaning when applied to electronics are not defined here.
IPC - IPC-TR-465-2 - EFFECT OF STEAM AGING TIME AND TEMPERATURE ON SOLDERABILITY TEST RESULTS Organization: IPC
Date: 1993-07-01
Description: Introduction At a meeting in February of 1989, the Institute for Interconnecting and Packaging Electronics Circuits (IPC) and the Electronic Industries Association (EIA) agreed to co-author a joint solderability test method.
IPC - IPC-2571 - GENERIC REQUIREMENTS FOR ELECTRONICS MANUFACTURING SUPPLY CHAIN COMMUNICATION - PRODUCT DATA EXCHANGE (PDX) Organization: IPC
Date: 2001-11-01
Description: The scheme is defined for bill of materials (BOM), approved manufacturer list (AML), changes (Engineering, Manufacturing, Product) and references to documents describing geometric and other definition characteristics. IPC 2571 is the umbrella specification for other IPC 2570-series specifications.
IPC - IPC-C-107 - PRINTED BOARD MATERIALS STANDARDS COLLECTION - TO PURCHASE HARDCOPY COMPILATION, CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE. STANDARDS FROM THIS COMPILATION ARE AVAILABLE AS INDIVIDUAL DOCUMENTS IN IHS STANDARDS EXPERT. SEE DETAILS FOR ADDITIONAL INFORMATION. Organization: IPC
Date: 2008-06-01
Description: 4101C: Specification for Base Materials for Rigid and Multilayer Printed Boards 4103A: Specification for Base Materials for High Speed/High Frequency Applications 4104: Specification for high Density interconnect (HDI) and Microvia Materials 4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boar 4121: Guidelines for Selecting Core Constructionfor Multilayer Printed Wiring Board Applications 4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat 4411A: Specificationand Charaterization Methods for Nonwoven Para-Aramid Reinforcement 4412A: Specification for Finished Fabric Woven From "E" Glass for Printed Boards 4562A: Metal Foil for Printed Board Applications 4563: Resin Coated Copper Foil for Printed Boards Guideline 4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed 4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed 9691A: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test A-142: Specification for Finished Fabric Soven from Aramid for Printed Boards CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards SG-141: Specification or Finished Fabric Woven from "S" Glass for Printed Boards T-50J: Terms and Definiations for Interconnecting and Packaging Electronic Circuits WP/TR-584A: IPC White Pater and Technical Report on the Use of Halogenated Flame Retardants in Print
IPC - IPC-2578 - SECTIONAL REQUIREMENTS FOR SUPPLY CHAIN COMMUNICATION OF BILL OF MATERIAL AND PRODUCT DESIGN CONFIGURATION DATA - PRODUCT DATA EXCHANGE (PDX) Organization: IPC
Date: 2001-11-01
Description: This standard (IPC 2578) covers the sectional requirements for the exchange of Bills of Material (BOM), Approved Manufacturer Lists (AML), Approved Supplier Lists (ASL), as well as the description of the components involved on the Bill of Material.
IPC - IPC-TR-582 - CLEANING AND CLEANLINESS TESTING PROGRAM TEST RESULTS FOR: PHASE 3 - LOW SOLIDS FLUXES AND PASTES PROCESSED IN AMBIENT AIR Organization: IPC
Date: 1994-11-01
Description: The AHSWG was comprised of: Department of Defense (DoD) representatives, military defense contractors, commercial manufacturers, material suppliers, equipment manufacturers, the Institute for Interconnecting and Packaging Electronic Circuits (IPC), and the Environmental Protection Agency (EPA).
IPC - IPC-5703 - CLEANLINESS GUIDELINES FOR PRINTED BOARD FABRICATORS Organization: IPC
Date: 2013-05-01
Description: Introduction In many IPC standards development meetings, those individuals responsible for assessing the quality of incoming unpopulated printed boards have lamented the fact that bare printed board cleanliness is often an unknown quality parameter, often with undesired results.
IPC - IPC-C-108 - CLEANING GUIDES AND HANDBOOKS COLLECTION - TO PURCHASE HARDCOPY COMPILATION, CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE. STANDARDS FROM THIS COMPILATION ARE AVAILABLE AS INDIVIDUAL DOCUMENTS IN IHS STANDARDS EXPERT. SEE DETAILS FOR ADDITIONAL INFORMATION. Organization: IPC
Date: 2008-06-01
Description:   IPC-C-108 is a hardcopy compilation of IPC documents that addresses solvent cleaning of electrical/ electronic assemblies, parts and application tools after soldering.
IPC - IPC-9641 - HIGH TEMPERATURE PRINTED BOARD FLATNESS GUIDELINE Organization: IPC
Date: 2013-06-01
Description: This guideline differs from and does not supersede IPC-TM-650, Method 2.4.22, which is used for inspection of bow and/or twist of bare printed boards at room temperature.
DS/EN 60749-20 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT Organization: DS
Date: 2009-12-16
Description: The main changes are as follows: - to reconcile certain classifications of IEC 60749-20 and those of IPC/JEDEC J-STD-020C; - reference IEC 60749-35 instead of Annex A of IEC 60749-20, Edition 1; - update for lead-free solder; - correct certain errors in the original Edition 1.
IPC - IPC-C-102 - FLEXIBLE PRINTED BOARD STANDARDS COLLECTION - TO PURCHASE HARDCOPY COMPILATION, CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE. STANDARDS FROM THIS COMPILATION ARE AVAILABLE AS INDIVIDUAL DOCUMENTS IN IHS STANDARDS EXPERT. SEE DETAILS FOR ADDITIONAL INFORMATION. Organization: IPC
Date: 2008-06-01
Description: IPC-C-102 is a hardcopy compilation of IPC documents that includes guidelines for selecting electrically conductive adhesives for use in assembly of components to printed circuit boards.
IPC - IPC-C-103 - ELECTRONICS ASSEMBLY STANDARDS COLLECTION - TO PURCHASE HARDCOPY COMPILATION, CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE. STANDARDS FROM THIS COMPILATION ARE AVAILABLE AS INDIVIDUAL DOCUMENTS IN IHS STANDARDS EXPERT. SEE DETAILS FOR ADDITIONAL INFORMATION. Organization: IPC
Date: 2008-06-01
Description: IPC C-103 is a hardcopy compilation of IPC documents of guidelines for adhesives used in assembly of printed circuit boards.
IPC - IPC-C-105 - RIGID PRINTED BOARD STANDARDS COLLECTION - TO PURCHASE HARDCOPY COMPILATION, CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE. STANDARDS FROM THIS COMPILATION ARE AVAILABLE AS INDIVIDUAL DOCUMENTS IN IHS STANDARDS EXPERT. SEE DETAILS FOR ADDITIONAL INFORMATION. Organization: IPC
Date: 2008-06-01
Description: IPC-C-105 is a hardcopy compilation of IPC documents on Rigid Board Standards. Documents were reviewed and recommended for inclusion by IPC's technical staff.
IPC - IPC-9708 - TEST METHODS FOR CHARACTERIZATION OF PRINTED BOARD ASSEMBLY PAD CRATERING Organization: IPC
Date: 2010-12-01
Description: Performance Classification This test method guideline recognizes that surface mount assemblies (SMAs) will be subject to variations in performance requirements based on end use. While performance classes are defined in IPC-6011, these performance classifications are not specific as to the required reliability.
IPC - IPC-M-109 - MOISTURE SENSITIVE COMPONENT STANDARDS AND GUIDELINES MANUAL Organization: IPC
Date: 2004-07-01
Description: SMD packages classified to a given moisture sensitivity level by using Procedures or Criteria defined within any previous version of J-STD-020, JESD22-A112 (rescinded), IPC-SM-786 (superseded) do not need to be reclassified to the current revision unless a change in classification level or a higher peak reflow temperature is desired.
IPC - IPC/JPCA-4104 - SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS Organization: IPC
Date: 1999-05-01
Description: To start the ordering process, one can use the specification sheets in this document in combination with relevant IPC documents for each material sets (i.e., IPC-CF-148, IPC-MF-150, or IPC-4101).The materials contained in this standard represent general material categories.

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