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IPC - IPC-TR-581 - IPC PHASE 3 CONTROLLED ATMOSPHERE SOLDERING STUDY Organization: IPC
Date: 1994-08-01
IPC - J-STD-001 - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES, INCLUDING SPACE APPLICATIONS ELECTRONIC HARDWARE ADDENDUM TO IPC J-STD-001F Organization: IPC
IPC - IPC-9203 - USERS GUIDE TO IPC-9202 AND THE IPC-B-52 STANDARD TEST VEHICLE Organization: IPC
Date: 2012-05-01
Description: There are a variety of test vehicles in the electronics industry that have been used to examine materials compatibility or materials interactions, such as the IPC-B-24 standard test board used to examine SIR performance of fluxes and solder pastes. All of the available test boards leave something to be desired as there is often a dramatic difference in materials between these standard test vehicles and produced assemblies.
IPC - IPC-EM-782 - DATA ANALYSIS SPREADSHEETS FOR IPC-SM-782 LAND PATTERNS - ADDENDUM DECEMBER 1995 Organization: IPC
Date: 1994-09-01
Description: "The information contained in the various files of the disk provide the appropriate size, shape, and tolerance of surface mount land patterns that insure sufficient area for the formation of appropriate solder fillets, that permit inspection and testing of those solder joints.The equations built into the spreadsheet format follow the principles delineated in IPC-SM-782.
IPC - IPC-C-1000 - IPC ESSENTIAL DOCUMENT COLLECTION FOR BOARD DESIGN, ASSEMBLY AND MANUFACTURE - TO PURCHASE HARDCOPY COMPILATION, CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE. STANDARDS FROM THIS COMPILATION ARE AVAILABLE AS INDIVIDUAL DOCUMENTS IN IHS STANDARDS EXPERT. SEE DETAILS FOR ADDITIONAL INFORMATION. Organization: IPC
Date: 2008-06-01
Description: 1071A: Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing 1601: Printed Board Handling and Storage Guidelines 2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards 2152: Standard for Determining Current Carrying Capacity in Printed Board Design 2221B: Generic Standard on Printed Board Design 2222A: Sectional Design Standard for Rigid Organic Printed Boards 2223C: Sectional Design Standard for Flexible Printed Boards 2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies 2226: Sectional Design Standard for High Density Interconnect (HDI) Boards 2251: Design Guide for the Packaging of High Speed Electronic Circuits 2252: Design Guide for RF/Microwave Circuit Boards 2316: Design Guide for Embedded Passive Device Printed Boards 2611: Generic Requirements for Electronic Product Documentation 2612: Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descript 2612-1: Sectional Requirements for Electronic Diagramming Symbol Generation Methodology 2614: Sectional Requirements for Board Fabrication Documentation 2615: Printed Board Dimensions and Tolerances 3406: Guidelines for Electrically Conductive Surface Mount Adhesives 3408: General Requirements for Anisotropically Conductive Adhesives Films 4101D: Specification for Base Materials for Rigid and Multilayer Printed Boards 4103A-WAM1: Specification for Base Materials for High Speed/High Frequency Applications 4104: Specification for High Density Interconnect (HDI) and Microvia Materials 4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boar 4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications 4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat 4202A: Flexible Base Dielectrics for Use in Flexible Printed Circuitry 4203A: Cover and Bonding Material for Flexible Printed Circuitry 4204A-WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry 4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement 4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards 4552-WAM1-2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit 4553A: Specification for Immersion Silver Plating for Printed Boards 4554: Specification for Immersion Tin Plating for Printed Circuit Boards 4556: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating fo 4562A: Metal Foil for Printed Board Applications 4563: Resin Coated Copper Foil for Printed Boards Guideline 4761: Design Guide for Protection of Printed Board Via Structures 4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend 4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed 4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printe 5701: Users Guide for Cleanliness of Unpopulated Printed Boards 5702: Guidelines for OEMs in Determining Accept Levels of Cleanliness of Unpopulated Printed Boards 5704: Cleanliness Requirements for Unpopulated Printed Boards 6011: Generic Performance Specification for Printed Boards 6012C: Qualification and Performance Specification for Rigid Printed Boards 6013C: Qualification and Performance Specification for Flexible Printed Boards 6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive De 6018B: Qualification and Performance Specification for High Frequency (Microwave) Printed Boards 7092: Design and Assembly Process Implementation for Embedded Components 7093: Design and Assembly Process Implementation for Bottom Termination Components 7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components 7095C: Design and Assembly Process Implementation for BGAs 7351B: Generic Requirements for Surface Mount Design and Land Pattern Standard 7526: Stencil and Misprinted Board Cleaning Handbook - FREE DOWNLOAD 7801: Reflow Oven Process Control Standard 9201A: Surface Insulation Resistance Handbook 9202: Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemic 9203: Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle 9252A: Requirements for Electrical Testing of Unpopulated Printed Boards 9641: High Temperature Printed Board Flatness Guideline 9691A: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Te 9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments 9702: IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects 9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability 9704A: Printed Circuit Assembly Strain Gage Test Guideline 9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder 9707: Spherical Bend Test Method for Characterization of Board Level Interconnects 9708: Test Methods for Characterization of Printed Board Assembly Pad Cratering 9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards A-600H: Acceptability of Printed Boards A-610F: Acceptability of Electronics Assembly A-620B: Requirements and Acceptance for Cable and Wire Harness Assemblies C-406: Design & Application Guidelines for Surface Mount Connectors CA-821: General Requirements for Thermally Conductive Adhesives CC-830B: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assembl CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies CM-770E: Component Mounting Guidelines for Printed Boards D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies D-325A: Documentation Requirements for Printed Boards D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Asse D-422: Design Guide for Press Fit Rigid Printed Board Back Planes DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards DR-572A: Drilling Guidelines for Printed Boards FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Pr HDBK-005: Guide to Solder Paste Assessment HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, T J-STD-003C-WAM1: Solderability Tests for Printed Boards J-STD-004B: Requirements for Soldering Fluxes J-STD-005A: Requirements for Soldering Pastes J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices J-STD-026: Semiconductor Design Standard for Flip Chip Applications J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations J-STD-028: Performance Standard for Construction of Flip Chip and Chip Scale Bumps J-STD-030A: Selection and Application of Board Level Underfill Materials J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Device J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes MC-790: Guidelines for Multichip Module Technology Utilization ML-960: Qualification and Performance Specification for Mass Lamination Panels for Multilayer print MS-810: Guidelines for High Volume Microsection QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards S-816: SMT Process Guideline & Checklist SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting SM-784: Guidelines for Chip-on-Board Technology Implementation SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments SM-817A: General Requirements for Dielectric Surface Mount Adhesives SM-840E: Qualification and Performance Specifiation of Permanent Solder Mask and Flexible Cover Mat TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology TR-486: Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress TR-579: Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs TR-583: An In-Depth Look At Ionic Cleanliness Testing WP/TR-584A: IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Prin WP-008: Setting Up Ion Chromatography Capability
IPC - IPC-WP/TR-584 - IPC WHITE PAPER AND TECHNICAL REPORT ON THE USE OF HALOGENATED FLAME RETARDANTS IN PRINTED CIRCUIT BOARDS AND ASSEMBLIES Organization: IPC
Date: 2007-08-01
Description: This document summarizes the IPC position on the subject of ‘‘halogen-free'' materials for the electronics industry.
IPC - IPC-HDBK-840 - SOLDER MASK HANDBOOK Organization: IPC
Date: 2006-08-01
Description: PurposeThe purpose of this handbook is to provide additional supporting information for IPC-SM-840 regarding solder mask types, processes, characteristics and properties in order to assist with the correct selection and use of the most appropriate material for the intended application.
IPC - IPC-HDBK-005 - GUIDE TO SOLDER PASTE ASSESSMENT Organization: IPC
Date: 2006-01-01
Description: This document also suggests some test methods that can help with designing and testing solder pastes. It is intended for use by both vendors and users of solder paste. Purpose Solder pastes are unique materials, whose performance in a surface mount process depends on a variety of variables, many of them interacting.
ASTM B32 - STANDARD SPECIFICATION FOR SOLDER METAL Organization: ASTM
Date: 2008-05-01
Description: Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not covered by this specification as they are under the auspices of IPC - Association Connecting Electronic Industries. These solders include those alloys having a liquidus temperature not exceeding 800°F (430°C).
IPC - IPC-7527 - REQUIREMENTS FOR SOLDER PASTE PRINTING Organization: IPC
Date: 2012-05-01
Description: For information on the evaluation of solder paste, see J-STD-005, Requirements for Soldering Pastes and IPC-HDBK-005. The purpose is not to define requirements to stencil design.
IPC - IPC-TR-464 - ACCELERATED AGING FOR SOLDERABILITY EVALUATIONS - INCORPORATES ADDENDUM: DECEMBER 1987 Organization: IPC
Date: 1984-04-01
Description: Without accelerated aging prior to solderability testing, i.e. as with the current common practice, little information is gained concerning the future solderability of such parts. The IPC formed a Task Group to study Accelerated Aging and recommend a method to be used for simulating long term natural storage.
IPC - J-STD-006 JAPANESE - REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS Organization: IPC
Date: 2006-01-01
Description: This standard is one of a set of three joint industry standards the prescribe the requirements and test methods for soldering materials for use in the electronics industry:IPC/EIA J-STD-004 Requirements for Soldering FluxesIPC/EIA J-STD-005 Requirements for Soldering PastesIPC J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications.
ECIA - EIA J-STD-001 - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES Organization: ECIA
Date: 2000-03-01
Description: For a more complete understanding of this document's recommendations and requirements, one may use this document in conjunction with IPC-HDBK-001 and IPC-A-610. When IPC/EIA J-STD-001 is cited or required by contract, the requirements of IPC-A-610 do not apply unless separately or specifically required.
IPC - J-STD-001 HUNGARIAN - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES - HUNGARIAN Organization: IPC
Date: 2010-04-01
Description: For a more complete understanding of this document's recommendations and requirements, one may use this document in conjunction with IPC-HDBK-001, IPC-A-610 and IPC-HDBK-610. Purpose This standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies.
IPC - J-STD-001F REDLINE - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES - REDLINE COMPARISON OF REVISION E TO F Organization: IPC
Date: 2014-07-01
Description: For a more complete understanding of this document’s recommendations and requirements, one may use this document in conjunction with IPC-HDBK-001 and IPC-A-610. Purpose This standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies.
IPC - IPC-9502 - PWB ASSEMBLY SOLDERING PROCESS GUIDELINE FOR ELECTRONIC COMPONENTS Organization: IPC
Date: 1999-04-01
Description: This document describes manufacturing solder process limits that components subjected to IPC-9501, IPC-9503, IPC-9504 and J-STD-020 would survive.
IPC - IPC-TR-460 - TROUBLE SHOOTING CHECKLIST FOR WAVE SOLDERING OF PRINTED WIRING BOARDS Organization: IPC
Date: 1984-02-01
Description: FOREWORD The material published in this document is a compilation of contributions from members of several comnittees coordinated by the Soldering Solderability Specification Task Group. The objective of this document is to provide a checklist of causes and recommended corrective actions for various process problems encountered during the wave soldering of printed wiring board assemblies.
IPC - TM-650 2.4.37.2 - EVALUATION OF HAND SOLDERING TOOLS ON HEAVY THERMAL LOADS Organization: IPC
Date: 1993-07-01
Description: This test method is to be used for the evaluation of hand soldering tools under a simulated heavy load such as that presented by PWBs with abnormally thick ground or power planes. Separate test methods (IPC-TM-650, Methods 2.4.37 and 2.4.37.1) are provided for evaluation of tools under normal operating conditions.
IPC - IPC-TR-465-2 - EFFECT OF STEAM AGING TIME AND TEMPERATURE ON SOLDERABILITY TEST RESULTS Organization: IPC
Date: 1993-07-01
Description: Introduction At a meeting in February of 1989, the Institute for Interconnecting and Packaging Electronics Circuits (IPC) and the Electronic Industries Association (EIA) agreed to co-author a joint solderability test method.
IPC - J-STD-001DS ADD - SPACE APPLICATIONS ELECTRONIC HARDWARE ADDENDUM TO J-STD-001D REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES Organization: IPC
Date: 2006-11-01
Description: This addendum provides additional requirements over those published in IPC J-STD-001D to ensure the reliability of soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space.

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