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IPC - IPC/WHMA-A-620 IMAGES DVD - IPC/WHMA-A-620B ILLUSTRATIONS - ENTIRE IMAGE SET: IMAGES AND GRAPHICS FROM IPC/WHMA-A-620B: REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES Organization: IPC
IPC - IPC/WHMA-A-620 + REDLINE - REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES THIS DOCUMENT PROVIDES A SIDE-BY-SIDE COMPARISON OF IPC/WHMA-A-620B TO IPC/WHMA-A-620C. *** ONLY AVAILABLE IN ELECTRONIC FORMAT *** Organization: IPC
IPC - IPC/WHMA-A-620-S - SPACE APPLICATIONS ELECTRONIC HARDWARE ADDENDUM TO IPC/WHMA-A-620B Organization: IPC
Date: 2013-06-01
Description: This addendum provides additional requirements over those published in IPC/WHMA-A-620B to ensure the performance of cable and wire harness assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space.
IPC - IPC-C-1000 - IPC ESSENTIAL DOCUMENT COLLECTION FOR BOARD DESIGN, ASSEMBLY AND MANUFACTURE - TO PURCHASE HARDCOPY COMPILATION, CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE. STANDARDS FROM THIS COMPILATION ARE AVAILABLE AS INDIVIDUAL DOCUMENTS IN IHS STANDARDS EXPERT. SEE DETAILS FOR ADDITIONAL INFORMATION. Organization: IPC
Date: 2008-06-01
Description: IPC-C-1000 is a hardcopy compilation of IPC documents that includes all of the C-10X segment collections, plus selected additional documents.
IPC - TM-650 2.5.17.2 - VOLUME RESISTIVITY OF CONDUCTIVE MATERIALS USED IN HIGH DENSITY INTERCONNECTION (HDI) AND MICROVIAS, TWO-WIRE METHOD Organization: IPC
Date: 1998-11-01
Description: For measuring resistivity on highly conductive materials or any material that cannot be patterned into a circuit pattern, a four-wire (Kelvin Probe) test method, such as IPC-TM-650, Method 2.5.14, is recommended. 1.1 Definition Volume resistivity is a material property that can be utilized to calculate the resistance in a circuit design.
IPC - A-610E ROMANIAN CD - ACCEPTABILITY OF ELECTRONIC ASSEMBLIES - TITLE EXTENSION: TO PURCHASE CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE Organization: IPC
Date: 2010-04-01
Description: For instance, the presence of criteria for adhesive bonding of components does not imply/authorize/require the use of adhesive bonding, and the depiction of a lead wrapped clockwise around a terminal does not imply/authorize/require that all leads/wires be wrapped in the clockwise direction. IPC-A-610 has criteria outside the scope of IPC J-STD-001 defining handling, mechanical and other workmanship requirements.
IPC - A-610E HUNGARIAN CD - ELEKTRONIKAI SZERELVÉNYEK ELFOGADHATÓSÁGA (HUNGARIAN LANGUAGE) - TO PURCHASE CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE Organization: IPC
Date: 2011-04-01
Description: For instance, the presence of criteria for adhesive bonding of components does not imply/authorize/require the use of adhesive bonding, and the depiction of a lead wrapped clockwise around a terminal does not imply/authorize/require that all leads/wires be wrapped in the clockwise direction. IPC-A-610 has criteria outside the scope of IPC J-STD-001 defining handling, mechanical and other workmanship requirements.
IPC - A-610F REDLINE - ACCEPTABILITY OF ELECTRONIC ASSEMBLIES - REDLINE COMPARISON E TO F VERSIONS Organization: IPC
Date: 2014-07-01
Description: For a more complete understanding of this document's recommendations and requirements, one may use this document in conjunction with IPC-HDBK-001, IPC-AJ-820 and IPC J-STD-001. The criteria in this standard are not intended to define processes to accomplish assembly operations nor is it intended to authorize repair/modification or change of the customer’s product.
IPC - IPC-C-103 - ELECTRONICS ASSEMBLY STANDARDS COLLECTION - TO PURCHASE HARDCOPY COMPILATION, CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE. STANDARDS FROM THIS COMPILATION ARE AVAILABLE AS INDIVIDUAL DOCUMENTS IN IHS STANDARDS EXPERT. SEE DETAILS FOR ADDITIONAL INFORMATION. Organization: IPC
Date: 2008-06-01
Description: 2611: Generic Requirements for Electronic Product Documentation 2612: Sectional Requirements for Electronic Diagramming Documentation (schematic and Logic Description) 2612-1: Sectional Requirements for Electronic diagramming Synbol Generation Methodology 3406: Guidelines for Electrically Conductive Surface Mount Adhesives 3408: General Requirements for anisotropically Conductive Adhesives Films 7095B: Design and Assembly Process Implementation for BGAs 7351B: Generic Requirements for Surface Mount Design and Land Pattern Standard 9202: Material and Process Characterization/Qualifiaation Test Protocol and Assessing Electrochemical 9203: Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle 9701A: Performance Test Methods and Qualification Requirements for Surface Mount Soulder Attachements 9702: IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects 9703: IPCJEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability 9704A: Printed Circuit Assembly Strain Gage Test Guideline 9707: Spherical Bend Test Method for Characterization of Board Level Interconnects 9708: Test Methods for Charaterization of Printed Board Assembly Pad Cratering A-610E: Acceptability of Electronic Assemblies A-620A: Requirements and Acceptance for Cable and Wire Harness Assemblies A-620AS: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A C-406: Design & Application Guidelines for Surface Mount Connectors CA-821: General Requirements for Thermally Conductive Adhesives CC-830B: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assembly CM-770E: Component Mounting Guidelines for Printed Boards D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assembly HDBK-001E: Handbook and Guide to Supplement J-STD-001 HDBK-005: Guide to Solder Paste Assessment JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies J-STD-002C: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires J-STD-003B: Solderability Tests for Printed Boards J-STD-004B: Requirements for Soldering Fluxes J-STD-005A: Requirements for Soldering Pastes J-STD-006B: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders J-STD-012: Implementation of Flip Chip & Chip Scale Technology J-STD-020D-1: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surf J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configureations J-STD-028: Performance Standard for Construction of Flip Chip and Chip Scale Bumps J-STD-030: Guideline for Selection and Application of Underfill Material for Flip Chip J-STD-033C: Handling, Packing, Shipping, and Use of Moisture/Reflow and/or Process Sensitie Components J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes MC-790: Guidelines for Multichip Module Technolgy Utilization S-816: SMT Process Guideline & Checklist SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting SM-784: Guidelines for Chip-on-Board Technoloty Implementation SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments SM-817: General Requiremnts for Dielectric Surface Mounting Adhesives T-50J: Terms and Definitions for Interconnecting and Packaging Electronic Circuits TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology
IPC - A-610F W/AMD 1 - ACCEPTABILITY OF ELECTRONIC ASSEMBLIES Organization: IPC
Date: 2016-02-01
Description: For a more complete understanding of this document’s recommendations and requirements, one may use this document in conjunction with IPCHDBK- 001, IPC-AJ-820 and IPC J-STD-001. The criteria in this standard are not intended to define processes to accomplish assembly operations nor is it intended to authorize repair/modification or change of the customer’s product.
IPC - IPC-DW-425 - DESIGN AND END PRODUCT REQUIREMENTS FOR DISCRETE WIRING BOARDS Organization: IPC
Date: 1990-05-01
Description: Designation The discrete wiring system (part number) shall be in the following form and as specified herein: IPC-DW-425/S (A1) E(2112) ------------------------------------------------------------- Where S is the Type Edge Board Specification (See 1.3.2.1) Plating Level Number Sheet (See 1.3.3 & 1.3.3.1) (See 1.3.2) H(5211) T(1111) L(4511) --------------------------------------------------------------- Hole Plating Terminal Plating Lands or Level Level Surface Plating (See 1.3.3 & 1.3.3.1) (See 1.3.3 & 1.3.3.1) (See 1.3.3 & 1.3.3.1) Specification Sheet Beginning with page 10 of this document are a series of specification sheets.
IPC - IPC-4553 - SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS Organization: IPC
Date: 2009-05-01
Description: As other finishes require specifications, they will be addressed by the IPC Plating Processes Subcommittee as part of the IPC-4550 specification family.
IPC - IPC-D-620 - DESIGN AND CRITICAL PROCESS REQUIREMENTS FOR CABLE AND WIRING HARNESSES - INCLUDES ACCESS TO ADDITIONAL CONTENT Organization: IPC
Date: 2015-12-01
Description: Purpose ‘‘Design Requirements for Cable and Wiring Harnesses’’ is the cable and wiring harness and systemslevel design requirements companion to IPC/WHMA-A-620, ‘‘Requirements and Acceptance for Cable and Wire Harness Assemblies,’’ and its associated space addendum.
ASTM B32 - STANDARD SPECIFICATION FOR SOLDER METAL Organization: ASTM
Date: 2008-05-01
Description: Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not covered by this specification as they are under the auspices of IPC - Association Connecting Electronic Industries.
IPC - IPC-7351 - GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD - INCLUDES CD-ROM; SUBSCRIPTION CUSTOMERS CAN OBTAIN ONE COMPLIMENTARY COPY FROM IHS BY CONTACTING IHS CUSTOMER CARE AT +1 800 IHS-CARE (+1 800 447-2273) OR VISIT WWW.IHS.COM/CUSTOMERCARE; INCLUDES ACCESS TO ADDITIONAL CONTENT Organization: IPC
Date: 2010-06-01
Description: Documentation HierarchyThis standard identifies the generic physical design principles involved in the creation of land patterns for surface mount components, and is supplemented by a shareware IPC-7351 Land Pattern viewer that provides, through the use of a graphical user interface, the individual component dimensions and corresponding land pattern recommendations based upon families of components. The IPC-7351 Land Pattern Viewer is provided on CD-ROM as part of the IPC-7351. Updates to land pattern dimensions, including patterns for new component families, can be found on the IPC website (www.ipc.org) under ‘‘PCB Tools and Calculators.’’
IPC - IPC-CM-770 - GUIDELINES FOR PRINTED BOARD COMPONENT MOUNTING Organization: IPC
Date: 2004-01-01
Description: Rigid Board TypesThe following rigid board types are classified in IPC-2222 and IPC-6012, Design and Qualification and Performance Specification for Rigid Printed Boards:• Type 1: Single-Sided Printed Board.

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