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IEC/PAS 62647-21 - PROCESS MANAGEMENT FOR AVIONICS – AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER – PART 21: PROGRAM MANAGEMENT – SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS - EDITION 1.0 Organization: IEC
Date: 2011-07-01
Description: Programs may inadvertently introduce Pb-free elements (including piece part finish, printed wiring board (PWB) or printed circuit board (PCB) finish, or assembly solder) if careful coordination between buyer and Supplier is not exercised.
IEC/TS 62647-21 - PROCESS MANAGEMENT FOR AVIONICS – AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER – PART 21: PROGRAM MANAGEMENT – SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS - EDITION 1.0 Organization: IEC
Date: 2013-07-01
Description: Manufacturers of Aerospace, Defence and High Performance (ADHP) electronics may inadvertently introduce Pb-free elements (including piece part finish, printed wiring board (PWB) or printed circuit board (PCB) finish, or assembly solder) if careful coordination between buyer and supplier is not exercised.
ANSI IICRC S500 - STANDARD AND REFERENCE GUIDE FOR PROFESSIONAL WATER DAMAGE RESTORATION - FOURTH EDITION Organization: ANSI
Date: 2015-01-01
Description: Such potentially hazardous, regulated materials include, but are not limited to: asbestos, lead, arsenic, mercury, polychlorinated biphenyls (PCBs), pesticides, fuels, solvents, radiological residues, and other chemical and certain biological contaminants.
IPC-7351 - GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD - INCLUDES CD-ROM; SUBSCRIPTION CUSTOMERS CAN OBTAIN ONE COMPLIMENTARY COPY FROM IHS BY CONTACTING IHS CUSTOMER CARE AT +1 800 IHS-CARE (+1 800 447-2273) OR VISIT WWW.IHS.COM/CUSTOMERCARE; INCLUDES ACCESS TO ADDITIONAL CONTENT Organization: IPC
Date: 2010-06-01
Description: Assembly, Printed Board – An assembly of several printed circuit assemblies or printed wiring assemblies, or both.

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