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JSA - JIS B 0144 - PCB (PRINTED CIRCUIT BOARD) ASSEMBLY ROBOTS - VOCABULARY Organization: JSA
Date: 2000-12-20
JSA - JIS B 8462 - PCB (PRINTED CIRCUIT BOARD) ASSEMBLY ROBOTS - SAFETY Organization: JSA
Date: 2000-12-20
JSA - JIS B 8461 - PCB (PRINTED CIRCUIT BOARD) ASSEMBLY ROBOTS - INTERFACES Organization: JSA
Date: 2002-02-20
JSA - JIS B 8460 - PCB (PRINTED CIRCUIT BOARD) ASSEMBLY ROBOTS - PRESENTATION OF CHARACTERISTICS AND FUNCTIONS Organization: JSA
Date: 2002-02-20
IPC J-STD-609 - MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES Organization: IPC
Date: 2016-10-01
Description: Purpose This standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of: (1) those assemblies that are assembled with Pb-containing or Pb-free solder; (2) components that have Pb-containing or Pb-free 2nd level interconnect terminal finishes and materials; (3) the maximum component temperature not to be exceeded during assembly or rework processing; (4) the base materials used in the PCB construction, including those PCBs that use halogen-free resin; (5) the surface finish of PCBs; and (6) the conformal coating on PCBAs.
IPC-M-103 - STANDARDS FOR SURFACE MOUNT ASSEMBLIES MANUAL Organization: IPC
Description: This document covers guidelines for selecting electrically conductive adhesives for use in assembly of components to printed circuit boards (PCB) or similar wiring interconnect systems.
JEDEC J-STD-609 - MARKING, SYMBOLS, AND LABELS OF LEADED AND LEAD-FREE TERMINAL FINISHED MATERIALS USED IN ELECTRONIC ASSEMBLY Organization: JEDEC
Date: 2016-04-01
Description: Purpose This standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of: (1) those assemblies that are assembled with Pb-containing or Pb-free solder; (2) components that have Pb-containing or Pb-free 2nd level interconnect terminal finishes and materials; (3) the maximum component temperature not to be exceeded during assembly or rework processing; (4) the base materials used in the PCB construction, including those PCBs that use halogenfree resin; (5) the surface finish of PCBs; and (6) the conformal coating on PCBAs.
IEC 61189-3-719 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES – PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) – MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING - EDITION 1.0 Organization: IEC
Date: 2016-01-01
Description: This part of IEC 61189 specifies a test method to monitor the resistance of single platedthrough holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.
CENELEC - EN 61189-3-719 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING Organization: CENELEC
Date: 2016-04-01
Description: This part of IEC 61189 specifies a test method to monitor the resistance of single platedthrough holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.
DS/EN 61189-3-719 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING Organization: DS
Date: 2016-04-15
Description: IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.
CEN - EN 16602-70-10 - SPACE PRODUCT ASSURANCE - QUALIFICATION OF PRINTED CIRCUIT BOARDS Organization: CEN
Date: 2015-01-01
Description: PCBs are used for the mounting of components in order to produce PCB assemblies performing complex electrical functions. The PCBs are subjected to thermal and mechanical shocks during their assembly such as mounting of components by soldering, rework and repair under normal terrestrial conditions, and in addition the complex PCB assembly are subjected to the environment imposed by launch and space flights.
DS/EN 16602-70-10 - SPACE PRODUCT ASSURANCE - QUALIFICATION OF PRINTED CIRCUIT BOARDS Organization: DS
Date: 2015-02-19
Description: PCBs are used for the mounting of components in order to produce PCB assemblies performing complex electrical functions. The PCBs are subjected to thermal and mechanical shocks during their assembly such as mounting of components by soldering, rework and repair under normal terrestrial conditions, and in addition the complex PCB assembly are subjected to the environment imposed by launch and space flights.
DIN EN 16602-70-10 - SPACE PRODUCT ASSURANCE - QUALIFICATION OF PRINTED CIRCUIT BOARDS; ENGLISH VERSION EN 16602-70-10:2015 Organization: DIN
Date: 2015-05-01
Description: PCBs are used for the mounting of components in order to produce PCB assemblies performing complex electrical functions. The PCBs are subjected to thermal and mechanical shocks during their assembly such as mounting of components by soldering, rework and repair under normal terrestrial conditions, and in addition the complex PCB assembly are subjected to the environment imposed by launch and space flights.
NBN - EN 16602-70-10 - SPACE PRODUCT ASSURANCE - QUALIFICATION OF PRINTED CIRCUIT BOARDS Organization: NBN
Date: 2015-02-27
Description: PCBs are used for the mounting of components in order to produce PCB assemblies performing complex electrical functions. The PCBs are subjected to thermal and mechanical shocks during their assembly such as mounting of components by soldering, rework and repair under normal terrestrial conditions, and in addition the complex PCB assembly are subjected to the environment imposed by launch and space flights.
NBN - EN 16602-70-10 - ASSURANCE PRODUIT DES PROJETS SPATIAUX - QUALIFICATION DES CIRCUITS IMPRIMÉS Organization: NBN
Date: 2015-02-27
Description: PCBs are used for the mounting of components in order to produce PCB assemblies performing complex electrical functions. The PCBs are subjected to thermal and mechanical shocks during their assembly such as mounting of components by soldering, rework and repair under normal terrestrial conditions, and in addition the complex PCB assembly are subjected to the environment imposed by launch and space flights.
CEN - EN 16602-70-11 - SPACE PRODUCT ASSURANCE - PROCUREMENT OF PRINTED CIRCUIT BOARDS Organization: CEN
Date: 2015-01-01
Description: PCBs are used for the mounting of components in order to produce PCB assemblies performing complex electrical functions. The PCBs are subjected to thermo-mechanical stresses during their assembly such as mounting of components by soldering, rework and repair under normal terrestrial conditions.
DS/EN 16602-70-11 - SPACE PRODUCT ASSURANCE - PROCUREMENT OF PRINTED CIRCUIT BOARDS Organization: DS
Description: PCBs are used for the mounting of components in order to produce PCB assemblies performing complex electrical functions. The PCBs are subjected to thermo-mechanical stresses during their assembly such as mounting of components by soldering, rework and repair under normal terrestrial conditions.
DIN EN 16602-70-11 - SPACE PRODUCT ASSURANCE - PROCUREMENT OF PRINTED CIRCUIT BOARDS; ENGLISH VERSION EN 16602-70-11:2015 Organization: DIN
Date: 2015-05-01
Description: PCBs are used for the mounting of components in order to produce PCB assemblies performing complex electrical functions. The PCBs are subjected to thermo-mechanical stresses during their assembly such as mounting of components by soldering, rework and repair under normal terrestrial conditions.
NBN - EN 16602-70-11 - SPACE PRODUCT ASSURANCE - PROCUREMENT OF PRINTED CIRCUIT BOARDS Organization: NBN
Date: 2015-02-27
Description: PCBs are used for the mounting of components in order to produce PCB assemblies performing complex electrical functions. The PCBs are subjected to thermo-mechanical stresses during their assembly such as mounting of components by soldering, rework and repair under normal terrestrial conditions.
NBN - EN 16602-70-11 - ASSURANCE PRODUIT DES PROJETS SPATIAUX - APPROVISIONNEMENT DES CIRCUITS IMPRIMÉS Organization: NBN
Date: 2015-02-27
Description: PCBs are used for the mounting of components in order to produce PCB assemblies performing complex electrical functions. The PCBs are subjected to thermo-mechanical stresses during their assembly such as mounting of components by soldering, rework and repair under normal terrestrial conditions.

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