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IPC/JEDEC-9706 - MECHANICAL SHOCK IN-SITU ELECTRICAL METROLOGY TEST GUIDELINES FOR FCBGA SMT COMPONENT SOLDER CRACK AND PAD CRATER/TRACE CRACK DETECTION Organization: IPC
Date: 2013-12-01
Description: This document establishes metrology guidelines to electrically and reliably detect solder joint opens on Flip-Chip Ball Grid Array (FCBGA) SMT board assemblies during the mechanical shock or drop event.
IPC - 7711 4.4.1 - CLEANING SMT LANDS USING BLADE TIP AND SOLDER BRAID Organization: IPC
Date: 1998-02-01
JEDEC JESD 217 - TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES - MINOR REVISION OF JESD217, SEPTEMBER 2010 Organization: JEDEC
Date: 2016-10-01
Description: Test methods can be applied to several types of ball grid array packages such as FCBGA, PBGA, CBGA, and CCGA with minimum 0.5 mm ball-to-ball pitch and constructed with leaded and lead-free solder alloys. Guidelines for pre-SMT voids may not be sufficiently robust where ball grid array packages balls are assembled onto unfilled micro-via structures on package substrate land.
NASA-STD-8739.3 W/CHG 5 W/CANC NOTICE - SOLDERED ELECTRICAL CONNECTIONS Organization: NASA
Date: 2011-09-23
Description: This publication does not define the soldering requirements for Surface Mount Technology (SMT).
NASA-STD-8739.3 - SOLDERED ELECTRICAL CONNECTIONS Organization: NASA
Date: 2011-03-29
Description: This publication does not define the soldering requirements for Surface Mount Technology (SMT).
IPC-HDBK-005 - GUIDE TO SOLDER PASTE ASSESSMENT Organization: IPC
Date: 2006-01-01
Description: This handbook is a companion to the solder paste standard J-STD-005 and should be considered to be a guide to help assess the applicability of a solder paste for its use in surface mount technology (SMT) processes. This document also suggests some test methods that can help with designing and testing solder pastes.
JEDEC JESD 22-B106 - RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES Organization: JEDEC
Date: 2016-11-01
Description: This test method shall not be used to simulate wave soldering of surface mount device packages that are glued onto the same side of the board as the solder wave and are fully submerged into the solder wave. The test method for simulating SMT devices through the wave is JESD22-A111, Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices.
ECIA - EIA/IS-47 - CONTACT TERMINATION FINISH STANDARD FOR SURFACE MOUNT DEVICES Organization: ECIA
Date: 1987-07-01
Description: Soldering of SMT components is performed, in general, at a relatively low soldering temperature (215°C).
IPC-7526 - STENCIL AND MISPRINTED BOARD CLEANING HANDBOOK Organization: IPC
Date: 2007-02-01
Description: This Handbook addresses the removal of solder paste and uncured/unreacted SMT adhesives from stencils, misprinted printed circuit boards (PCBs) and application tools connected to the soldering paste application processes.
NASA-STD-8739.2 W/CHG 2 W/CANC NOTICE - WORKMANSHIP STANDARD FOR SURFACE MOUNT TECHNOLOGY Organization: NASA
Date: 2011-03-29
Description: Purpose This publication sets forth soldering requirements for reliable Surface Mount Technology (SMT). Applicability This publication is applicable to NASA Centers and programs utilizing SMT for flight hardware, mission critical ground support equipment, and elements thereof, and where invoked contractually.
NASA-STD-8739.2 - WORKMANSHIP STANDARD FOR SURFACE MOUNT TECHNOLOGY Organization: NASA
Date: 1999-08-31
Description: Purpose This publication sets forth soldering requirements for reliable Surface Mount Technology (SMT). Applicability This publication is applicable to NASA Centers and programs utilizing SMT for flight hardware, mission critical ground support equipment, and elements thereof, and where invoked contractually.
IPC-SMC-WP-005 - PWB SURFACE FINISHES Organization: IPC
Date: 1997-04-01
Description: INTRODUCTION The acceptance and use of Organic Solderability Preservatives (aSPs) as replacements for Hot Air Solder Leveling (HASL) continues to grow. aSPs selectively protect and maintain the solderability of a PCB's copper features (i.e. SMT pads, through-holes) by providing thermal protection against degradation during assembly.
IPC-D-279 - DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES Organization: IPC
Date: 1996-07-01
Description: The effort of this document is directed at SMT; the interconnect structure and the solder joint will receive most of our attention.
IPC/JEDEC-9704 - PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE Organization: IPC
Date: 2012-02-01
Description: • The topics covered include: • Test setup and equipment requirements • Strain measurement • Report format This document assumes the methodology is being used to test a surface mount device such as Ball Grid Array (BGA), Small Outline Package (SOP), Chip Scale (Size) Package (CSP), and area-array surface mount (SMT) connectors/sockets. In certain cases, the described test approach may be used for non-area-array discrete SMT devices such as capacitors or resistors.
ECIA - EIA CB 11 - SURFACE MOUNTING OF MULTILAYER CERAMIC CHIP CAPACITORS, GUIDELINES FOR Organization: ECIA
Date: 1986-01-01
Description: The use of capacitor chips on printed wiring or printed circuit boards as well as other larger area substrates such as ceramic or porcelainized-steel, is a comparatively new technology generally referred to as SMT, surface mount technology. The physical and mechanical aspects of -the chip and its use are the primary subjects of this document.
IPC-C-1000 - IPC ESSENTIAL DOCUMENT COLLECTION FOR BOARD DESIGN, ASSEMBLY AND MANUFACTURE - TO PURCHASE HARDCOPY COMPILATION, CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE. STANDARDS FROM THIS COMPILATION ARE AVAILABLE AS INDIVIDUAL DOCUMENTS IN IHS STANDARDS EXPERT. SEE DETAILS FOR ADDITIONAL INFORMATION. Organization: IPC
Date: 2008-06-01
Description: 1071A: Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing 1601: Printed Board Handling and Storage Guidelines 2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards 2152: Standard for Determining Current Carrying Capacity in Printed Board Design 2221B: Generic Standard on Printed Board Design 2222A: Sectional Design Standard for Rigid Organic Printed Boards 2223C: Sectional Design Standard for Flexible Printed Boards 2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies 2226: Sectional Design Standard for High Density Interconnect (HDI) Boards 2251: Design Guide for the Packaging of High Speed Electronic Circuits 2252: Design Guide for RF/Microwave Circuit Boards 2316: Design Guide for Embedded Passive Device Printed Boards 2611: Generic Requirements for Electronic Product Documentation 2612: Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descript 2612-1: Sectional Requirements for Electronic Diagramming Symbol Generation Methodology 2614: Sectional Requirements for Board Fabrication Documentation 2615: Printed Board Dimensions and Tolerances 3406: Guidelines for Electrically Conductive Surface Mount Adhesives 3408: General Requirements for Anisotropically Conductive Adhesives Films 4101D: Specification for Base Materials for Rigid and Multilayer Printed Boards 4103A-WAM1: Specification for Base Materials for High Speed/High Frequency Applications 4104: Specification for High Density Interconnect (HDI) and Microvia Materials 4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boar 4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications 4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat 4202A: Flexible Base Dielectrics for Use in Flexible Printed Circuitry 4203A: Cover and Bonding Material for Flexible Printed Circuitry 4204A-WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry 4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement 4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards 4552-WAM1-2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit 4553A: Specification for Immersion Silver Plating for Printed Boards 4554: Specification for Immersion Tin Plating for Printed Circuit Boards 4556: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating fo 4562A: Metal Foil for Printed Board Applications 4563: Resin Coated Copper Foil for Printed Boards Guideline 4761: Design Guide for Protection of Printed Board Via Structures 4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend 4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed 4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printe 5701: Users Guide for Cleanliness of Unpopulated Printed Boards 5702: Guidelines for OEMs in Determining Accept Levels of Cleanliness of Unpopulated Printed Boards 5704: Cleanliness Requirements for Unpopulated Printed Boards 6011: Generic Performance Specification for Printed Boards 6012C: Qualification and Performance Specification for Rigid Printed Boards 6013C: Qualification and Performance Specification for Flexible Printed Boards 6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive De 6018B: Qualification and Performance Specification for High Frequency (Microwave) Printed Boards 7092: Design and Assembly Process Implementation for Embedded Components 7093: Design and Assembly Process Implementation for Bottom Termination Components 7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components 7095C: Design and Assembly Process Implementation for BGAs 7351B: Generic Requirements for Surface Mount Design and Land Pattern Standard 7526: Stencil and Misprinted Board Cleaning Handbook - FREE DOWNLOAD 7801: Reflow Oven Process Control Standard 9201A: Surface Insulation Resistance Handbook 9202: Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemic 9203: Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle 9252A: Requirements for Electrical Testing of Unpopulated Printed Boards 9641: High Temperature Printed Board Flatness Guideline 9691A: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Te 9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments 9702: IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects 9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability 9704A: Printed Circuit Assembly Strain Gage Test Guideline 9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder 9707: Spherical Bend Test Method for Characterization of Board Level Interconnects 9708: Test Methods for Characterization of Printed Board Assembly Pad Cratering 9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards A-600H: Acceptability of Printed Boards A-610F: Acceptability of Electronics Assembly A-620B: Requirements and Acceptance for Cable and Wire Harness Assemblies C-406: Design & Application Guidelines for Surface Mount Connectors CA-821: General Requirements for Thermally Conductive Adhesives CC-830B: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assembl CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies CM-770E: Component Mounting Guidelines for Printed Boards D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies D-325A: Documentation Requirements for Printed Boards D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Asse D-422: Design Guide for Press Fit Rigid Printed Board Back Planes DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards DR-572A: Drilling Guidelines for Printed Boards FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Pr HDBK-005: Guide to Solder Paste Assessment HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, T J-STD-003C-WAM1: Solderability Tests for Printed Boards J-STD-004B: Requirements for Soldering Fluxes J-STD-005A: Requirements for Soldering Pastes J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices J-STD-026: Semiconductor Design Standard for Flip Chip Applications J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations J-STD-028: Performance Standard for Construction of Flip Chip and Chip Scale Bumps J-STD-030A: Selection and Application of Board Level Underfill Materials J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Device J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes MC-790: Guidelines for Multichip Module Technology Utilization ML-960: Qualification and Performance Specification for Mass Lamination Panels for Multilayer print MS-810: Guidelines for High Volume Microsection QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards S-816: SMT Process Guideline & Checklist SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting SM-784: Guidelines for Chip-on-Board Technology Implementation SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments SM-817A: General Requirements for Dielectric Surface Mount Adhesives SM-840E: Qualification and Performance Specifiation of Permanent Solder Mask and Flexible Cover Mat TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology TR-486: Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress TR-579: Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs TR-583: An In-Depth Look At Ionic Cleanliness Testing WP/TR-584A: IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Prin WP-008: Setting Up Ion Chromatography Capability
IPC-9708 - TEST METHODS FOR CHARACTERIZATION OF PRINTED BOARD ASSEMBLY PAD CRATERING Organization: IPC
Date: 2010-12-01
Description: This document provides test methods to evaluate the susceptibility of printed board assembly (PBA) materials and designs to cohesive dielectric failure underneath surface mount technology (SMT) attach pads. The test methods can be used to rank order and compare different printed board materials and design parameters, but do not define acceptance criteria.
IPC-C-103 - ELECTRONICS ASSEMBLY STANDARDS COLLECTION - TO PURCHASE HARDCOPY COMPILATION, CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE. STANDARDS FROM THIS COMPILATION ARE AVAILABLE AS INDIVIDUAL DOCUMENTS IN IHS STANDARDS EXPERT. SEE DETAILS FOR ADDITIONAL INFORMATION. Organization: IPC
Date: 2008-06-01
Description: 2611: Generic Requirements for Electronic Product Documentation 2612: Sectional Requirements for Electronic Diagramming Documentation (schematic and Logic Description) 2612-1: Sectional Requirements for Electronic diagramming Synbol Generation Methodology 3406: Guidelines for Electrically Conductive Surface Mount Adhesives 3408: General Requirements for anisotropically Conductive Adhesives Films 7095B: Design and Assembly Process Implementation for BGAs 7351B: Generic Requirements for Surface Mount Design and Land Pattern Standard 9202: Material and Process Characterization/Qualifiaation Test Protocol and Assessing Electrochemical 9203: Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle 9701A: Performance Test Methods and Qualification Requirements for Surface Mount Soulder Attachements 9702: IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects 9703: IPCJEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability 9704A: Printed Circuit Assembly Strain Gage Test Guideline 9707: Spherical Bend Test Method for Characterization of Board Level Interconnects 9708: Test Methods for Charaterization of Printed Board Assembly Pad Cratering A-610E: Acceptability of Electronic Assemblies A-620A: Requirements and Acceptance for Cable and Wire Harness Assemblies A-620AS: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A C-406: Design & Application Guidelines for Surface Mount Connectors CA-821: General Requirements for Thermally Conductive Adhesives CC-830B: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assembly CM-770E: Component Mounting Guidelines for Printed Boards D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assembly HDBK-001E: Handbook and Guide to Supplement J-STD-001 HDBK-005: Guide to Solder Paste Assessment JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies J-STD-002C: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires J-STD-003B: Solderability Tests for Printed Boards J-STD-004B: Requirements for Soldering Fluxes J-STD-005A: Requirements for Soldering Pastes J-STD-006B: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders J-STD-012: Implementation of Flip Chip & Chip Scale Technology J-STD-020D-1: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surf J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configureations J-STD-028: Performance Standard for Construction of Flip Chip and Chip Scale Bumps J-STD-030: Guideline for Selection and Application of Underfill Material for Flip Chip J-STD-033C: Handling, Packing, Shipping, and Use of Moisture/Reflow and/or Process Sensitie Components J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes MC-790: Guidelines for Multichip Module Technolgy Utilization S-816: SMT Process Guideline & Checklist SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting SM-784: Guidelines for Chip-on-Board Technoloty Implementation SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments SM-817: General Requiremnts for Dielectric Surface Mounting Adhesives T-50J: Terms and Definitions for Interconnecting and Packaging Electronic Circuits TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology
IPC-7351 - GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD - INCLUDES CD-ROM; SUBSCRIPTION CUSTOMERS CAN OBTAIN ONE COMPLIMENTARY COPY FROM IHS BY CONTACTING IHS CUSTOMER CARE AT +1 800 IHS-CARE (+1 800 447-2273) OR VISIT WWW.IHS.COM/CUSTOMERCARE; INCLUDES ACCESS TO ADDITIONAL CONTENT Organization: IPC
Date: 2010-06-01
Description: Note: It is the responsibility of the user to verify the SMT land patterns used for achieving an undisturbed mounting process, including testing and an ensured reliability for the product stress conditions in use.
IPC-CM-770 - GUIDELINES FOR PRINTED BOARD COMPONENT MOUNTING Organization: IPC
Date: 2004-01-01
Description: Gull Wing Leads – An SMT lead form. Leads extending horizontally from the component body centerline, bent downward immediately past the body and then bent outward just below the bottom of the body, thus forming the shape of a gull’s wing.

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