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DIN - DVS 3310 - QUALITY REQUIREMENTS IN ADHESIVE BONDING TECHNOLOGY Organization: DIN
Date: 2012-02-01
Description: Introduction This technical code describes the requirements on users who are either planning to use adhesive bonding technology or who are already using adhesive bonding technology. This technical code is not specific to a particular bonding task and can therefore be utilised for all adhesive bonding work.
DIN - DVS 1904-2 - ADHESIVE BONDING OF PLASTICS IN DOMESTIC INSTALLATION - PIPES AND FITTINGS - ADHESIVE BONDING OPERATION - FINDINGS ON ADHESIVE-BONDED JOINTS Organization: DIN
Date: 2010-02-01
Description: This technical code does not affect any requirements in relevant legal regulations, e.g. according to the rules of the Pressure Device Directive (PDD). The adhesive bonding work on domestic technology installations which is carried out according to this technical code complies with the recognised rules of technology.
CPC - A FORMULARY OF ADHESIVES - A FORMULARY OF ADHESIVES AND SEALANTS Organization: CPC
Date: 1987-05-05
Description: This collection of formulas covers a wide range of applications in adhesive technology. The major industries involved in the manufacture of adhesive ingredients have contributed experimental and starting-point formulations to this work.
WILEY - ADVANCES IN MODELING AND - ADVANCES IN MODELING AND DESIGN OF ADHESIVELY BONDED SYSTEMS Organization: WILEY
Date: 2013-01-01
Description: Due to advances in adhesive materials and the many potential merits that adhesive bonding offers, adhesive bonding has replaced other joining methods in many applications.
WILEY - HANDBOOK OF PAPER AND PAP - HANDBOOK OF PAPER AND PAPERBOARD PACKAGING TECHNOLOGY - 2ND EDITION Organization: WILEY
Date: 2013-02-01
Description: The book is directed at readers based in companies which manufacture packaging grades of paper and paperboard, companies involved in the design, printing and production of packaging, and companies which manufacture inks, coatings, adhesives and packaging machinery. It will be essential reading for students of packaging technology and technologists working in food manufacturing who are users of paper and paperboard packaging products.
GMW16251 - STRUCTURAL ADHESIVE PERFORMANCE GUIDELINE FOR THE BONDING OF COMPOSITE SUBSTRATE FOR AFTER MARKET USE - ISSUE 2; ENGLISH Organization: GMW
Date: 2015-08-01
Description: The acceptability of performance of any adhesive system, evaluated by means of this standard, shall be the responsibility of the Service Technology Engineer, in conjunction with the Design Release Engineer, for the application intended.
MCGRAW - ELECTRONICS MANUFACTURING - ELECTRONICS MANUFACTURING: WITH LEAD-FREE, HALOGEN-FREE, AND CONDUCTIVE-ADHESIVE MATERIALS Organization: MCGRAW
Date: 2003-01-01
Description: This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products.
GMW16252 - STRUCTURAL ADHESIVE PERFORMANCE GUIDELINE FOR THE BONDING OF METALLIC SUBSTRATE FOR AFTER MARKET USE - ISSUE 2; ENGLISH Organization: GMW
Date: 2015-04-01
Description: This guideline covers the performance requirements for an adhesive or adhesive system suitable for the structural bonding of metallic substrates for aftermarket service applications. These adhesives may be used in service to bond replacement body panels (door, deck lid, hood, or roof skins) as an option to, or in conjunction with, welding, rivets, or other mechanical attachment means.
DIN - DVS 1904-1 - ADHESIVE BONDING OF PLASTICS IN DOMESTIC INSTALLATION - REQUIREMENTS ON PLANTS AND PERSONNEL Organization: DIN
Date: 2010-02-01
Description: This technical code does not affect any requirements in relevant legal regulations, e.g. according to the rules of the Pressure Device Directive (PDD). The adhesive bonding work on domestic technology installations which is carried out according to this technical code complies with the recognised rules of technology.
AWS WHB-5.9 - WELDING HANDBOOK VOLUME 5 - MATERIALS AND APPLICATIONS, PART 2 Organization: AWS
Date: 2015-01-01
Description: Aluminum usage in the world has grown exponentially since then, driven by the development of new joining technology and new applications. Aluminum is highly ranked among the most useful metals known to manufacturers and fabricators.
MCGRAW - POLYMER SCIENCE AND TECHN - POLYMER SCIENCE AND TECHNOLOGY: PLASTICS, RUBBERS, BLENDS AND COMPOSITES, THIRD EDITION Organization: MCGRAW
Date: 2011-01-01
Description: The fundamentals of polymerization, polymer characteristics, rheology and morphology, as well as the composition, technology, testing and evaluation of various plastics, rubbers, fibres, adhesives, coatings and composites are comprehensively presented.
ASTM D6105 - STANDARD PRACTICE FOR APPLICATION OF ELECTRICAL DISCHARGE SURFACE TREATMENT (ACTIVATION) OF PLASTICS FOR ADHESIVE BONDING Organization: ASTM
Date: 2004-04-01
Description: This practice covers various electrical discharge treatments to be used to enhance the ability of polymeric substrates to be adhesively bonded. This practice does not include additional information on the preparation of test specimens or testing conditions as they are covered in the various ASTM test methods or specifications for specific materials.
IEEE 1142 - GUIDE FOR THE SELECTION, TESTING, APPLICATION, AND INSTALLATION OF CABLES HAVING RADIAL-MOISTURE BARRIERS AND/OR LONGITUDIANAL WATER BLOCKING Organization: IEEE
Date: 2009-12-09
Description: Aluminum, copper, or lead substrates are coated with polymeric coatings on one or both sides and adhesively bonded to the cable jacket or over sheath. The tapes are usually applied longitudinally, with an overlap, or seam, that is adhesively sealed over the core of the cable and under the jacket.
IPC-FC-234 - PRESSURE SENSITIVE ADHESIVE (PSA) ASSEMBLY GUIDELINES FOR FLEXIBLE, RIGID OR RIGID-FLEX PRINTED BOARDS Organization: IPC
Date: 2014-11-01
Description: The methods described herein are not specifications. PSA technology is continuously evolving such that applications and requirements may vary beyond the scope of this publication.
ASTM D7438 - STANDARD PRACTICE FOR FIELD CALIBRATION AND APPLICATION OF HAND-HELD MOISTURE METERS Organization: ASTM
Date: 2013-04-01
Description: This practice applies to the measurement of moisture content of solid wood, including solid wood products containing additives, that is, chemicals or adhesives, by hand-held moisture meters under conditions of end-use.
DELPHI-I - DELPHI DX650018 - ADHESION REQUIREMENTS FOR BONDING EXTERIOR BONDING MOLDING COMPOUNDS (SMC) Organization: DELPHI-I
Date: 1999-06-01
Description: SCOPE This specification covers the performance requirements for an adhesive or adhesive system suitable for bonding sheet molding compounds in exterior applications. Due to the continuing evolution of SMC/adhesive technology this specification must be reviewed every two years.
WILEY - ADHESION: CURRENT RESEARC - ADHESION Organization: WILEY
Date: 2005-01-01
Description: From the contents: Fundamentals of adhesion and interphases Modeling and simulation of interfaces and interphases New chemistry for adhesives Bio-adhesion Surface treatment and chemistry of surfaces Surface energetics Ageing mechanisms and durability Advanced adhesive technologies and applications Non-destructive evaluation of adhesive joints Recycling and ecology
SAE/TP - 2008-01-2236 - HIGH PERFORMANCE ROBOTICS FOR AEROSPACE PAINT FINISHING OPERATIONS Organization: SAE/TP
Date: 2008-08-19
Description: These developments include: new IRB5500 robots with increased work envelope and acceleration capability; highly efficient RB1000 paint atomizer family; CBS advanced paint saving cartridge technology; new robotic powder paint application (IC-3) and color change (PCC) equipment; DispensePac sealant and adhesive robotic dispensing systems including newest applications of sprayable masking materials; TrueView vision and force control systems supporting applications in work object location, robot guidance, part cleaning, sanding, polishing and masking.
IPC-7526 - STENCIL AND MISPRINTED BOARD CLEANING HANDBOOK Organization: IPC
Date: 2007-02-01
Description: This Handbook addresses the removal of solder paste and uncured/unreacted SMT adhesives from stencils, misprinted printed circuit boards (PCBs) and application tools connected to the soldering paste application processes.
ASTM D4393 - STANDARD TEST METHOD FOR STRAP PEEL ADHESION OF REINFORCING CORDS OR FABRICS TO RUBBER COMPOUNDS Organization: ASTM
Date: 2004-10-01
Description: Variables that may contribute to differences in results of this test method include adhesive type, adhesive application procedure, adhesive cure, fiber type, construction of cords or reinforcing fabrics, rubber type, rubber cure, rubber thickness, and cord spacing.

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