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IPC - IPC-C-1000 - IPC ESSENTIAL DOCUMENT COLLECTION FOR BOARD DESIGN, ASSEMBLY AND MANUFACTURE - TO PURCHASE HARDCOPY COMPILATION, CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE. STANDARDS FROM THIS COMPILATION ARE AVAILABLE AS INDIVIDUAL DOCUMENTS IN IHS STANDARDS EXPERT. SEE DETAILS FOR ADDITIONAL INFORMATION. Organization: IPC
Date: 2008-06-01
Description: IPC-C-1000 is a hardcopy compilation of IPC documents that includes all of the C-10X segment collections, plus selected additional documents.
IPC - IPC-C-103 - ELECTRONICS ASSEMBLY STANDARDS COLLECTION - TO PURCHASE HARDCOPY COMPILATION, CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE. STANDARDS FROM THIS COMPILATION ARE AVAILABLE AS INDIVIDUAL DOCUMENTS IN IHS STANDARDS EXPERT. SEE DETAILS FOR ADDITIONAL INFORMATION. Organization: IPC
Date: 2008-06-01
Description: 2611: Generic Requirements for Electronic Product Documentation 2612: Sectional Requirements for Electronic Diagramming Documentation (schematic and Logic Description) 2612-1: Sectional Requirements for Electronic diagramming Synbol Generation Methodology 3406: Guidelines for Electrically Conductive Surface Mount Adhesives 3408: General Requirements for anisotropically Conductive Adhesives Films 7095B: Design and Assembly Process Implementation for BGAs 7351B: Generic Requirements for Surface Mount Design and Land Pattern Standard 9202: Material and Process Characterization/Qualifiaation Test Protocol and Assessing Electrochemical 9203: Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle 9701A: Performance Test Methods and Qualification Requirements for Surface Mount Soulder Attachements 9702: IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects 9703: IPCJEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability 9704A: Printed Circuit Assembly Strain Gage Test Guideline 9707: Spherical Bend Test Method for Characterization of Board Level Interconnects 9708: Test Methods for Charaterization of Printed Board Assembly Pad Cratering A-610E: Acceptability of Electronic Assemblies A-620A: Requirements and Acceptance for Cable and Wire Harness Assemblies A-620AS: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A C-406: Design & Application Guidelines for Surface Mount Connectors CA-821: General Requirements for Thermally Conductive Adhesives CC-830B: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assembly CM-770E: Component Mounting Guidelines for Printed Boards D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assembly HDBK-001E: Handbook and Guide to Supplement J-STD-001 HDBK-005: Guide to Solder Paste Assessment JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies J-STD-002C: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires J-STD-003B: Solderability Tests for Printed Boards J-STD-004B: Requirements for Soldering Fluxes J-STD-005A: Requirements for Soldering Pastes J-STD-006B: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders J-STD-012: Implementation of Flip Chip & Chip Scale Technology J-STD-020D-1: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surf J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configureations J-STD-028: Performance Standard for Construction of Flip Chip and Chip Scale Bumps J-STD-030: Guideline for Selection and Application of Underfill Material for Flip Chip J-STD-033C: Handling, Packing, Shipping, and Use of Moisture/Reflow and/or Process Sensitie Components J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes MC-790: Guidelines for Multichip Module Technolgy Utilization S-816: SMT Process Guideline & Checklist SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting SM-784: Guidelines for Chip-on-Board Technoloty Implementation SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments SM-817: General Requiremnts for Dielectric Surface Mounting Adhesives T-50J: Terms and Definitions for Interconnecting and Packaging Electronic Circuits TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology
ASTM B32 - STANDARD SPECIFICATION FOR SOLDER METAL Organization: ASTM
Date: 2008-05-01
Description: Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not covered by this specification as they are under the auspices of IPC - Association Connecting Electronic Industries.
IPC - IPC-4553 - SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS Organization: IPC
Date: 2009-05-01
Description: As other finishes require specifications, they will be addressed by the IPC Plating Processes Subcommittee as part of the IPC-4550 specification family.
IPC - IPC-7351 - GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD - INCLUDES CD-ROM; SUBSCRIPTION CUSTOMERS CAN OBTAIN ONE COMPLIMENTARY COPY FROM IHS BY CONTACTING IHS CUSTOMER CARE AT +1 800 IHS-CARE (+1 800 447-2273) OR VISIT WWW.IHS.COM/CUSTOMERCARE; INCLUDES ACCESS TO ADDITIONAL CONTENT Organization: IPC
Date: 2010-06-01
Description: Documentation HierarchyThis standard identifies the generic physical design principles involved in the creation of land patterns for surface mount components, and is supplemented by a shareware IPC-7351 Land Pattern viewer that provides, through the use of a graphical user interface, the individual component dimensions and corresponding land pattern recommendations based upon families of components. The IPC-7351 Land Pattern Viewer is provided on CD-ROM as part of the IPC-7351. Updates to land pattern dimensions, including patterns for new component families, can be found on the IPC website (www.ipc.org) under ‘‘PCB Tools and Calculators.’’

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