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ASTM D2925 - STANDARD TEST METHOD FOR BEAM DEFLECTION OF “FIBERGLASS” (GLASS-FIBER-REINFORCED THERMOSETTING RESIN) PIPE UNDER FULL BORE FLOW Organization: ASTM
Date: 2014-08-01
Description: This test method can be used to determine deflection at varying conditions by substituting other test media. Deflections observed using this test method are representative only of piping supported as a simple beam under full bore flow which has one diameter of pipe overhanging at each support.
DS/EN 62047-16 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 16: TEST METHODS FOR DETERMINING RESIDUAL STRESSES OF MEMS FILMS - WAFER CURVATURE AND CANTILEVER BEAM DEFLECTION METHODS Organization: DS
Date: 2015-07-14
Description: IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μ to 10 μ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.
CEI - EN 62047-16 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES PART 16: TEST METHODS FOR DETERMINING RESIDUAL STRESSES OF MEMS FILMS - WAFER CURVATURE AND CANTILEVER BEAM DEFLECTION METHODS Organization: CEI
Date: 2016-01-01
Description: This part of IEC 62047 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μm to 10 μm in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods. The films should be deposited onto a substrate of known mechanical properties of Young’s modulus and Poisson’s ratio.
IEC 62047-16 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 16: TEST METHODS FOR DETERMINING RESIDUAL STRESSES OF MEMS FILMS - WAFER CURVATURE AND CANTILEVER BEAM DEFLECTION METHODS - EDITION 1.0 Organization: IEC
Date: 2015-03-01
Description: This part of IEC 62047 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μm to 10 μm in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods. The films should be deposited onto a substrate of known mechanical properties of Young's modulus and Poisson's ratio.
CENELEC - EN 62047-16 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 16: TEST METHODS FOR DETERMINING RESIDUAL STRESSES OF MEMS FILMS - WAFER CURVATURE AND CANTILEVER BEAM DEFLECTION METHODS Organization: CENELEC
Date: 2015-07-01
Description: This part of IEC 62047 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μm to 10 μm in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods. The films should be deposited onto a substrate of known mechanical properties of Young's modulus and Poisson's ratio.
CCTI - T-113 - END-SUPPORTED BEAM DEFLECTION COMPOSITE TUBES AND CORES - TO PURCHASE PLEASE CONTACT IHS CUSTOMER CARE AT +1 800 IHS-CARE (+1 800 447-2273) OR VISIT WWW.IHS.COM/CUSTOMERCARE Organization: CCTI
Date: 2004-03-01
NPFC - MIL-E-1/53 - ELECTRON TUBE,DEFLECTION BEAM Organization: NPFC
ESDU 69017 - THE DEFLECTIONS AND SLOPES OF SHAFTS OR BEAMS OF CONSTANT OR STEPPED SECTION. Organization: ESDU
Date: 1969-06-01
Description: ESDU 69017 gives a method of calculating the slope and deflection at any point along the length of a shaft or beam of constant or stepped cross section under any number of point loads, distributed loads and applied moments.
ACI - 435.5R - DEFLECTIONS OF CONTINUOUS CONCRETE BEAMS Organization: ACI
Date: 1973-01-01
DIN EN 62047-16 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 16: TEST METHODS FOR DETERMINING RESIDUAL STRESSES OF MEMS FILMS - WAFER CURVATURE AND CANTILEVER BEAM DEFLECTION METHODS (IEC 47F/125/CD:2012) Organization: DIN
Date: 2012-11-01
ASTM D2925 + REDLINE - STANDARD TEST METHOD FOR BEAM DEFLECTION OF "FIBERGLASS" (GLASS- FIBER-REINFORCED THERMOSETTING RESIN) PIPE UNDER FULL BORE FLOW - INCLUDES STANDARD + REDLINE (PDF) Organization: ASTM
BSI - BS EN 62047-16 - SEMICONDUCTOR DEVICES — MICRO-ELECTROMECHANICAL DEVICES PART 16: TEST METHODS FOR DETERMINING RESIDUAL STRESSES OF MEMS FILMS — WAFER CURVATURE AND CANTILEVER BEAM DEFLECTION METHODS Organization: BSI
Date: 2015-07-31
AFNOR - NF EN 62047-16 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 16 : TEST METHODS FOR DETERMINING RESIDUAL STRESSES OF MEMS FILMS - WAFER CURVATURE AND CANTILEVER BEAM DEFLECTION METHODS Organization: AFNOR
Date: 2015-11-14
NAVY - MIL-E-1/53B - ELECTRON TUBE, RECEIVING, DEFLECTION BEAM, POWER AMPLIFIER JAN-6BG6G Organization: NAVY
Date: 1959-01-21
DIN EN 62047-16 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 16: TEST METHODS FOR DETERMINING RESIDUAL STRESSES OF MEMS FILMS - WAFER CURVATURE AND CANTILEVER BEAM DEFLECTION METHODS (IEC 62047-16:2015); GERMAN VERSION EN 62047-16:2015 Organization: DIN
Date: 2015-12-01
Description: In diesem Teil der IEC 62047 sind die Prüfverfahren zum Messen der Eigenspann...
CS UK - CS TR58 - TR58 DEFLECTIONS IN CONCRETE SLABS AND BEAMS Organization: CS UK
BIS - IS 7416: PART 6 - DIMENSIONS FOR TV FERRITE COMPONENTS: PART 6 BEAM CENTRING MAGNET FOR DEFLECTION COIL Organization: BIS
Date: 1987-01-01
ACI - 435.4R - VARIABILITY OF DEFLECTIONS OF SIMPLY SUPPORTED REINFORCED CONCRETE BEAMS Organization: ACI
Date: 1972-01-01
AENOR - UNE 41250-1 - TEST METHODS FOR MEASUREMENT OF PAVEMENT DEFLECTION. PART 1: BENKELMAN BEAM Organization: AENOR
Date: 2016-01-20
DLA - MIL-E-1/315 CANC NOTICE 1 - ELECTRON TUBE, 7-INCH DIAMETER, SINGLE BEAM, POST-ACCELERATOR, ELECTROSTATIC FOCUS AND DEFLECTION CATHODE-RAY TUBE, TYPE K1095P7 Organization: DLA
Date: 1960-01-20

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