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DLA - SMD-5962-87603 REV B - MICROCIRCUIT, HIGH PERFORMANCE CMOS 9-WIDE AND 10-WIDE BUS INTERFACE LATCHES, MONOLITHIC SILICON Organization: DLA
Date: 1992-11-02
Description: The complete PIN shall be as shown in the following example: The device type(s) shall identify the circuit function as follows: Device type Generic number Circuit function 01 29C841 High performance CM0S 10-wide bus interface latch 02 29C843 High performance CMOS 9-wide bus interface latch 03 29C941 High performance CMOS 10-wide bus interface latch 1/ 04 29C943 High performance CM0S 9-wide bus interface latch 1/ 05 29C841A High performance CMOS 10-wide bus interface latch 06 29C843A High performance CMOS 9-wide bus interface latch The case outline(s) shall be as designated in MIL-STD-1835 and as follows: Outline Letter Descriptive designator Terminals Package style K GDFP2-F24 or 24 Flat package CDFP3-F24 L GDIP3-T24 or 24 Dual-in-line package CDIP4-F24 3 CQCC1-N28 28 Square chip carrier Supply voltage range
DLA - SMD-5962-88674 - MICROCIRCUITS, DIGITAL, FAST CMOS, 8-BIT, NONINVERTING , BUS INTERFACE REGISTERS, TTL COMPATIBLE, MONOLITHIC SILICON Organization: DLA
Date: 1988-09-15
Description: The complete part number shall be as shown in the following example: The device types shall identify the circuit function as follows: Device type Generic number Circuit function 01 54FCT825A 8-bit, non-inverting, bus interface registers, TTL compatible 02 54FCT825B 8-bit, non-inverting, bus interface registers, TTL compatible The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows: Outline letter Case outline K F-6 (24-lead, .640" × .420" × .090) flat package L D-9 (24-lead, 1.280" × .310" × .200") dual-in-line package 3 C-4 (28-terminal, .460" × .460" × .100") square chip carrier package Supply voltage (VCC) - - - - - - - - - - - - - - - - −0.5 V dc to +6.0 V dc Input voltage range - - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc Output voltage range - - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc DC input diode current (IIK) - - - - - - - - - - - - ±20 mA DC output diode current (IOK) - - - - - - - - - - - ±50 mA DC output current - - - - - - - - - - - - - - - - - ±100 mA Maximum power dissipation (PD) 2/ - - - - - - - - - 500 mW Thermal resistance. junction-to-case (θJC): Cases K, L, and 3 - - - - - - - - - - - - - - - - See MIL-M-38510, appendix C Storage temperature range - - - - - - - - - - - - - −65°C to +150° C Junction temperature (TJ) - - - - - - - - - - - - - +175°C Lead temperature (soldering, 10 seconds) - - - - - - +300°C Supply voltage (VCC) - - - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Maximum logic low voltage (VIL) - - - - - - - - - - 0.8 V dc Minimum logic high voltage (VIH) - - - - - - - - - - 2.0 V dc Case operating temperature range (TC) - - - - - - - −55°C to +125°C Minimum setup time, Data to CP (ts): Device type 01 - - - - - - - - - - - - - - - - - - 4.0 ns Device type 02 - - - - - - - - - - - - - - - - - - 3.0 ns Minimum hold time, Data to CP (th): Device type 01 - - - - - - - - - - - - - - - - - - 2.0 ns Device type 02 - - - - - - - - - - - - - - - - - - 1.5 ns Minimum setup time, [E bar][N bar] to CP (ts): Device type 01 - - - - - - - - - - - - - - - - - - 4.0 ns Device type 02 - - - - - - - - - - - - - - - - - - 3.0 ns Minimum hold time, [E bar][N bar] to CP (th): Device type 01 - - - - - - - - - - - - - - - - - - 2.0 ns Device type 02 - - - - - - - - - - - - - - - - - - 0.0 ns Minimum [C bar][L bar][R bar] recovery time, low to high (trem): Device type 01 - - - - - - - - - - - - - - - - - - 7.0 ns Device type 02 - - - - - - - - - - - - - - - - - - 6.0 ns Minimum CP width, low or high (tW): Device type 01 - - - - - - - - - - - - - - - - - - 7.0 ns Device type 02 - - - - - - - - - - - - - - - - - - 6.0 ns Minimum [C bar][L bar][R bar] pulse width, low (tW): Device type 01 - - - - - - - - - - - - - - - - - - 7.0 ns Device type 02 - - - - - - - - - - - - - - - - - - 6.0 ns
DLA - SMD-5962-88675 - MICROCIRCUITS, DIGITAL, FAST CMOS, 8-BIT NONINVERTING BUS INTERFACE LATCH, TTL COMPATIBLE, MONOLITHIC SILICON Organization: DLA
Date: 1988-09-06
Description: The complete part number shall be as shown in the following example: The device types shall identify the circuit function as follows: Device type Generic number Circuit function 01 54FCT845A 8-bit noninverting bus interface latch, TTL compatible 02 54FCT845B 8-bit noninverting bus interface latch, TTL compatible The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows: Outline letter Case outline K F-6 (24-lead, .640" × .420". × .090"), flat package L D-9 (24-lead, 1.280" ×.310" × .200"), dual-in-line package 3 C-4 (28-terminal, .460" × .460" × .100"), square chip carrier package Supply voltage range (VCC) - - - - - - - - - - - - - - - - −0.5 V dc to +6.0 V dc Input voltage range - - - - - - - - - - - - - - - - - - - - −0.5 V dc to VCC +0.5 V dc Output voltage range - - - - - - - - - - - - - - - - - - - −0.5 V dc to VCC +0.5 V dc DC input diode current (IIK) - - - - - - - - - - - - - - - ±20mA DC output diode current (IOK) - - - - - - - - - - - - - - - ±50 mA DC output current - - - - - - - - - - - - - - - - - - - - - ±100mA Maximum power dissipation (PD) 2/ - - - - - - - - - - - - - - 500 mW Thermal resistance, junction-to-case (θJC): Cases K, L, and 3 - - - - - - - - - - - - - - - - - - - - See MIL-M-38510, appendix C Storage temperature range - - - - - - - - - - - - - - - - - −65°C to +150°C Junction temperature (TJ) - - - - - - - - - - - - - - - - - +175°C Lead temperature (soldering, 10 seconds)- - - - - - - - - - +300°C Supply voltage (VCC) - - - - - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Maximum logic low voltage (VIL) - - - - - - - - - - - - 0.8 V dc Minimum logic high voltage (VIH) - - - - - - - - - - - - 2.0 V dc Case operating temperature range (TC)- - - - - - - - - - −55°C to +125°C Minimum setup time, data to LE (ts): Device type 01 - - - - - - - - - - - - - - - - - - - - 2.5 ns Device type 02 - - - - - - - - - - - - - - - - - - - - 2.5 ns Minimum hold time, data to LE (th): Device type 01 - - - - - - - - - - - - - - - - - - - - 3.0 ns Device type 02 - - - - - - - - - - - - - - - - - - - - 2.5 ns Maximum preset recovery time, low to high (trem): Device type 01 - - - - - - - - - - - - - - - - - - - - 17.0 ns Device type 02 - - - - - - - - - - - - - - - - - - - - 13.0 ns Maximum clear recovery time, low to high (trem): Device type 01 - - - - - - - - - - - - - - - - - - - - 17.0 ns Device type 02 - - - - - - - - - - - - - - - - - - - - 10.0 ns Minimum LE pulse width, high (tw): Device type 01 - - - - - - - - - - - - - - - - - - - - 6.0 ns Device type 02 - - - - - - - - - - - - - - - - - - - - 4.0 ns Minimum preset pulse width, low (tw): Device type 01 - - - - - - - - - - - - - - - - - - - - 9.0 ns Device type 02 - - - - - - - - - - - - - - - - - - - - 4.0 ns Minimum clear pulse width, low (tw): Device type 01 - - - - - - - - - - - - - - - - - - - - 9.0 ns Device type 02 - - - - - - - - - - - - - - - - - - - - 4.0 ns
IEC 62680-2-1 - UNIVERSAL SERIAL BUS INTERFACES FOR DATA AND POWER – PART 2-1: UNIVERSAL SERIAL BUS SPECIFICATION, REVISION 2.0 - EDITION 1.0 Organization: IEC
Date: 2015-09-01
Description: This series covers the Universal Series Bus interfaces for data and power and consists of the following parts: IEC 62680-1-1, Universal Serial Bus interfaces for data and power – Part 1-1: Common components – USB Battery Charging Specification, Revision IEC 62680-2-1, Universal Serial Bus interfaces for data and power – Part 2-1: Universal Serial Bus Specification, Revision 2.0 IEC 62680-2-2, Universal Serial Bus interfaces for data and power – Part 2-2: USB Micro- USB Cables and Connectors Specification, Revision 1.01 IEC 62680-2-3, Universal Serial Bus interfaces for data and power – Part 2-3: Universal Serial Bus Cables and Connectors Class Document, Revision 2.0 This part of the IEC 62680 series consists of several distinct parts: the main body of the text, which consists of the original specification and all ECN and Errata developed by the USB-IF.
DS/EN 62680-2-1 - UNIVERSAL SERIAL BUS INTERFACES FOR DATA AND POWER - PART 2-1: UNIVERSAL SERIAL BUS SPECIFICATION, REVISION 2.0 (TA 14) Organization: DS
Date: 2016-01-07
Description: The specification describes the bus attributes, the protocol definition, types of transactions, bus management, and the programming interface required to design and build systems and peripherals that are compliant with this standard.
DLA - SMD-5962-92228 - MICROCIRCUIT, DIGITAL, FAST CMOS, 10-BIT BUS INTERFACE LATCH WITH NONINVERTING THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS AND LIMITED OUTPUT VOLTAGE SWING, MONOLITHIC SILICON Organization: DLA
Date: 1994-10-18
Description: The device type(s) shall identify the circuit function as follows: Device type Generic number Circuit function 01 54FCT841AT 10-bit bus interface latch with noninverting three-state outputs, TTL compatible inputs and limited output voltage swing. 02 54FCT841BT 10-bit bus interface latch with noninverting three-state outputs, TTL compatible inputs and limited output voltage swing. 03 54FCT841CT 10-bit bus interface latch with noninverting three-state outputs, TTL compatible inputs and limited output voltage swing.
DLA - SMD-5962-87519 REV A - MICROCIRCUITS, DIGITAL, NMOS, GENERAL, PURPOSE INTERFACE BUS CONTROLLER, MONOLITHIC SILICON Organization: DLA
Date: 1991-09-20
Description: The complete part number shall be as shown in the following example: The device type shall identify the circuit function as follows: Device type Generic number Circuit function 01 9914A General purpose interface bus (GPIB) controller The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows: Outline letter Case outline Q D-5 (40-lead, 2.096" × .620" × .225"), dual-in-line package X C-5 (44-terminal, .662" × .662" × .120"), square chip carrier package Supply voltage range (VCC)- - - - - - - - - - - - - - - - - - −0.3 V dc to 20 V dc Input voltage range - - - - - - - - - - - - - - - - - - - - - −0.3 V dc to 20 V dc Output voltage range- - - - - - - - - - - - - - - - - - - - - −0.3 V dc to 20 V dc Continuous power dissipation- - - - - - - - - - - - - - - - - 1.0 W Storage temperature range - - - - - - - - - - - - - - - - - - −55°C to +150°C Thermal resistance, junction-to-case (θJC)- - - - - - - - - - See MIL-M-38510, appendix C Lead temperature (soldering, 10 seconds)- - - - - - - - - - - +300°C Supply voltage (VCC) - - - - - - - - - - - - - - - - - - - - 4.75 V dc to 5.25 V dc Supply voltage.
BSI - BS 6475 - SPECIFICATION FOR PROCESSOR SYSTEM BUS INTERFACE (EUROBUS A) Organization: BSI
Date: 1984-04-30
Description: Specifies one of a family of interfaces for use in modular data acquisition, processing, communication and control systems for military, industrial and other applications.
DS/EN 61326-2-5 - ELECTRICAL EQUIPMENT FOR MEASUREMENT, CONTROL AND LABORATORY USE - EMC REQUIREMENTS - PART 2-5: PARTICULAR REQUIREMENTS - TEST CONFIGURATIONS, OPERATIONAL CONDITIONS AND PERFORMANCE CRITERIA FOR DEVICES WITH FIELD BUS INTERFACES ACCORDING TO IEC 61784-1 Organization: DS
Date: 2013-02-28
Description: IEC 61326-2-5:2012 treats the particular features for EMC testing of field devices with field bus interfaces. This part of IEC 61326 covers only the field bus interface of the equipment.
CENELEC - EN 61326-2-5 - ELECTRICAL EQUIPMENT FOR MEASUREMENT, CONTROL AND LABORATORY USE - EMC REQUIREMENTS - PART 2-5: PARTICULAR REQUIREMENTS - TEST CONFIGURATIONS, OPERATIONAL CONDITIONS AND PERFORMANCE CRITERIA FOR DEVICES WITH FIELD BUS INTERFACES ACCORDING TO IEC 61784-1 Organization: CENELEC
Date: 2013-01-01
Description: In addition to the requirements of International Standard IEC 61326-1, this part of IEC 61326 treats the particular features for EMC testing of field devices with field bus interfaces. This part of IEC 61326 covers only the field bus interface of the equipment.
IEC 61326-2-5 - ELECTRICAL EQUIPMENT FOR MEASUREMENT, CONTROL AND LABORATORY USE – EMC REQUIREMENTS – PART 2-5: PARTICULAR REQUIREMENTS – TEST CONFIGURATIONS, OPERATIONAL CONDITIONS AND PERFORMANCE CRITERIA FOR FIELD DEVICES WITH FIELD BUS INTERFACES ACCORDING TO IEC 61784-1 - EDITION 2.0 Organization: IEC
Date: 2012-10-01
Description: In addition to the requirements of International Standard IEC 61326-1, this part of IEC 61326 treats the particular features for EMC testing of field devices with field bus interfaces. This part of IEC 61326 covers only the field bus interface of the equipment.
SAC - GB/T 14241-93 - INFORMATION PROCESSING-PROCESSOR SYSTEM BUS INTERFACE(EUROBUS A) Organization: SAC
Date: 1993-03-16
ISO/IEC 6951 - INFORMATION PROCESSING - PROCESSOR SYSTEM BUS INTERFACE (EUROBUS A) - FIRST EDITION Organization: ISO
Date: 1986-12-15
DOD - SMD 5962-92162 - MICROCIRCUIT, HYBRID, LINEAR, DUAL REDUNDANT, REMOTE TERMINAL, BUS INTERFACE UNIT Organization: DOD
Date: 2012-02-21
Description: This drawing documents five product assurance classes as defined in paragraph...
DOD - SMD 5962-86879 - MICROCIRCUIT, LINEAR, BUS INTERFACE DRIVER CIRCUIT, MONOLITHIC SILICON Organization: DOD
Date: 2014-10-09
Description: This drawing describes device requirements for MIL-STD-883 compliant, non-JAN...
DOD - SMD 5962-99581 - MICROCIRCUIT, DIGITAL, CMOS, BUS INTERFACE TERMINAL CONTROLLER, MONOLITHIC SILICON Organization: DOD
Date: 2015-03-30
Description: This drawing documents two product assurance class levels consisting of high ...
DOD - SMD 5962-86880 - MICROCIRCUIT, LINEAR, CMOS ARINC BUS INTERFACE, MONOLITHIC SILICON Organization: DOD
Date: 2015-10-22
Description: This drawing describes device requirements for MIL-STD-883 compliant, non-JAN...
NPFC - A-A-50732 - TEST SET, INTERFACE BUS Organization: NPFC
NPFC - A-A-58012 - TEST SET, INTERFACE BUS Organization: NPFC
DS/EN 62680-1-3 - UNIVERSAL SERIAL BUS INTERFACES FOR DATA AND POWER – PART 1-3: UNIVERSAL SERIAL BUS INTERFACES – COMMON COMPONENTS – USB TYPE-CTM CABLE AND CONNECTOR SPECIFICATION Organization: DS
Date: 2016-11-28
Description: It defines a new receptacle, plug, cable and detection mechanisms that are compatible with existing USB interface electrical and functional specifications. This specification covers the following aspects that are needed to produce and use this new USB cable/connector solution in newer platforms and devices, and that interoperate with existing platforms and devices: - USB Type-C receptacles, including electro-mechanical definition and performance requirements; - USB Type-C plugs and cable assemblies, including electro-mechanical definition and performance requirements; - USB Type-C to legacy cable assemblies and adapters; - USB Type-C-based device detection and interface configuration, including support for legacy connections; - USB Power Delivery optimized for the USB Type-C connector.

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