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ANSI C83.62 - EIA STANDARD METALLIZED DIELECTRIC CAPACITORS IN METALLIC AND NON-METALLIC CASES FOR DIRECT CURRENT APPLICATION Organization: ANSI
ECIA - EIA SP 4334 - PROPOSED REAFFIRMATION OF EIA-540DB00 "BLANK DETAIL SPECIFICATION FOR DECOUPLING CAPACITOR DUAL IN-LINE PACKAGE SOCKETS" Organization: ECIA
ECIA - EIA SP 3930 - PROPOSED REVISION OF EIA-198-D "CERAMIC DIELECTRIC CAPACITORS CLASSES I, II, III AND IV - PART II: TEST METHODS" Organization: ECIA
ECIA - EIA SP 3931 - PROPOSED REVISION OF EIA-198-D "CERAMIC DIELECTRIC CAPACITORS CLASSES I, II, III AND IV - PART III: INDIVIDUAL SPECIFICATIONS" Organization: ECIA
ECIA - EIA SP 3929 - PROPOSED REVISION OF EIA-198-D - CERAMIC DIELECTRIC CAPACITORS CLASSES I, II, III AND IV - PART I: CHARACTERISTICS AND REQUIREMENTS:" Organization: ECIA
ECIA - EIA SP 4335 - PROPOSED REAFFIRMATION OF EIA-540DBAA "DETAIL SPECIFICATION FOR DECOUPLING CAPACITOR DUAL IN-LINE PACKAGE SOCKETS FOR USE IN ELECTRONIC EQUIPMENT" Organization: ECIA
ECIA - EIA CB 11 - SURFACE MOUNTING OF MULTILAYER CERAMIC CHIP CAPACITORS, GUIDELINES FOR Organization: ECIA
Date: 1986-01-01
Description: Guidelines for the selection and use of these chips based on electrical ratings, values and performance characteristics are given in ELA specification EIA-198-C, Ceramic Dielectric Capacitors. Note that this document concentrates and directs its information to the mounting and interconnection of chips by soldering.
ECIA - EIA-376 - FIXED FILM DIELECTRIC CAPACITORS IN METALLIC AND NON-METALLIC CASES FOR D.C. APPLICATION - ANSI C83.61-71 Organization: ECIA
Date: 1970-01-01
Description: This EIA Standard covers the general requirements for direct current (D.C.) film dielectric, fixed capacitors in metallic and non-metallic cases. Capacitors listed are used primarily in entertainment, commercial and industrial equipment for filtering, bypass, coupling, and blocking purposes where D.C. voltages predominate.
ECIA - 540DB00 - BLANK DETAIL SPECIFICATION FOR DECOUPLING CAPACITOR DUAL IN-LINE PACKAGE SOCKETS Organization: ECIA
Date: 1993-01-01
Description: (d) Decoupling capacitance _____ microfarads OBJECT The object of this detail specification is to provide all information required, using Sectional Specification EIA-540D000 as a base, for the identification and quality assessment of Decoupling Capacitor Dual In-Line package sockets within the NECQ quality system.
ECIA - EIA-377 - METALLIZED DIELECTRIC CAPACITORS IN METALLIC AND NON-METALLIC CASES FOR DIRECT CURRENT APPLICATION - ANSI C83.62-71 Organization: ECIA
Date: 1970-01-01
Description: This standard covers the general requirements for direct current (D.C.) metalized electrode, film and/or paper dielectric fixed capacitors in metallic and non-metallic cases. Capacitors listed in this standard are used primarily for filtering, bypass, coupling and blocking purposes where D.C. voltages predominate.
ECIA - EIA-540DBAA - DETAIL SPECIFICATION FOR DECOUPLING CAPACITOR DUAL IN-LINE PACKAGE SOCKETS FOR USE IN ELECTRONIC EQUIPMENT Organization: ECIA
Date: 1994-10-19
Description: OBJECT The object of this Detail Specification is to provide all information required for the identification and quality assessment of decoupiing capacitor dual in-line package sockets for the NECQ quality system, using Sectional Specification EIA-540D000 as a base. The information contained herein or by reference is complete and sufficient for inspection purposes.
ECIA - EIA-198-2 - CERAMIC DIELECTRIC CAPACITORS CLASSES I, II, III, AND IV PART II: TEST METHODS Organization: ECIA
Date: 1998-01-01
Description: The test methods described herein are not to be interpreted as an exact and conclusive representation of actual service operation in any one geographic location, since it is known that the only true test for operation in a specific location is an actual service test at that point; b) To describe in one standard (1) all of the test methods applicable to ceramic capacitors described in EIA-198, (2) those newly-developed test methods that are feasible for use in several standards, and (3) the recognized extreme environments, particularly temperatures, barometric pressures etc., at which capacitors will be tested under some of the presently-standardized testing procedures.
ECIA - EIA-198-1 - CERAMIC DIELECTRIC CAPACITORS CLASSES I, II, III AND IV - PART I: CHARACTERISTICS AND REQUIREMENTS - REVISION OF EIA-198-1-E Organization: ECIA
Date: 2002-11-01
Description: EIA-198-1-F of this standard provides means to characterize ceramic capacitors electrically and mechanically by use of type designators.
ECIA - EIA-198-3 - CERAMIC DIELECTRIC CAPACITORS CLASSES I, II, III AND IV PART III: INDIVIDUAL SPECIFICATIONS - REPLACES EIA 198-D Organization: ECIA
Date: 1998-01-01
Description: Prior to printing a review was conducted of current EIA Standards and a list of documents that could have bearing on this standard was assembled.
EIA - EIA RS-468 - LEAD TAPING OF COMPONENTS IN THE RADIAL CONFIGURATION FOR AUTOMATIC HANDLING Organization: EIA
Date: 1981-04-01
Description: This Standard covers the lead taping requirements for components having radial leads covering specifically disc capacitors, electrolytic capacitors, film capacitors and fixed inductors. It may be expanded to cover lead taping of other components not specifically mentionf=!
ASTM F1771 - STANDARD TEST METHOD FOR EVALUATING GATE OXIDE INTEGRITY BY VOLTAGE RAMP TECHNIQUE Organization: ASTM
Date: 1997-02-10
Description: For a more detailed discussion of the design and evaluation of test structures for this test method, the reader is referred to the EIA/JEDEC Standard 35-1. Failure criteria specified in this test method include both the fixed current limit (soft) and destructive (hard) types.
IPC-C-1000 - IPC ESSENTIAL DOCUMENT COLLECTION FOR BOARD DESIGN, ASSEMBLY AND MANUFACTURE - TO PURCHASE HARDCOPY COMPILATION, CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE. STANDARDS FROM THIS COMPILATION ARE AVAILABLE AS INDIVIDUAL DOCUMENTS IN IHS STANDARDS EXPERT. SEE DETAILS FOR ADDITIONAL INFORMATION. Organization: IPC
Date: 2008-06-01
Description: 1071A: Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing 1601: Printed Board Handling and Storage Guidelines 2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards 2152: Standard for Determining Current Carrying Capacity in Printed Board Design 2221B: Generic Standard on Printed Board Design 2222A: Sectional Design Standard for Rigid Organic Printed Boards 2223C: Sectional Design Standard for Flexible Printed Boards 2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies 2226: Sectional Design Standard for High Density Interconnect (HDI) Boards 2251: Design Guide for the Packaging of High Speed Electronic Circuits 2252: Design Guide for RF/Microwave Circuit Boards 2316: Design Guide for Embedded Passive Device Printed Boards 2611: Generic Requirements for Electronic Product Documentation 2612: Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descript 2612-1: Sectional Requirements for Electronic Diagramming Symbol Generation Methodology 2614: Sectional Requirements for Board Fabrication Documentation 2615: Printed Board Dimensions and Tolerances 3406: Guidelines for Electrically Conductive Surface Mount Adhesives 3408: General Requirements for Anisotropically Conductive Adhesives Films 4101D: Specification for Base Materials for Rigid and Multilayer Printed Boards 4103A-WAM1: Specification for Base Materials for High Speed/High Frequency Applications 4104: Specification for High Density Interconnect (HDI) and Microvia Materials 4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boar 4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications 4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat 4202A: Flexible Base Dielectrics for Use in Flexible Printed Circuitry 4203A: Cover and Bonding Material for Flexible Printed Circuitry 4204A-WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry 4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement 4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards 4552-WAM1-2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit 4553A: Specification for Immersion Silver Plating for Printed Boards 4554: Specification for Immersion Tin Plating for Printed Circuit Boards 4556: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating fo 4562A: Metal Foil for Printed Board Applications 4563: Resin Coated Copper Foil for Printed Boards Guideline 4761: Design Guide for Protection of Printed Board Via Structures 4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend 4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed 4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printe 5701: Users Guide for Cleanliness of Unpopulated Printed Boards 5702: Guidelines for OEMs in Determining Accept Levels of Cleanliness of Unpopulated Printed Boards 5704: Cleanliness Requirements for Unpopulated Printed Boards 6011: Generic Performance Specification for Printed Boards 6012C: Qualification and Performance Specification for Rigid Printed Boards 6013C: Qualification and Performance Specification for Flexible Printed Boards 6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive De 6018B: Qualification and Performance Specification for High Frequency (Microwave) Printed Boards 7092: Design and Assembly Process Implementation for Embedded Components 7093: Design and Assembly Process Implementation for Bottom Termination Components 7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components 7095C: Design and Assembly Process Implementation for BGAs 7351B: Generic Requirements for Surface Mount Design and Land Pattern Standard 7526: Stencil and Misprinted Board Cleaning Handbook - FREE DOWNLOAD 7801: Reflow Oven Process Control Standard 9201A: Surface Insulation Resistance Handbook 9202: Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemic 9203: Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle 9252A: Requirements for Electrical Testing of Unpopulated Printed Boards 9641: High Temperature Printed Board Flatness Guideline 9691A: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Te 9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments 9702: IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects 9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability 9704A: Printed Circuit Assembly Strain Gage Test Guideline 9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder 9707: Spherical Bend Test Method for Characterization of Board Level Interconnects 9708: Test Methods for Characterization of Printed Board Assembly Pad Cratering 9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards A-600H: Acceptability of Printed Boards A-610F: Acceptability of Electronics Assembly A-620B: Requirements and Acceptance for Cable and Wire Harness Assemblies C-406: Design & Application Guidelines for Surface Mount Connectors CA-821: General Requirements for Thermally Conductive Adhesives CC-830B: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assembl CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies CM-770E: Component Mounting Guidelines for Printed Boards D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies D-325A: Documentation Requirements for Printed Boards D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Asse D-422: Design Guide for Press Fit Rigid Printed Board Back Planes DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards DR-572A: Drilling Guidelines for Printed Boards FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Pr HDBK-005: Guide to Solder Paste Assessment HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, T J-STD-003C-WAM1: Solderability Tests for Printed Boards J-STD-004B: Requirements for Soldering Fluxes J-STD-005A: Requirements for Soldering Pastes J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices J-STD-026: Semiconductor Design Standard for Flip Chip Applications J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations J-STD-028: Performance Standard for Construction of Flip Chip and Chip Scale Bumps J-STD-030A: Selection and Application of Board Level Underfill Materials J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Device J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes MC-790: Guidelines for Multichip Module Technology Utilization ML-960: Qualification and Performance Specification for Mass Lamination Panels for Multilayer print MS-810: Guidelines for High Volume Microsection QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards S-816: SMT Process Guideline & Checklist SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting SM-784: Guidelines for Chip-on-Board Technology Implementation SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments SM-817A: General Requirements for Dielectric Surface Mount Adhesives SM-840E: Qualification and Performance Specifiation of Permanent Solder Mask and Flexible Cover Mat TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology TR-486: Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress TR-579: Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs TR-583: An In-Depth Look At Ionic Cleanliness Testing WP/TR-584A: IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Prin WP-008: Setting Up Ion Chromatography Capability

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