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DS/EN 62047-15 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 15: TEST METHOD OF BONDING STRENGTH BETWEEN PDMS AND GLASS Organization: DS
Date: 2015-07-14
Description: The problem of bonding strength is mainly for high pressure applications as in the case of certain peristaltic pump designs where an off chip compressed air supply is used to drive the fluids in micro channels created by a twin layer, one formed by bondage between glass with replica moulded PDMS and another between PDMS and PDMS.
IEC 62047-15 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 15: TEST METHOD OF BONDING STRENGTH BETWEEN PDMS AND GLASS - EDITION 1.0 Organization: IEC
Date: 2015-03-01
Description: The problem of bonding strength is mainly for high pressure applications as in the case of certain peristaltic pump designs where an off chip compressed air supply is used to drive the fluids in micro channels created by a twin layer, one formed by bondage between glass with replica moulded PDMS and another between PDMS and PDMS.
CENELEC - EN 62047-15 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 15: TEST METHOD OF BONDING STRENGTH BETWEEN PDMS AND GLASS Organization: CENELEC
Date: 2015-07-01
Description: The problem of bonding strength is mainly for high pressure applications as in the case of certain peristaltic pump designs where an off chip compressed air supply is used to drive the fluids in micro channels created by a twin layer, one formed by bondage between glass with replica moulded PDMS and another between PDMS and PDMS.
CEI - EN 62047-15 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES PART 15: TEST METHOD OF BONDING STRENGTH BETWEEN PDMS AND GLASS Organization: CEI
Date: 2016-01-01
Description: The problem of bonding strength is mainly for high pressure applications as in the case of certain peristaltic pump designs where an off chip compressed air supply is used to drive the fluids in micro channels created by a twin layer, one formed by bondage between glass with replica moulded PDMS and another between PDMS and PDMS.
JEDEC JESD 247 - MULTI-WIRE MULTI-LEVEL I/O STANDARD Organization: JEDEC
Date: 2016-06-01
Description: This standard defines the DC and AC operating conditions, I/O impedances, termination characteristics, and compliance test methods of I/O drivers and receivers used in multi-wire, multi-level signaling interfaces. The multiwire interfaces defined by this specification all utilize quaternary signal levels.

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