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This standard deÞnes the information content and the data formats for the interchange of digital test program data between DATPGs and automatic test equipment (ATE) for board-level printed circuit assemblies. This information can be broadly grouped into data that deÞnes the...
This document specifies the use of the integrated resources necessary for the scope and information requirements for electronic assembly interconnect and packaging design NOTE The scope of this document is further refined in the application activity model in Annex F. The following are within...
IEC 62325-451-4:2014 specifies a package for the settlement and reconciliation business process and the associated document contextual model, assembly model and XML schema for use within European style markets. The relevant aggregate core components (ACCs) defined in IEC 62325-351 have been...
This part of IEC 62325 specifies a UML package for the electricity balancing business process and its associated document contextual models, assembly models and XML schemas for use within the European style electricity markets. This part of IEC 62325 is based on the European style market...
Based on the European style market profile (IEC 62325-351), this part of IEC 62325-451 specifies a package for the problem statement and status request business processes and the associated document contextual models, assembly models and XML schema for use within European style markets. The...
Based on the European style market profile (IEC 62325-351), this part of IEC 62325-451 specifies a package for the problem statement and status request business processes and the associated document contextual models, assembly models and XML schema for use within European style markets. The...
This part of IEC 62325 specifies a UML package for the market information publication business process and its associated document contextual models, assembly models and XML schemas for use within the European-style electricity markets. This part of IEC 62325 is based on the European-style...
Based on the European style market profile (ESMP) (IEC 62325-351), this part of IEC 62325- 451 specifies a package for the settlement and reconciliation business process and the associated document contextual model, assembly model and XML schema for use within European style markets. The...
Based on the European style market profile (IEC 62325-351), this part of IEC 62325-451 specifies a package for the settlement and reconciliation business process and the associated document contextual model, assembly model and XML schema for use within European style markets. The relevant...
IEC 62325-451-6:2016 specifies a UML package for the market information publication business process and its associated document contextual models, assembly models and XML schemas for use within the European style electricity markets. Is based on the European style market contextual model...
IEC 62325-451-5:2015 is based on the European style market profile (IEC 62325-351) and specifies a package for the problem statement and status request business processes and the associated document contextual models, assembly models and XML schema for use within European style markets. The...
This part of IEC 62325 specifies a UML package for the market information publication business process and its associated document contextual models, assembly models and XML schemas for use within the European-style electricity markets. This part of IEC 62325 is based on the European-style...
This part of IEC 62325 specifies a UML package for the market information publication business process and its associated document contextual models, assembly models and XML schemas for use within the European style electricity markets. This part of IEC 62325 is based on the European style...
This part of IEC 61192 specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed...
This part of IEC 61192 specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally trough-hole...
IEC 62325-451-6:2018 specifies a UML package for the market information publication business process and its associated document contextual models, assembly models and XML schemas for use within the European-style electricity markets. This standard is based on the European-style market...
