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ESD EP119 - PRINTED CIRCUIT BOARD DESIGN TECHNIQUES FOR EMC COMPLIANCE - TO PURCHASE CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE Organization: ESD
Date: 2000-01-01
IEEE PRINTED CIRCUIT - PRINTED CIRCUIT BOARD DESIGN TECHNIQUES FOR EMC COMPLIANCE Organization: IEEE
IEEE EMC PRINTED - EMC AND THE PRINTED CIRCUIT BOARD: DESIGN, THEORY, AND LAYOUT MADESIMPLE Organization: IEEE
IPC-HDBK-850 - GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF POTTING MATERIALS AND ENCAPSULATION PROCESSES USED FOR ELECTRONICS PRINTED CIRCUIT BOARD ASSEMBLY Organization: IPC
Date: 2012-07-01
Description: The purpose of this handbook is to assist the individuals who must either make choices regarding encapsulation or who must work in encapsulation operations and to provide guidelines for the design, selection, and application of Potting and Encapsulation as it pertains to electronic components and printed board assembly only.
AENOR UNE 20552 - DESIGN AND USE OF COMPONENTS INTENTED FOR MOUNTING ON BOARD WITH WIRING AND PRINTED CIRCUITS Organization: AENOR
Date: 1975-06-15
MCGRAW-HILL - PRINT CIRC ASSEM DES - PRINTED CIRCUIT ASSEMBLY DESIGN Organization: MCGRAW-HILL
Date: 2000-01-01
Description: In this unique one-stop design guide you'll find complete coverage of electrical and mechanical design considerations as you explore: design process flow; the latest design methods and tools; circuit board layout; documentation; more.
IEC 63055 - FORMAT FOR LSI-PACKAGE-BOARD INTEROPERABLE DESIGN - EDITION 1.0 Organization: IEC
Date: 2016-11-01
Description: This standard defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSI are interconnected.
IEEE 2401 - FORMAT FOR LSI-PACKAGE-BOARD INTEROPERABLE DESIGN - IEEE COMPUTER SOCIETY Organization: IEEE
Date: 2015-09-03
Description: This standard defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSI are interconnected.
JEDEC JESD 51-8 - INTEGRATED CIRCUIT THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS - JUNCTION-TO-BOARD Organization: JEDEC
Date: 1999-10-01
Description: The environmental conditions described in this document are specifically designed for testing of integrated circuit devices that are mounted on standard test boards with two internal copper planes [3].
IPC-C-1000 - IPC ESSENTIAL DOCUMENT COLLECTION FOR BOARD DESIGN, ASSEMBLY AND MANUFACTURE - TO PURCHASE HARDCOPY COMPILATION, CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE. STANDARDS FROM THIS COMPILATION ARE AVAILABLE AS INDIVIDUAL DOCUMENTS IN IHS STANDARDS EXPERT. SEE DETAILS FOR ADDITIONAL INFORMATION. Organization: IPC
Date: 2008-06-01
Description: 1071A: Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing 1601: Printed Board Handling and Storage Guidelines 2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards 2152: Standard for Determining Current Carrying Capacity in Printed Board Design 2221B: Generic Standard on Printed Board Design 2222A: Sectional Design Standard for Rigid Organic Printed Boards 2223C: Sectional Design Standard for Flexible Printed Boards 2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies 2226: Sectional Design Standard for High Density Interconnect (HDI) Boards 2251: Design Guide for the Packaging of High Speed Electronic Circuits 2252: Design Guide for RF/Microwave Circuit Boards 2316: Design Guide for Embedded Passive Device Printed Boards 2611: Generic Requirements for Electronic Product Documentation 2612: Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descript 2612-1: Sectional Requirements for Electronic Diagramming Symbol Generation Methodology 2614: Sectional Requirements for Board Fabrication Documentation 2615: Printed Board Dimensions and Tolerances 3406: Guidelines for Electrically Conductive Surface Mount Adhesives 3408: General Requirements for Anisotropically Conductive Adhesives Films 4101D: Specification for Base Materials for Rigid and Multilayer Printed Boards 4103A-WAM1: Specification for Base Materials for High Speed/High Frequency Applications 4104: Specification for High Density Interconnect (HDI) and Microvia Materials 4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boar 4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications 4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat 4202A: Flexible Base Dielectrics for Use in Flexible Printed Circuitry 4203A: Cover and Bonding Material for Flexible Printed Circuitry 4204A-WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry 4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement 4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards 4552-WAM1-2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit 4553A: Specification for Immersion Silver Plating for Printed Boards 4554: Specification for Immersion Tin Plating for Printed Circuit Boards 4556: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating fo 4562A: Metal Foil for Printed Board Applications 4563: Resin Coated Copper Foil for Printed Boards Guideline 4761: Design Guide for Protection of Printed Board Via Structures 4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend 4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed 4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printe 5701: Users Guide for Cleanliness of Unpopulated Printed Boards 5702: Guidelines for OEMs in Determining Accept Levels of Cleanliness of Unpopulated Printed Boards 5704: Cleanliness Requirements for Unpopulated Printed Boards 6011: Generic Performance Specification for Printed Boards 6012C: Qualification and Performance Specification for Rigid Printed Boards 6013C: Qualification and Performance Specification for Flexible Printed Boards 6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive De 6018B: Qualification and Performance Specification for High Frequency (Microwave) Printed Boards 7092: Design and Assembly Process Implementation for Embedded Components 7093: Design and Assembly Process Implementation for Bottom Termination Components 7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components 7095C: Design and Assembly Process Implementation for BGAs 7351B: Generic Requirements for Surface Mount Design and Land Pattern Standard 7526: Stencil and Misprinted Board Cleaning Handbook - FREE DOWNLOAD 7801: Reflow Oven Process Control Standard 9201A: Surface Insulation Resistance Handbook 9202: Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemic 9203: Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle 9252A: Requirements for Electrical Testing of Unpopulated Printed Boards 9641: High Temperature Printed Board Flatness Guideline 9691A: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Te 9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments 9702: IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects 9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability 9704A: Printed Circuit Assembly Strain Gage Test Guideline 9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder 9707: Spherical Bend Test Method for Characterization of Board Level Interconnects 9708: Test Methods for Characterization of Printed Board Assembly Pad Cratering 9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards A-600H: Acceptability of Printed Boards A-610F: Acceptability of Electronics Assembly A-620B: Requirements and Acceptance for Cable and Wire Harness Assemblies C-406: Design & Application Guidelines for Surface Mount Connectors CA-821: General Requirements for Thermally Conductive Adhesives CC-830B: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assembl CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies CM-770E: Component Mounting Guidelines for Printed Boards D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies D-325A: Documentation Requirements for Printed Boards D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Asse D-422: Design Guide for Press Fit Rigid Printed Board Back Planes DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards DR-572A: Drilling Guidelines for Printed Boards FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Pr HDBK-005: Guide to Solder Paste Assessment HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, T J-STD-003C-WAM1: Solderability Tests for Printed Boards J-STD-004B: Requirements for Soldering Fluxes J-STD-005A: Requirements for Soldering Pastes J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices J-STD-026: Semiconductor Design Standard for Flip Chip Applications J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations J-STD-028: Performance Standard for Construction of Flip Chip and Chip Scale Bumps J-STD-030A: Selection and Application of Board Level Underfill Materials J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Device J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes MC-790: Guidelines for Multichip Module Technology Utilization ML-960: Qualification and Performance Specification for Mass Lamination Panels for Multilayer print MS-810: Guidelines for High Volume Microsection QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards S-816: SMT Process Guideline & Checklist SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting SM-784: Guidelines for Chip-on-Board Technology Implementation SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments SM-817A: General Requirements for Dielectric Surface Mount Adhesives SM-840E: Qualification and Performance Specifiation of Permanent Solder Mask and Flexible Cover Mat TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology TR-486: Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress TR-579: Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs TR-583: An In-Depth Look At Ionic Cleanliness Testing WP/TR-584A: IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Prin WP-008: Setting Up Ion Chromatography Capability
DSF/FPREN 16602-70-28 - SPACE PRODUCT ASSURANCE - REPAIR AND MODIFICATION OF PRINTED CIRCUIT BOARD ASSEMBLIES FOR SPACE USE Organization: DS
Description: This Standard is confined to the repair and modification of single­sided, double­sided and multi­layer printed circuit board assemblies. This Standard does not address the potential need for rework resulting from a repair or modification and unassembled (bare) printed circuits boards.
CEN - EN 16602-70-28 - SPACE PRODUCT ASSURANCE - REPAIR AND MODIFICATION OF PRINTED CIRCUIT BOARD ASSEMBLIES FOR SPACE USE Organization: CEN
Date: 2014-10-01
Description: This Standard is confined to the repair and modification of singlesided, doublesided and multilayer printed circuit board assemblies. This Standard does not address the potential need for rework resulting from a repair or modification and unassembled (bare) printed circuits boards.
NBN - EN 16602-70-28 - SPACE PRODUCT ASSURANCE - REPAIR AND MODIFICATION OF PRINTED CIRCUIT BOARD ASSEMBLIES FOR SPACE USE Organization: NBN
Date: 2014-11-28
Description: This Standard is confined to the repair and modification of single­sided, double­sided and multi­layer printed circuit board assemblies. This Standard does not address the potential need for rework resulting from a repair or modification and unassembled (bare) printedcircuits boards.
IPC-C-105 - RIGID PRINTED BOARD STANDARDS COLLECTION - TO PURCHASE HARDCOPY COMPILATION, CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE. STANDARDS FROM THIS COMPILATION ARE AVAILABLE AS INDIVIDUAL DOCUMENTS IN IHS STANDARDS EXPERT. SEE DETAILS FOR ADDITIONAL INFORMATION. Organization: IPC
Date: 2008-06-01
Description: These IPC documents can be viewed individually through the appropriate IPC subscriptions in IHS Standards Expert 1601: Printed Board Handling and Storage Guidelines 2152: Standard for Determining Current Carrying Capacity in Printed Board Design 2221B: Generic Standard on Printed Board Design 2222A: Sectional Design Standard on Rigid Organic Printed Boards 2226: Sectional Design Standard for High Density Interconnect (HDI) Boards 2251: Design Guide for the Packaging of High Speed Electronic Circuits 2252: Design Fuide fore RF/Microwave Circuit Boards 2316: Design Guide for Embedded Passive Device Printed Boards 2611: Generic Requirements for Electronic Product Documentation 2614: Sectional Requirements for Board Fabrication Documentation 2615: Printed Board Dimensions and Tolerances 4101C: Specification for Base Materials for Rigid and Multilayer Printed Boards 4103A: Specification for Base Materials for High Speed/High Frequency Applications 4412A: Specification for Finished Fabric Woven from "E" Glass for Printed Boards - Includes Amendments 4552: Specificaion for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards 4553A: Specification for Immersion Silver Plating for Printed Boards 4554: Specification for Immersion Tin Plating for printed Circuit Boards 4562A: Metal Foil for Printed Board Applications 4563: Resin Coated Copper Foil for Printed Boards Guideline 4761: Design Guide for Protection of Printed Board Via Structures 4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend 4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed 4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed 6011: Generic Performance Specification for Printed Boards 6012C: Qualification and Performance Specification for Rigid Printed Boards 6017: Qualification and Performance Specification for printed Boards Containing Embedded Passive 6018B: Qualification and Performance Specification for High Frequency (Microwave) Printed Boards 7351B: Generic Requirements for Surface Mount Design and Land Pattern Standard 9252A: Requirements for Electrical Testing of Unpopulated Printed Boards 9691A: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test A-600H: Acceptability of Printed Boards D-325A: Documentation Requirements for Printed Boards DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards DR-572A: Drilling Guidelines for Printed Boards JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline J-STD-003B: Solderability Tests for Printed Boards ML-960: Qualification and Performance Specification for Mass Lamination Panels for Multilayer Print MA-810: Guidelines for High Volume Microsection SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Mat T-50J: Terms and Definitions for Interconnecting and Packaging Electronic Circuits TR-486: Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress TR-579: Round Robin Reliability Evaluation of Smalll Diameter Plated Through Holes in PWBs WP/TR-584A: IPC White Pater and Technical Report on the Use of Halogenated Flame Retardants in Print
IPC-C-102 - FLEXIBLE PRINTED BOARD STANDARDS COLLECTION - TO PURCHASE HARDCOPY COMPILATION, CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE. STANDARDS FROM THIS COMPILATION ARE AVAILABLE AS INDIVIDUAL DOCUMENTS IN IHS STANDARDS EXPERT. SEE DETAILS FOR ADDITIONAL INFORMATION. Organization: IPC
Date: 2008-06-01
Description: 2221B: Generic Standard on Printed Board Design 2223C: Sectional Design Standard for Flexible Printed Boards 2611: Generic Requirements for Electronic Product Documentation 2614: Sectional Requirements for Board Fabrication Documentation 4202A: Flexible Base Dielectrics for Use in Flexible Printed Circuitry 4203A: Cover and Bonding Material for Flexble Printed Circuitry 4204A: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry 4412A: Specification for Finished Fabric Woven from "E" Glass for Printed Boards - includes Amendment 4562A: Metal Foil for Printed Board applications 6011: Generic Performance Specification for Printed Boards 6013B: Qualification and Performance Specification for Flexible Printed Boards 9252A: Requirements for Electrical Testing of Unpopulated Printed Boards A-600H: Acceptability of Printed Boards DR-572A: Drilling Guidelines for Printed Boards T-50J: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-2614 - SECTIONAL REQUIREMENTS FOR BOARD FABRICATION DOCUMENTATION Organization: IPC
Date: 2010-03-01
Description: This standard establishes the requirements for the documentation of printed circuit board fabrication, and identifies the physical attributes and performance requirements of the unpopulated product.
IPC-SM-784 - GUIDELINES FOR CHIP-ON- BOARD TECHNOLOGY IMPLEMENTATION Organization: IPC
Date: 1990-11-01
Description: This document provides guidelines for the use of Chip-on-Board Technology (hereafter this term may be referenced by the acronym COB).
IPC-CM-770 - GUIDELINES FOR PRINTED BOARD COMPONENT MOUNTING Organization: IPC
Date: 2004-01-01
Description: Classification of producibility is related to complexity of the design and the precision required to produce the particular printed board or printed board assembly.
MCGRAW - PRINTED CIRCUITS HANDBOOK - PRINTED CIRCUITS HANDBOOK, SEVENTH EDITION Organization: MCGRAW
Date: 2016-01-01
Description: And now, for the first time anywhere, the new edition of this essential guide provides time-saving tools for success in the area of printed circuit supply chain management, including an entire new section on the elements of design, supplier identification and qualification, process control, product acceptance processes, and quality and reliability specification and assurance.
DIN EN 16602-70-28 - SPACE PRODUCT ASSURANCE - REPAIR AND MODIFICATION OF PRINTED CIRCUIT BOARD ASSEMBLIES FOR SPACE USE; ENGLISH VERSION EN 16602-70-28:2014 Organization: DIN
Date: 2015-06-01
Description: This Standard is confined to the repair and modification of singlesided, doublesided and multilayer printed circuit board assemblies. This Standard does not address the potential need for rework resulting from a repair or modification and unassembled (bare) printed circuits boards.

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