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IPC - TM-650 2.5.5.5.1 - STRIPLINE TEST FOR COMPLEX RELATIVE PERMITTIVITY OF CIRCUIT BOARD MATERIALS TO 14 GHZ Organization: IPC
Date: 1998-03-01
Description: Summary: This method is for measurement of relative permittivity (er) and dissipation factor or loss tangent (tan d) of circuit board substrates under stripline conditions. Measurements are made by measuring resonances of a length of stripline over a wide frequency range from below 1 GHz to about 14 GHz(1,2).
IPC-CM-770 - GUIDELINES FOR PRINTED BOARD COMPONENT MOUNTING Organization: IPC
Date: 2004-01-01
Description: The object of this technique is to reduce the thickness of the Chip-On-Board assembly. A resin may cover the chip after bonding.
ECIA - EIA RS-406 - GENERAL DOCUMENT FOR CONNECTORS, ELECTRIC, PRINTED- WIRING BOARD Organization: ECIA
Date: 1973-01-08
Description: Type I One-piece connector Type II Two-piece connector Classes: See Table I Size: The size of the connector defines the thickness of the applicable pluggable printed wiring board. Contact Spacing: The contact spacing centerline to centerline defines the spacing between adjacent contacts.
JEDEC JESD 51-3 - LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD FOR LEADED SURFACE MOUNT PACKAGES Organization: JEDEC
Date: 1996-08-01
Description: This standard describes design requirements for a single layer, leaded surface mount integrated circuit package thermal test board. The standard describes board material and geometry requirements, minimum trace lenghts, trace thickness, and routing considerations.
TSE - TS 3940 - METAL-CLAD BASE MATERIALS FOR PRINTED CIRCUITS THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, NON-BURNING OR SELF-EXTINGUISHING GRADE, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS Organization: TSE
Date: 1983-03-23
Description: This standard give requirements for properties of base materials of defined flammability for use in the fabrication of multilayer printed board. Laminated sheets have thicknesses not greater than 0.8 mm.
NPFC - MIL-STD-2119 - DESIGN REQUIREMENTS FOR PRINTED-WIRING ELECTRICAL BACKPLANE ASSEMBLIES Organization: NPFC
Date: 1990-02-19
Description: The design criteria (such as printed-wiring board thickness) contained in this standard are predicated on the requirement that end item assemblies are conformal coated or solder masked.
IPC-1065 - MATERIAL DECLARATION HANDBOOK Organization: IPC
Date: 2005-01-01
Description: This handbook has been developed to aid Printed Circuit Board manufacturers and users of Printed Circuit Boards in completing Material Declarations that follow the format and guidance of the Joint Industry Material Composition Declaration Guide for Electronic Products.
IPC-4553 - SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS Organization: IPC
Date: 2009-05-01
Description: Statement of ScopeThis specification sets the requirements for the use of Immersion Silver (IAg) as a surface finish for printed circuit boards. This specification is intended to set requirements for IAg deposit thickness based on performance criteria.
IPC/JPCA-4104 - SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS Organization: IPC
Date: 1999-05-01
Description: The application levels used in IPC-4104 slash sheets are:H – Printed Circuit Board/ High Density Interconnect Applications (see Figure 1-3)I – Integrated Circuit Packaging Applications (see Figure 1-4 and Figure 1-5)U – User Defined ApplicationsApplication level H (see Figure 1-3) does not require moisture resistance of PCB materials testing (see IPC-TM-650, Method 2.6.16.1).

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