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SAE ARP6467 - HUMAN FACTORS MINIMUM REQUIREMENTS AND RECOMMENDATIONS FOR THE FLIGHT DECK DISPLAY OF DATA LINKED NOTICES TO AIRMEN (NOTAMS)
Description: Such standardization allows automation (machines or software) to check accuracy, apply various sorting or filtering choices to the NOTAMs, or add other data to them such as displaying their shapes or locations over maps or other baseline data.
NPFC - MIL-PRF-83419 - ALTIMETER, SERVO CONTROLLED, AUTOMATIC PRESSURE STANDBY
Description: The two altimeters covered by this specification are intended for use with altitude computers CPU46/A and CPU66/A, Central Air Data Computers, and Standard Central Air Data Computers (SCADCs) to provide a display of static pressure defect corrected altitude in the normal mode and uncorrected pressure altitude in the standby mode.
NACE SP0214 - INSPECTION, CLEANING, AND REMEDIATION TECHNOLOGY FOR WATER PIPING IN BUILDINGS - ITEM NO. 21176
Description: GROUP I: The predominant water-usage systems in most buildings consisting of potable water (hot and cold); steam and condensate systems; and waters for heating, ventilation, and air conditioning (HVAC) (open and closed systems) GROUP II: Waste water—sewage and drainage GROUP III: Higher quality waters—preconditioning systems and boilers GROUP IV: Fire-protection systems—wet, dry, foam, and other systems GROUP V: Architectural systems—fountains, waterfalls, and other displays Group I: Highest Water-Usage Systems in Buildings The Group I piping systems include the potable-water system and building systems that are major users of potable water.
ASHRAE - LO-09-026 - HUMIDIFICATION OF LARGE-SCALE CLEANROOMS BY ADIABATIC HUMIDIFICATION METHOD IN SUBTROPICAL AREAS: AN INDUSTRIAL CASE STUDY
Description: Normally, MAU output air with the temperature controlled at 11 to 17°C (51.8 to 62.6°F), the humidity-ratio controlled at 9.65 × 10–3 kg/kg (lb/lb) for TFT-LCD (thin-film transistor liquid-crystal displayer) fabrication plants. The make-up air (MA) mixes with return air (RA) to keep the cleanroom at 23 ± 1%°C and 40 ± 5% RH for most high-tech fabrication plants, including those in the semiconductor and TFT-LCD industries.
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