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ASTM B885-09(2020) - Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
October 1, 2020 - ASTM International

5.1 This test method provides a way to detect contamination on printed wiring board fingers that affects the electrical performance of such fingers. Such contamination may arise during PWB manufacture, circuit assembly, or service life and may include solder mask, solder flux, hardened...

GMW16680 - Sealers, Paint Shop, Pumpable, for Waterborne/2K, 3-Wet, Non-Compressed, Compact Painting Process, Generic Qualification
April 1, 2020 - GMW

This specification details the performance requirements of a family of sealers designed to be compatible with the three (3) wet compact painting process which uses waterborne basecoat plus Two (2) Component (2K) clearcoat topcoat systems. The materials are, applied in the paint shop after the...

SMACNA HVAC DUST CONSTR - FIBROUS GLASS DUCT CONSTRUCTION STANDARDS **BOOK & CD**
SMACNA
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ASTM B885-09(2015) - Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
May 1, 2015 - ASTM International

5.1 This test method provides a way to detect contamination on printed wiring board fingers that affects the electrical performance of such fingers. Such contamination may arise during PWB manufacture, circuit assembly, or service life and may include solder mask, solder flux, hardened...

ASTM B885-09 - Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
April 15, 2009 - ASTM International

This test method provides a way to detect contamination on printed wiring board fingers that affects the electrical performance of such fingers. Such contamination may arise during PWB manufacture, circuit assembly, or service life and may include solder mask, solder flux, hardened...

ASTM B885-97(2003) - Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
June 10, 2003 - ASTM International

This test method provides a way to detect contamination on printed wiring board fingers that affects the electrical performance of such fingers. Such contamination may arise during PWB manufacture, circuit assembly, or service life and may include solder mask, solder flux, hardened...

MIL-STD-1330 - PRECISION CLEANING AND TESTING OF SHIPBOARD OXYGEN, HELIUM, HELIUM-OXYGEN, NITROGEN, AND HYDROGEN SYSTEMS
June 28, 2007 - NPFC

This standard provides the requirements for precision cleaning and testing of oxygen or oxygen-enriched systems and components; oxygen generating plants including nitrogen, hydrogen, and demineralized water support systems and components; and helium, helium-oxygen, and hydrogen life support systems...

BS 4558 - Specification for Positive Pressure, Powered Dust Respirators
March 17, 1970 - BSI

Specifies requirements for respirators comprising a mask supplied with filtered air from a power pack, to provide protection whilst reducing the respiratory load.

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