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DLA - MS3498 REV C - SCREW ASSEMBLY, PANEL Organization: DLA
Date: 1987-07-24
Description: THE GOVERNMENT HAS A ROYALTY-FREE LICENSE UNDER U.S PATENT APPLICATION SERIAL NUMBER 843,953 FILED ON JULY 23, 1969, ENTITLED "ADJUSTABLE SLEEVE FOR FASTENING SOFT MATERIAL PANELS TO HARD MATERIAL" FOR THE BENEFIT OF MANUFACTURE OF THIS ADJUSTABLE SLEEVE EITHER FOR THE GOVERNMENT OR FOR USE IN EQUIPMENT TO BE DELIVERED TO THE GOVERNMENT.
EEMUA PUB NO 178 - A DESIGN GUIDE FOR THE ELECTRICAL SAFETY OF INSTRUMENTS, INSTRUMENT/CONTROL PANELS AND CONTROL SYSTEMS - EDITION 2 Organization: EEMUA
Date: 2009-01-01
Description: This Publication is intended to apply to electrically powered instrument systems and their control panels used to measure, indicate, compute, control, record, etc. and which are suitable for use in process control and similar applications.
UL 1693 - UL STANDARD FOR SAFETY ELECTRIC RADIANT HEATING PANELS AND HEATING PANEL SETS - THIRD EDITION; REPRINT WITH REVISIONS THROUGH AND INCLUDING OCTOBER 14, 2011 Organization: UL
Date: 2010-09-13
Description: These requirements do not cover the following: a) Heating equipment connected to the supply by use of a flexible cord with attachment plug; b) Heating equipment that is movable after installation; c) Heating equipment with integral means of producing air flow; d) Heating equipment manufactured and sold as an integral part of a floor or ceiling covering materials such as heated floor tiles, heated carpet, and heated laminate floor; e) Heating equipment exceeding 355 W/m2(33 W/ft2) when installed in concrete or poured masonry; f) Electric Space-Heating Cables of Article 424 Part V of the National Electrical Code, ANSI/NFPA 70; g) Heating panels and panel sets for mounted directly underfloor coverings in accordance with 424.99 of the National Electrical Code, ANSI/NFPA 70; and h) Radiant heating panels intended to be installed in a dropped or suspended ceiling.
IPC-C-1000 - IPC ESSENTIAL DOCUMENT COLLECTION FOR BOARD DESIGN, ASSEMBLY AND MANUFACTURE - TO PURCHASE HARDCOPY COMPILATION, CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE. STANDARDS FROM THIS COMPILATION ARE AVAILABLE AS INDIVIDUAL DOCUMENTS IN IHS STANDARDS EXPERT. SEE DETAILS FOR ADDITIONAL INFORMATION. Organization: IPC
Date: 2008-06-01
Description: 1071A: Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing 1601: Printed Board Handling and Storage Guidelines 2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards 2152: Standard for Determining Current Carrying Capacity in Printed Board Design 2221B: Generic Standard on Printed Board Design 2222A: Sectional Design Standard for Rigid Organic Printed Boards 2223C: Sectional Design Standard for Flexible Printed Boards 2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies 2226: Sectional Design Standard for High Density Interconnect (HDI) Boards 2251: Design Guide for the Packaging of High Speed Electronic Circuits 2252: Design Guide for RF/Microwave Circuit Boards 2316: Design Guide for Embedded Passive Device Printed Boards 2611: Generic Requirements for Electronic Product Documentation 2612: Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descript 2612-1: Sectional Requirements for Electronic Diagramming Symbol Generation Methodology 2614: Sectional Requirements for Board Fabrication Documentation 2615: Printed Board Dimensions and Tolerances 3406: Guidelines for Electrically Conductive Surface Mount Adhesives 3408: General Requirements for Anisotropically Conductive Adhesives Films 4101D: Specification for Base Materials for Rigid and Multilayer Printed Boards 4103A-WAM1: Specification for Base Materials for High Speed/High Frequency Applications 4104: Specification for High Density Interconnect (HDI) and Microvia Materials 4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boar 4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications 4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat 4202A: Flexible Base Dielectrics for Use in Flexible Printed Circuitry 4203A: Cover and Bonding Material for Flexible Printed Circuitry 4204A-WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry 4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement 4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards 4552-WAM1-2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit 4553A: Specification for Immersion Silver Plating for Printed Boards 4554: Specification for Immersion Tin Plating for Printed Circuit Boards 4556: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating fo 4562A: Metal Foil for Printed Board Applications 4563: Resin Coated Copper Foil for Printed Boards Guideline 4761: Design Guide for Protection of Printed Board Via Structures 4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend 4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed 4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printe 5701: Users Guide for Cleanliness of Unpopulated Printed Boards 5702: Guidelines for OEMs in Determining Accept Levels of Cleanliness of Unpopulated Printed Boards 5704: Cleanliness Requirements for Unpopulated Printed Boards 6011: Generic Performance Specification for Printed Boards 6012C: Qualification and Performance Specification for Rigid Printed Boards 6013C: Qualification and Performance Specification for Flexible Printed Boards 6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive De 6018B: Qualification and Performance Specification for High Frequency (Microwave) Printed Boards 7092: Design and Assembly Process Implementation for Embedded Components 7093: Design and Assembly Process Implementation for Bottom Termination Components 7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components 7095C: Design and Assembly Process Implementation for BGAs 7351B: Generic Requirements for Surface Mount Design and Land Pattern Standard 7526: Stencil and Misprinted Board Cleaning Handbook - FREE DOWNLOAD 7801: Reflow Oven Process Control Standard 9201A: Surface Insulation Resistance Handbook 9202: Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemic 9203: Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle 9252A: Requirements for Electrical Testing of Unpopulated Printed Boards 9641: High Temperature Printed Board Flatness Guideline 9691A: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Te 9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments 9702: IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects 9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability 9704A: Printed Circuit Assembly Strain Gage Test Guideline 9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder 9707: Spherical Bend Test Method for Characterization of Board Level Interconnects 9708: Test Methods for Characterization of Printed Board Assembly Pad Cratering 9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards A-600H: Acceptability of Printed Boards A-610F: Acceptability of Electronics Assembly A-620B: Requirements and Acceptance for Cable and Wire Harness Assemblies C-406: Design & Application Guidelines for Surface Mount Connectors CA-821: General Requirements for Thermally Conductive Adhesives CC-830B: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assembl CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies CM-770E: Component Mounting Guidelines for Printed Boards D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies D-325A: Documentation Requirements for Printed Boards D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Asse D-422: Design Guide for Press Fit Rigid Printed Board Back Planes DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards DR-572A: Drilling Guidelines for Printed Boards FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Pr HDBK-005: Guide to Solder Paste Assessment HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, T J-STD-003C-WAM1: Solderability Tests for Printed Boards J-STD-004B: Requirements for Soldering Fluxes J-STD-005A: Requirements for Soldering Pastes J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices J-STD-026: Semiconductor Design Standard for Flip Chip Applications J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations J-STD-028: Performance Standard for Construction of Flip Chip and Chip Scale Bumps J-STD-030A: Selection and Application of Board Level Underfill Materials J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Device J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes MC-790: Guidelines for Multichip Module Technology Utilization ML-960: Qualification and Performance Specification for Mass Lamination Panels for Multilayer print MS-810: Guidelines for High Volume Microsection QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards S-816: SMT Process Guideline & Checklist SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting SM-784: Guidelines for Chip-on-Board Technology Implementation SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments SM-817A: General Requirements for Dielectric Surface Mount Adhesives SM-840E: Qualification and Performance Specifiation of Permanent Solder Mask and Flexible Cover Mat TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology TR-486: Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress TR-579: Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs TR-583: An In-Depth Look At Ionic Cleanliness Testing WP/TR-584A: IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Prin WP-008: Setting Up Ion Chromatography Capability
FAA-E-2850 - SWITCHGEAR, CONTROL PANEL, CRITICAL POWER CENTERS AND D.C CONTROL POWER EQUIPMENT FOR ARTCC/ACF POWER SYSTEM Organization: FAA
Date: 1988-11-01
Description: This specification establishes the performance, design, manufacture, test, acceptance requirements and delivery to FAA sites of 480 volt three-phase power switchgear lineups, 48 volt DC batteries, chargers and distribution panels for control power, 480-208/120 volt critical power centers (CPCs), power control and monitoring system (PCMS) control panel, auxiliary equipment and accessories for the electrical power system at Air Route Traffic Control Centers (ARTCCs).
ASTM F1844 - STANDARD PRACTICE FOR MEASURING SHEET RESISTANCE OF THIN FILM CONDUCTORS FOR FLAT PANEL DISPLAY MANUFACTURING USING A NONCONTACT EDDY CURRENT GAGE Organization: ASTM
Date: 1997-12-10
Description: This practice describes methods for measuring the sheet electrical resistance of sputtered thin conductive films deposited on large insulating substrates (glass or plastic), used in making flat panel information displays. This practice is intended to be used with Test Methods F673.
ASTM F1711 - STANDARD PRACTICE FOR MEASURING SHEET RESISTANCE OF THIN FILM CONDUCTORS FOR FLAT PANEL DISPLAY MANUFACTURING USING A FOUR-POINT PROBE METHOD Organization: ASTM
Date: 1996-06-10
Description: This practice describes methods for measuring the sheet electrical resistance of sputtered thin conductive films deposited on large insulating substrates, used in making flat panel information displays. It is assumed that the thickness of the conductive thin film is much thinner than the spacing of the contact probes used to measure the sheet resistance.
CSA SPE-1000 - MODEL CODE FOR THE FIELD EVALUATION OF ELECTRICAL EQUIPMENT - FOURTH EDITION Organization: CSA
Date: 2013-05-01
Description: This Model Code does not apply to the field evaluation of a) wire and cable products; b) wiring devices; c) equipment for use in hazardous locations; d) medical electrical equipment and systems; e) components* that will require further evaluation as part of a complete assembly, such as switches, relays, and timers; f) equipment connected to line voltage in excess of 46 kV; g) manlifts, elevators, climb assists and similar systems (other than their associated control panels); and h) any equipment that is not permitted to be field evaluated as directed by an AHJ (such as air-cleaning equipment that intentionally produces ozone).
DSF/FPREN 61010-2-201 - SAFETY REQUIREMENTS FOR ELECTRICAL EQUIPMENT FOR MEASUREMENT, CONTROL AND LABORATORY USE - PART 2-201: PARTICULAR REQUIREMENTS FOR CONTROL EQUIPMENT Organization: DS
Description: This clause of Part 1 is applicable, except as follows. 1.1.1 Equipment included in scope Replacement: This part of IEC 61010 specifies safety requirements and related verification tests for any product performing the function of control equipment and/or their associated peripherals, for example: - Programmable logic controller (PLC) and programmable automation controller (PAC); - Distributed Control Systems (DCS); - remote I/O; - industrial PC (computers) and Panel PC; - Programming and Debugging Tools (PADTs); - Displays and Human-Machine Interfaces (HMI); - positioners, which have as their intended use the control and command of machines, automated manufacturing and industrial processes, e.g. discrete and continuous control.
DSF/FPREN 61010-2-201 - SAFETY REQUIREMENTS FOR ELECTRICAL EQUIPMENT FOR MEASUREMENT, CONTROL AND LABORATORY USE – PART 2-201: PARTICULAR REQUIREMENTS FOR CONTROL EQUIPMENT Organization: DS
Description: This clause of Part 1 is applicable, except as follows. 1.1.1 Equipment included in scope Replacement: This part of IEC 61010 specifies safety requirements and related verification tests for any product performing the function of control equipment and/or their associated peripherals, for example: – Programmable logic controller (PLC) and programmable automation controller (PAC); – Distributed Control Systems (DCS); – remote I/O; – industrial PC (computers) and Panel PC; – Programming and Debugging Tools (PADTs); – Displays and Human-Machine Interfaces (HMI); – positioners, which have as their intended use the control and command of machines, automated manufacturing and industrial processes, e.g. discrete and continuous control.
UL - 61010-2-010 BULLETIN - UL STANDARD FOR SAFETY REQUIREMENTS FOR ELECTRICAL EQUIPMENT FOR MEASUREMENT, CONTROL, AND LABORATORY USE – PART 2-010: PARTICULAR REQUIREMENTS FOR LABORATORY EQUIPMENT FOR THE HEATING OF MATERIALS - COMMENTS DUE: DECEMBER 22, 2014 Organization: UL
Date: 2014-11-07
Description: NOTE All indicating and recording electrical measuring instruments (except those excluded in 1.1.2) fall within the scope of IEC 61010 unless they are panel meters designed only for building-in to other equipment. Built-in panel meters are considered to be components and only need to meet the relevant requirements of IEC 61010, or other standards, as part of the equipment into which they are built.
CEI EN 62382 - ELECTRICAL AND INSTRUMENTATION LOOP CHECK Organization: CEI
Date: 2013-11-01
Description: This standard is applicable for the construction of new plants and for expansion/retrofits (i.e. revamping) of E&I installations in existing plants (including PLC, BAS, DCS, panel-mounted and field instrumentation). It does not include a detailed checkout of power distribution systems, except as they relate to the loops being checked (i.e. a motor starter or a power supply to a four-wire transmitter).
MODUK - DEF STAN 61-12: PART 13 - WIRES, CORDS AND CABLES ELECTRICAL – METRIC UNITS PART 13: WIRES ELECTRICAL (PVC INSULATED NON-SHEATHED CABLES FOR SWITCHGEAR AND CONTROL GEAR WIRING) - ISSUE 4: 01/2010 Organization: MODUK
Date: 2010-01-15
Description: This Defence Standard specifies single core, PVC insulated, non-sheathed cables for Ministry of Defence use in the following applications: a) The wiring of switch, control, metering, relay, and instrument panels of power switchgear. b) For internal connections in rectifier equipment and in motor starters and controllers.
CENELEC - EN 62382 - CONTROL SYSTEMS IN THE PROCESS INDUSTRY - ELECTRICAL AND INSTRUMENTATION LOOP CHECK Organization: CENELEC
Date: 2013-03-01
Description: This standard is applicable for the construction of new plants and for expansion/retrofits (i.e. revamping) of E&I installations in existing plants (including PLC, BAS, DCS, panel-mounted and field instrumentation). It does not include a detailed checkout of power distribution systems, except as they relate to the loops being checked (i.e. a motor starter or a power supply to a four-wire transmitter).
IEC 62382 - CONTROL SYSTEMS IN THE PROCESS INDUSTRY – ELECTRICAL AND INSTRUMENTATION LOOP CHECK - EDITION 2.0 Organization: IEC
Date: 2012-11-01
Description: This standard is applicable for the construction of new plants and for expansion/retrofits (i.e. revamping) of E&I installations in existing plants (including PLC, BAS, DCS, panel-mounted and field instrumentation). It does not include a detailed checkout of power distribution systems, except as they relate to the loops being checked (i.e. a motor starter or a power supply to a four-wire transmitter).
NPFC - MIL-A-82450 - AUTOMATIC PILOT TEST SET (FOR TORPEDO MK 46) Organization: NPFC
Date: 1972-04-25
Description: The test set is a rectangular cabinet containing five test panels and three rack-mounted power supplies. The test set simulates the electrical inputs and outputs of the Automatic Pilot.
GMW15350 - INTERIOR DOOR TRIM ASSEMBLY - STEADY STATE PART MONITORING - ISSUE 3; ENGLISH; GMW RESTRICTED/CONFIDENTIAL STANDARD – TO PURCHASE CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE Organization: GMW
Date: 2016-12-01
Description: Attribute Data is collected to insure Characteristics on Parts/Subassemblies that are established and controlled during the manufacturing process and internal to the Part/Subassembly are within engineering specifications (for example: Instrument Panel Trim Plate to Radio, Overhead Wiring Harness Location). Electrical Functionality.
MANEY - MATERIALS FORESIGHT ON - MATERIALS FORESIGHT ON THE ELECTRONICS INDUSTRY Organization: MANEY
Date: 1998-01-01
Description: A Focus Group of the Foresight Manufacturing, Production and Business Processes Panel has addressed manufacturing trends within the UK electronics industryz and a draft of that report was available during the preparation of this document.
UL 1673 - UL STANDARD FOR SAFETY ELECTRIC SPACE HEATING CABLES - THIRD EDITION; REPRINT WITH REVISIONS THROUGH AND INCLUDING OCTOBER 14, 2011 Organization: UL
Date: 2010-09-13
Description: These requirements do not cover the following: a) Heating cable intended to be installed in a dropped or suspended ceiling; b) Heating cable connected to the supply by use of a flexible cord with attachment plug; c) Heating cable equipment that is movable after installation; d) Heating equipment with integral means of producing air flow; e) Heating equipment manufactured and sold as an integral part of a floor covering materials such as heated floor tiles, heated carpet, and heated laminate floor; f) Heating equipment intended for installation on dry board or plaster, when heating equipment exceeds 2-3/4 W/ft (9 W/m) and/or with adjacent runs intended to be installed less than 1.5 inches (38 mm) on center; g) Constant wattage heating cable intended for installation in concrete or poured masonry floors with heating leads rated greater than 16-1/2 W/ft (54 W/m); and h) Heating panels and panel sets of Article Part IX of the National Electrical Code (NEC), ANSI/NFPA 70; and i) Heating cables for installation directly below floor coverings in accordance with 424.99 of the National Electrical Code (NEC), ANSI/NFPA 70.
SAE T-122 - ENGINEERING PLASTICS AND PLASTIC COMPOSITES IN AUTOMOTIVE APPLICATIONS - TO PURCHASE CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE Organization: SAE
Date: 2009-04-03
Description: Interior components make up the largest use of plastics in automotive vehicles, in applications such as instrument panels (IPs), body panels, door panels, dashmats, seat backs, seat bases, steering wheels, and airbag covers.

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