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IPC - A-610E ROMANIAN CD - ACCEPTABILITY OF ELECTRONIC ASSEMBLIES - TITLE EXTENSION: TO PURCHASE CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE Organization: IPC
Date: 2010-04-01
Description: This document presents acceptance requirements for the manufacture of electrical and electronic assemblies. Historically, electronic assembly standards contained a more comprehensive tutorial addressing principles and techniques.
IPC - A-610F REDLINE - ACCEPTABILITY OF ELECTRONIC ASSEMBLIES - REDLINE COMPARISON E TO F VERSIONS Organization: IPC
Date: 2014-07-01
Description: This document presents acceptance requirements for the manufacture of electrical and electronic assemblies. Historically, electronic assembly standards contained a more comprehensive tutorial addressing principles and techniques.
MODUK - DEF STAN 58-95: PART 1 - ELECTRONIC ASSEMBLIES PART 1: GENERAL REQUIREMENTS - ISSUE 1; 01.76; AMENDMENT 1 Organization: MODUK
Date: 1976-01-14
Description: This INTERIM Defence Standard specifies the general requirements for electronic assemblies for Ministry of Defence use.
IPC - J-STD-001 HUNGARIAN - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES - HUNGARIAN Organization: IPC
Date: 2010-04-01
Description: This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. Historically, electronic assembly (soldering) standards contained a more comprehensive tutorial addressing principles and techniques.
IPC - J-STD-001F REDLINE - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES - REDLINE COMPARISON OF REVISION E TO F Organization: IPC
Date: 2014-07-01
Description: This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. Historically, electronic assembly (soldering) standards contained a more comprehensive tutorial addressing principles and techniques.
ECIA - EIA J-STD-001 - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES Organization: ECIA
Date: 2000-03-01
Description: This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. Historically, electronic assembly (soldering) standards contained a more comprehensive tutorial addressing principles and techniques.
IEC 61192-5 - WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES – PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES - EDITION 1.0 Organization: IEC
Date: 2007-05-01
Description: This part of IEC 61192 provides information and requirements that are applicable to modification, rework and repair procedures for soldered electronic assemblies. It is applicable to specific processes used to manufacture soldered electronic assemblies where components are attached to printed boards and to the relevant parts of resulting products.
DS/EN 61192-5 - WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES Organization: DS
Date: 2007-07-02
Description: This part of IEC 61192 provides information and requirements that are applicable to modification, rework and repair procedures for soldered electronic assemblies. It is applicable to specific processes used to manufacture soldered electronic assemblies where components are attached to printed boards and to the relevant parts of resulting products.
MODUK - DEF STAN 34-4 - FLUXES FOR SOFT SOLDERING ELECTRICAL AND ELECTRONIC ASSEMBLIES Organization: MODUK
Date: 1990-06-01
Description: This INTERIM Standard specifies the requirements for organix-based fluxes for soft soldering operations used in the manufacture of electrical and electronic assemblies.
IPC-D-326 - INFORMATION REQUIREMENTS FOR MANUFACTURING PRINTED BOARDS AND OTHER ELECTRONIC ASSEMBLIES Organization: IPC
Date: 2004-01-01
Description: This document covers the information requirements for the procurement of material, box build, assembly, system integration, inspection, test, burn-in, and delivery and/or distribution of electronic assemblies.PurposeThe purpose of this document is to outline an effective method of transferring product assembly information intercompany or from OEM to the assembler.
DS/EN 61192-1 - WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL Organization: DS
Date: 2003-05-23
Description: This part of IEC 61192 specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates.
NASA-LLIS-0768 - LESSONS LEARNED – THERMAL DESIGN PRACTICES FOR ELECTRONIC ASSEMBLIES Organization: NASA
Date: 2000-04-06
Description: Practice: Insure that thermal design practices for electronic assemblies will meet the requirements of the combined ground and flight environmental conditions defined by the spacecraft mission.
NASA-STD-8739.1 - WORKMANSHIP STANDARD FOR POLYMERIC APPLICATION ON ELECTRONIC ASSEMBLIES Organization: NASA
Date: 2016-06-30
Description: This standard prescribes NASA’s technical and quality assurance requirements for polymeric applications for electrical and electronic assemblies. Purpose This publication sets forth requirements for staking, conformal coating, bonding, and encapsulation of components used in electronic hardware.
IPC-HDBK-4691 - HANDBOOK ON ADHESIVE BONDING IN ELECTRONIC ASSEMBLY OPERATIONS Organization: IPC
Date: 2015-11-01
Description: The purpose of this handbook is to assist individuals who must either make choices regarding adhesive bonding or who must work in adhesive bonding operations and also to provide guidelines for the design, selection and application of adhesive bonding as it pertains to electronic assembly only.
IPC - TM-650 2.6.9.1 - TEST TO DETERMINE SENSITIVITY OF ELECTRONIC ASSEMBLIES TO ULTRASONIC ENERGY Organization: IPC
Date: 1995-01-01
Description: The purpose of this test method is to provide a consistent procedure to test the sensitivity of electronic components to ultrasonic energy. There has been a reluctance in the electronics industry to use ultrasonic energy for printed board assemblies cleaning because of the possibility of damage to wire bonds in active, hermetically sealed components or other damage that might cause latent failures.
IPC-7721 - REPAIR AND MODIFICATION OF PRINTED BOARDS AND ELECTRONIC ASSEMBLIES - CHANGE 1: 3/2000; CHANGE 2: 4/2001 INCORPORATED Organization: IPC
Date: 1998-02-01
Description: Purpose This document prescribes the procedural requirements, tools and materials and methods to be used in the modification, rework, repair, overhaul or restoration of electronic products. Although this document is based in large part on the Product Class Definitions of ANSI/J-STDO0 1, this document should be considered applicable to any type of electronic equipment.
IPC - J-STD-001DS ADD - SPACE APPLICATIONS ELECTRONIC HARDWARE ADDENDUM TO J-STD-001D REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES Organization: IPC
Date: 2006-11-01
Description: This addendum provides additional requirements over those published in IPC J-STD-001D to ensure the reliability of soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space.
DS/EN 61192-2 - WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 2: SURFACE-MOUNT ASSEMBLIES Organization: DS
Date: 2003-06-06
Description: This part of IEC 61192 specifies requirments for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of organic substrates.
IEC 61192-2 - WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES PART 2: SURFACE-MOUNT ASSEMBLIES - EDITION 1.0 Organization: IEC
Date: 2003-03-01
Description: This part of IEC 61192 specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.
MODUK - DEF STAN 58-95: 90/031 - ELECTRONIC ASSEMBLY/AMPLIFIER ASSEMBLY - ISSUE 2 (03.86); AMENDMENT 1; CORRIGENDUM Organization: MODUK
Date: 1986-03-01

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