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IPC - J-STD-006 JAPANESE - REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS Organization: IPC
Date: 2006-01-01
Description: This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for “special” electronic grade solders. This is a quality control standard and is not intended to relate directly to the material’s performance in the manufacturing process.
IPC - J-STD-006 - REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS Organization: IPC
Date: 2013-07-01
Description: This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, wire, and powder solders, for electronic soldering applications; and for ‘‘special form'' (see 1.2.3) electronic grade solders.
DS/EN 61190-1-3/A1 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS Organization: DS
Date: 2010-09-29
Description: This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2.
DSF/EN 61190-1-3/FPRA1 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY -- PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS Organization: DS
Description: This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2.
DSF/FPREN 61190-1-3 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS Organization: DS
Description: This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2.
CENELEC - EN 61190-1-3 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS - INCORPORATES AMENDMENT A1: 2010 Organization: CENELEC
Date: 2007-06-01
Description: This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2.
DS/EN 61190-1-3 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS Organization: DS
Date: 2007-07-02
Description: This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2.
IEC 61190-1-3 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY – PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NONFLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS - EDITION 2.1 CONSOLIDATED REPRINT Organization: IEC
Date: 2010-11-01
Description: This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2.
DS/EN 61192-5 - WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES Organization: DS
Date: 2007-07-02
Description: This part of IEC 61192 provides information and requirements that are applicable to modification, rework and repair procedures for soldered electronic assemblies. It is applicable to specific processes used to manufacture soldered electronic assemblies where components are attached to printed boards and to the relevant parts of resulting products.
IEC 61192-5 - WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES – PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES - EDITION 1.0 Organization: IEC
Date: 2007-05-01
Description: This part of IEC 61192 provides information and requirements that are applicable to modification, rework and repair procedures for soldered electronic assemblies. It is applicable to specific processes used to manufacture soldered electronic assemblies where components are attached to printed boards and to the relevant parts of resulting products.
IPC-S-815 - GENERAL REQUIREMENTS FOR SOLDERING ELECTRONIC INTERCONNECTIONS Organization: IPC
Date: 1987-12-01
Description: This standard prescribes general requirements for highquality soldering of electronic interconnections. (Processes are restricted to those soldering alloys having liquidus temperatures below 427°C [800°F].)
ARMY - QPL-QQ-S-571-111 - SOLDER, ELECTRONIC (96 TO 485 DEG.C) Organization: ARMY
Date: 1995-06-14
Description: FEDERAL QUALIFIED PRODUCTS LIST OF PRODUCTS QUALIFIED UNDER FEDERAL SPECIFICATION QQ-S-571 SOLDER, ELECTRONIC (96 to 485° c) This list has been prepare for use by or for the Government in the acquisition of products covered by Federal Specification QQ-S-571.
IPC - SF-818 - GENERAL REQUIREMENTS FOR ELECTRONIC SOLDERING FLUXES Organization: IPC
Date: 1988-02-01
IPC-SF-818 - GENERAL REQUIREMENTS FOR ELECTRONIC SOLDERING FLUX Organization: IPC
DS/EN 61192-1 - WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL Organization: DS
Date: 2003-05-23
Description: This part of IEC 61192 specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates.
IPC - J-STD-001 HUNGARIAN - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES - HUNGARIAN Organization: IPC
Date: 2010-04-01
Description: This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. Historically, electronic assembly (soldering) standards contained a more comprehensive tutorial addressing principles and techniques.
IPC - J-STD-001F REDLINE - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES - REDLINE COMPARISON OF REVISION E TO F Organization: IPC
Date: 2014-07-01
Description: This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. Historically, electronic assembly (soldering) standards contained a more comprehensive tutorial addressing principles and techniques.
ECIA - EIA J-STD-001 - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES Organization: ECIA
Date: 2000-03-01
Description: This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. Historically, electronic assembly (soldering) standards contained a more comprehensive tutorial addressing principles and techniques.
DS/EN 61192-2 - WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 2: SURFACE-MOUNT ASSEMBLIES Organization: DS
Date: 2003-06-06
Description: This part of IEC 61192 specifies requirments for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of organic substrates.
IEC 61192-2 - WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES PART 2: SURFACE-MOUNT ASSEMBLIES - EDITION 1.0 Organization: IEC
Date: 2003-03-01
Description: This part of IEC 61192 specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.

1 - 20 of 587 results