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This Standard outlines the solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface...
This Standard outlines test Te (Solderability testing of printed board) and test Tc [Solderability testing by balancing method, with assessment based on quantitative assessment criteria (wetting time and wettability)], the solder bath wetting balance method and the...
This part of IEC 60068 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes. NOTE...
This part of IEC 60068 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes. NOTE...
This part of IEC 60068 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes. NOTE...
This part of 60068 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For...
This part of IEC 60068 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For...
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute...
This part of IEC 60068 outlines test Te, solder bath wetting balance method and solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. IEC 60068-2-54 has now been integrated into this latest Standard Revision. The procedures...
IEC 60068-2-69:2017 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute...
IEC 60068-2-69:2017 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute...
IEC 60068-3-13:2016 provides background information and guidance for writers and users of specifications for electric and electronic components, containing references to the test standards IEC 60068-2-20, IEC 60068-2-58, IEC 60068-2-69, IEC 60068-2-83, and to IEC 61760-1, which defines...
Provides background information and recommendations for writers of specifications containing references to standards relating to soldering and solderability.
The standard describes the procedures of solderability tests applicable to wire and tag terminations (Ta) or to printed wiring boards (Tc), describes tests for resistance to soldering heat, applicable to components (Tb).
Tests of the solderability of wire and tag terminations, printed boards and metal-clad laminates; and a test of the ability of components to withstand heating stresses produced by soldering.
This part of IEC 60068, which is a technical report, presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. This process covers a great variety of electronic products, including a large range...
This part of IEC 60068 serves as a Technical Report and presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. This process covers a great variety of electronic products, including a large...
