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ECIA - EIA CB 12 - GOLD PLATING STUDY TEST REPORT Organization: ECIA
Date: 1990-01-01
Description: The purpose of this study is to evaluate the performance characteristics of gold plating thicknesses when exposed to a severe series of environmental sequences. phenomenon which could potentially cause contact interface degradation.
IPC - TM-650 2.3.24 - POROSITY OF GOLD PLATING (CHEMICAL METHOD) Organization: IPC
Date: 1978-02-01
Description: This test method provides procedures to determine the porosity of gold plating on both copper and nickel surfaces by chemical means.
SAE AMS2422 - PLATING, GOLD Organization: SAE
Date: 2014-02-01
Description: Form This specification covers the requirements for electrodeposited gold plate. Application This plating has been used typically to improve the solderability, electrical conductivity, corrosion resistance, performance, and appearance of electronic and electrical parts, but usage is not limited to such applications.
MODUK - DTD-938 - GOLD PLATING Organization: MODUK
NPFC - MIL-G-45204 - GOLD PLATING, ELECTRODEPOSITED Organization: NPFC
NPFC - MIL-G-14548 - GOLD PLATING (ELECTRODEPOSITED) Organization: NPFC
Date: 1959-11-03
NAVY - MIL-G-19788 CANC NOTICE 1 - GOLD PLATING (ELECTRODEPOSITED) Organization: NAVY
Date: 1977-12-08
NPFC - MIL-DTL-45204 - GOLD PLATING, ELECTRODEPOSITED Organization: NPFC
SEMI G8 - TEST METHOD FOR GOLD PLATING Organization: SEMI
SAE AMS2425 - PLATING, GOLD FOR THERMAL CONTROL Organization: SAE
Date: 2012-12-01
Description: Purpose This specification covers the requirements for gold deposited on metal surfaces and the properties of the deposit.
IPC-4552 GERMAN - SPECIFICATION FOR ELECTROLESS NICKEL/IMMERSION GOLD (ENIG) PLATING FOR PRINTED CIRCUIT BOARDS Organization: IPC
Date: 2002-10-01
Description: This specification sets the requirements for the use of Electroless Nickel/Immersion Gold (ENIG) as a surface finish for printed circuit boards.
IPC-4552 CD - SPECIFICATION FOR ELECTROLESS NICKEL/IMMERSION GOLD (ENIG) PLATING FOR PRINTED CIRCUIT BOARDS - INCORPORATES AMENDMENTS 1 & 2; ON CD-ROM - TO PURCHASE PLEASE CONTACT IHS CUSTOMER CARE AT +1 800 IHS-CARE (+1 800 447-2273) OR VISIT WWW.IHS.COM/CUSTOMERCARE Organization: IPC
Date: 2012-12-01
IPC-4552 GERMAN CD - SPECIFICATION FOR ELECTROLESS NICKEL/IMMERSION GOLD (ENIG) PLATING FOR PRINTED CIRCUIT BOARDS - TO PURCHASE CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE Organization: IPC
Date: 2002-10-01
IPC-4556 CD - SPECIFICATION FOR ELECTROLESS NICKEL/ELECTROLESS PALLADIUM/IMMERSION GOLD (ENEPIG) PLATING FOR PRINTED CIRCUIT BOARDS - ON CD-ROM - TO PURCHASE PLEASE CONTACT IHS CUSTOMER CARE AT +1 800 IHS-CARE (+1 800 447-2273) OR VISIT WWW.IHS.COM/CUSTOMERCARE Organization: IPC
Date: 2013-01-01
IPC-4552 - PERFORMANCE SPECIFICATION FOR ELECTROLESS NICKEL/IMMERSION GOLD (ENIG) PLATING FOR PRINTED BOARDS Organization: IPC
IPC-4556 - SPECIFICATION FOR ELECTROLESS NICKEL/ELECTROLESS PALLADIUM/IMMERSION GOLD (ENEPIG) PLATING FOR PRINTED CIRCUIT BOARDS Organization: IPC
IECQ - QC 010000/ IN0001 IS 1 - TWO PART CONNECTORS FOR PRINTED CIRCUIT BOARDS FOR BASIC GRID OF 2,54MM (0.1 INCH) WITH COMMON MOUNTING EURO CONNECTORS STYLE R, R/2 & HE11 (CONNECTORS CONFORMING TO 500 MATING CYCLES AND HAVING 1.27 MICRON GOLD PLATING FINISH OVER CONTACT AREA) Organization: IECQ
Date: 1992-01-01
MODUK - DEF STAN 03-17 - ELECTRO-DEPOSITION OF GOLD - ISSUE 3: 04/2007 Organization: MODUK
Date: 2007-04-30
Description: b) Provide a solderable surface. This Standard does not cover the gold plating of threaded items.
SAE AMS03-17 - ELECTRO-DEPOSITION OF GOLD Organization: SAE
Date: 2015-04-01
Description: Provide a solderable surface. This Standard does not cover the gold plating of threaded items.
ECIA - EIA CB 13 - X-RAY FLUORESCENCE FOR MEASURING PLATING THICKNESS Organization: ECIA
Date: 1990-01-01
Description: All have peculiar application and also limitations, Basic economics, however, demands that for measuring gold thicknesses in the commonly used plating thickness ranges, a system must be highly reliable, accurate, repeatable and fast.

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