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DLA - MIL-PRF-47009D - COMPOUND, SILICONE, HEAT SINK Organization: DLA
Date: 2006-11-09
Description: This specification covers four types of one-part ready-to-use silicone heat sink compound.
DOD - DESC-DWG-84002 - HEAT SINKS FOR SEMICONDUCTOR DEVICES Organization: DOD
Date: 1984-04-03
Description: This drawing describes the requirement for a family of extruded aluminum heat sinks. The complete part number shall be as shown in the following example: 84002 -01 Drawing number Dash number
SAE AIR1957 - (R) HEAT SINKS FOR AIRBORNE VEHICLES Organization: SAE
Date: 2015-11-01
Description: The document also discusses approaches to control the use of heat sinks and techniques for analysis and verification of heat sink management. The heat sinks are for aircraft operating at subsonic and supersonic speeds
ARMY - A-A-56022 - COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE Organization: ARMY
Date: 1992-10-19
Description: This commercial item description covers a silicone and/or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink seal and improve thermal conductivity at heat sink junctions.
ANS 2.21 - CRITERIA FOR ASSESSING ATMOSPHERIC EFFECTS ON THE ULTIMATE HEAT SINK Organization: ANS
Date: 2012-01-01
Description: This standard does not apply to designs that do not rely on external water sources as the ultimate heat sink or to nonmeteorological elements of ultimate heat sink design.
DOD - DESC-DWG-85136 - HEAT SINKS, ELECTRICAL-ELECTRONIC COMPONENT, FIN STOCK, ALUMINUM ALLOY Organization: DOD
Date: 2010-02-23
Description: This drawing describes the requirements for a family of aluminum alloy fin stock heat sinks for use with electronic components. Devices conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for OEM application.
SAE/TP - 2008-01-2165 - TESTING OF AN R134A SPRAY EVAPORATIVE HEAT SINK Organization: SAE/TP
Date: 2008-06-29
Description: The NASA Glenn Research Center has been developing a spacecraft open loop spray evaporative heat sink for use in pressure environments near sea-level, where evaporative cooling of water is not effective.
SAE/TP - 2008-01-2928 - HEAT TRANSFER PERFORMANCE OF A DUAL LATENT HEAT SINK FOR PULSED HEAT LOADS Organization: SAE/TP
Date: 2008-11-11
Description: This paper presents the concept of a dual latent heat sink for thermal management of pulse heat generating electronic systems.
NPFC - MIL-PRF-47009 - COMPOUND, SILICONE, HEAT SINK Organization: NPFC
NPFC - MIL-C-47009 - COMPOUND, SILICONE, HEAT SINK Organization: NPFC
NPFC - MIL-H-87111 - HEAT SINK, SEMICONDUCTOR DEVICES Organization: NPFC
SAC - GB/T 7423.3-87 - HEAT SINK OF SEMICONDUCTOR DEVICES--HEAT SINK, STAGGERED FINGERS SHAPES Organization: SAC
Date: 1987-03-16
SAC - GB/T 7423.2-87 - HEAT SINK OF SEMICONDUCTOR DEVICES--HEAT SINK, EXTRUDED SHAPES Organization: SAC
Date: 1987-03-16
ASHRAE ST-16-017 - PERFORMANCE ANALYSIS OF A GROUND-SOURCE HEAT PUMP SYSTEM USING MINE WATER AS HEAT SINK AND SOURCE Organization: ASHRAE
Date: 2016-01-01
Description: This paper summarizes a case study of an innovative ground-source heat pump (GSHP) system that uses flooded mines as a heat source and heat sink. This GSHP system provides space conditioning to an existing 56,000 ft2 (5203m2) research facility, in conjunction with existing space heating and space cooling systems.
AIA/NAS - NAS4117 - HEAT SINK, INSULATOR, WAFER TYPE - REV 1 Organization: AIA/NAS
Date: 2012-08-31
SAE/TP - 2006-01-2216 - PRELIMINARY TRADE STUDY OF EVAPORATIVE HEAT SINKS Organization: SAE/TP
Date: 2006-07-17
Description: For short durations, evaporative heat rejection systems are a very effective way of removing heat from spacecraft. Future NASA vehicles, such as the Crew Exploration Vehicle (CEV), will require non-radiative heat rejection systems during at least a portion of the planned mission, just as their predecessors have.
SAC - GB/T 8446.1-87 - HEAT SINK FOR POWER SEMICONDUCTOR DEVICE Organization: SAC
Date: 1987-12-19
SAC - GB/T 7423.1-87 - HEAT SINK OF SEMICONDUCTOR DEVICES--GENERIC SPECIFICATION Organization: SAC
Date: 1987-03-16
ARMY - DOD-STD-35 -115 CANC NOTICE 4 - HEAT SINKS AUTOMATED ENGINEERING DOCUMENT PREPARATION SYSTEM Organization: ARMY
Date: 2005-07-20
NPFC - DOD-STD-35-115 - HEAT SINKS, AUTOMATED ENGINEERING DOCUMENT PREPARATION SYSTEM Organization: NPFC

1 - 20 of 179 results