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ASTM C551 - STANDARD SPECIFICATION FOR ASBESTOS-CEMENT FIBERBOARD INSULATING PANELS Organization: ASTM
Date: 2007-11-01
Description: This specification covers asbestos-cement insulating panels consisting of a core of insulating fiber board sandwiched between, and bonded to, two sheets of asbestos-cement facing board.
ASTM C551/C551M - STANDARD SPECIFICATION FOR ASBESTOS-CEMENT FIBERBOARD INSULATING PANELS Organization: ASTM
Date: 2007-11-01
Description: This specification covers asbestos-cement insulating panels consisting of a core of insulating fiber board sandwiched between, and bonded to, two sheets of asbestos-cement facing board.
ASTM C659 - STANDARD SPECIFICATION FOR ASBESTOS-CEMENT ORGANIC-FOAM CORE INSULATING PANELS Organization: ASTM
Date: 1990-10-26
Description: This specification covers asbestos-cement plastic-foam core panels consisting of a core of insulating cellular plastic sandwiched between and bonded to two sheets of asbestoscement facing board.
ASTM E1803 - STANDARD TEST METHODS FOR DETERMINING STRENGTH CAPACITIES OF STRUCTURAL INSULATED PANELS Organization: ASTM
Date: 2014-03-01
Description: These test methods cover procedures for determining strength properties under specified loads for rigid-faced structural insulated panels. These test methods are appropriate for structural insulated panels with rigid facings having a minimum thickness of 0.16 in. (4 mm) and an insulating core with a minimum thickness of 1.5 in. (38 mm).
ULC CAN-S138 - STANDARD METHOD OF TEST FOR FIRE GROWTH OF INSULATED BUILDING PANELS IN A FULL-SCALE ROOM CONFIGURATION - FIRST EDITION Organization: ULC
Date: 2006-05-01
Description: This document describes the test method used to determine the contribution to fire growth provided by a non-loadbearing insulated building panel installed in a sprinklered or unsprinklered room configuration (see Appendix A).
FMAPPROVAL 4880 - CLASS 1 FIRE RATING OF INSULATED WALL OR WALL AND ROOF/CEILING PANELS, INTERIOR FINISH MATERIALS OR COATINGS, AND EXTERIOR WALL SYSTEMS Organization: FM
Date: 2010-05-01
Description: This standard sets the fire performance requirements for Class 1 fire rated insulated wall or wall and roof/ceiling panels, interior finish materials or coatings and exterior wall systems in wall or wall and roof/ceiling constructions installed to maximum heights of 30 or 50 ft (9.1 or 15.2 m) or without height restriction when exposed to an ignition source simulating a building fire.
MODUK - DEF STAN 61-12: PART 13 - WIRES, CORDS AND CABLES ELECTRICAL – METRIC UNITS PART 13: WIRES ELECTRICAL (PVC INSULATED NON-SHEATHED CABLES FOR SWITCHGEAR AND CONTROL GEAR WIRING) - ISSUE 4: 01/2010 Organization: MODUK
Date: 2010-01-15
Description: This Defence Standard specifies single core, PVC insulated, non-sheathed cables for Ministry of Defence use in the following applications: a) The wiring of switch, control, metering, relay, and instrument panels of power switchgear. b) For internal connections in rectifier equipment and in motor starters and controllers.
ASTM C1146 - STANDARD GUIDE FOR PREFABRICATED PANEL AND H–BAR INSULATION SYSTEMS FOR VESSELS, DUCTS AND EQUIPMENT OPERATING AT TEMPERATURES ABOVE AMBIENT AIR Organization: ASTM
Date: 2009-06-01
Description: Typical applications include, but are not limited to, air and gas ducts, steam generating units, air quality control systems, fans, storage tanks, process vessels, and coke drums The insulation described herein is limited to systems consisting of insulating units specially designed to fit the surfaces to be insulated, and engineered for the service and environmental requirements.
MODUK - DEF STAN 59-47 - CONFORMAL COATINGS FOR PANELS, PRINTED CIRCUIT AND PANELS, ELECTRONIC CIRCUIT - ISSUE 4; 04.91 Organization: MODUK
Date: 1991-04-26
Description: The material covered by this Defence Standard is a thin transparent continuous contour coating applied to printed circuit assemblies to provide an electrical insulating protective barrier against deleterious environmental conditions.
PIP ELSHT01 - SELF-REGULATED ELECTRIC HEAT TRACE SYSTEM SPECIFICATION Organization: PIP
Date: 2017-01-01
Description: This Practice includes requirements for heat trace cable, monitor-control panel, junction boxes, and temperature sensors. The following are not included in this Practice: a.
NFRC 100 - PROCEDURE FOR DETERMINING FENESTRATION PRODUCT U-FACTORS Organization: NFRC
Date: 2014-01-01
Description: Products of all glazing materials, tints, and types, including (but not limited to) clear glass, tinted glass, stained glass, fritted glazing, etched glazing, sandblasted glazing, glass block, thin plastic films (internally suspended, internally applied, or externally applied), rigid plastics, and translucent fiberglass with or without any solar control, low-E, or any other partially transparent coating, and products with manufactured decorative opaque insulated glazing panels, designed for interchangeability with other glazing options; D.
DS/ISO 3008 - FIRE RESISTANCE TESTS - DOOR AND SHUTTER ASSEMBLIES Organization: DS
Description: This International Standard specifies a method for determining the fire resistance of door and shutterassemblies designed primarily for installation within openings incorporated in vertical separating elements,such as:. hinged and pivoted doors. horizontally sliding and vertically sliding doors including articulated sliding doors, sectional doors. steel single skin folding shutters (un-insulated). other sliding folding doors. tilting doors. lift landing/elevator doors. rolling shutter doors. removable panels in wallsThis International Standard is used in conjunction with ISO 834-1.
NECA NEIS 202 - STANDARD FOR INSTALLING AND MAINTAINING INDUSTRIAL HEAT TRACING SYSTEMS Organization: NECA
Date: 2013-01-01
Description: System components used with these types of heat tracing cables included power transformers, control panels, temperature sensors, temperature controllers, contactors, circuit breakers, enclosures, conduit, wire, and all necessary auxiliary equipment and controls.
ASTM F2675/F2675M - STANDARD TEST METHOD FOR DETERMINING ARC RATINGS OF HAND PROTECTIVE PRODUCTS DEVELOPED AND USED FOR ELECTRICAL ARC FLASH PROTECTION Organization: ASTM
Date: 2013-06-01
Description: Materials for hand protective products, which are not normally produced in flat panels or which display shrinkage making the material unacceptable to test on panels, shall be tested using this standard.
IPC-C-1000 - IPC ESSENTIAL DOCUMENT COLLECTION FOR BOARD DESIGN, ASSEMBLY AND MANUFACTURE - TO PURCHASE HARDCOPY COMPILATION, CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE. STANDARDS FROM THIS COMPILATION ARE AVAILABLE AS INDIVIDUAL DOCUMENTS IN IHS STANDARDS EXPERT. SEE DETAILS FOR ADDITIONAL INFORMATION. Organization: IPC
Date: 2008-06-01
Description: 1071A: Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing 1601: Printed Board Handling and Storage Guidelines 2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards 2152: Standard for Determining Current Carrying Capacity in Printed Board Design 2221B: Generic Standard on Printed Board Design 2222A: Sectional Design Standard for Rigid Organic Printed Boards 2223C: Sectional Design Standard for Flexible Printed Boards 2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies 2226: Sectional Design Standard for High Density Interconnect (HDI) Boards 2251: Design Guide for the Packaging of High Speed Electronic Circuits 2252: Design Guide for RF/Microwave Circuit Boards 2316: Design Guide for Embedded Passive Device Printed Boards 2611: Generic Requirements for Electronic Product Documentation 2612: Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descript 2612-1: Sectional Requirements for Electronic Diagramming Symbol Generation Methodology 2614: Sectional Requirements for Board Fabrication Documentation 2615: Printed Board Dimensions and Tolerances 3406: Guidelines for Electrically Conductive Surface Mount Adhesives 3408: General Requirements for Anisotropically Conductive Adhesives Films 4101D: Specification for Base Materials for Rigid and Multilayer Printed Boards 4103A-WAM1: Specification for Base Materials for High Speed/High Frequency Applications 4104: Specification for High Density Interconnect (HDI) and Microvia Materials 4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boar 4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications 4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat 4202A: Flexible Base Dielectrics for Use in Flexible Printed Circuitry 4203A: Cover and Bonding Material for Flexible Printed Circuitry 4204A-WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry 4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement 4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards 4552-WAM1-2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit 4553A: Specification for Immersion Silver Plating for Printed Boards 4554: Specification for Immersion Tin Plating for Printed Circuit Boards 4556: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating fo 4562A: Metal Foil for Printed Board Applications 4563: Resin Coated Copper Foil for Printed Boards Guideline 4761: Design Guide for Protection of Printed Board Via Structures 4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend 4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed 4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printe 5701: Users Guide for Cleanliness of Unpopulated Printed Boards 5702: Guidelines for OEMs in Determining Accept Levels of Cleanliness of Unpopulated Printed Boards 5704: Cleanliness Requirements for Unpopulated Printed Boards 6011: Generic Performance Specification for Printed Boards 6012C: Qualification and Performance Specification for Rigid Printed Boards 6013C: Qualification and Performance Specification for Flexible Printed Boards 6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive De 6018B: Qualification and Performance Specification for High Frequency (Microwave) Printed Boards 7092: Design and Assembly Process Implementation for Embedded Components 7093: Design and Assembly Process Implementation for Bottom Termination Components 7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components 7095C: Design and Assembly Process Implementation for BGAs 7351B: Generic Requirements for Surface Mount Design and Land Pattern Standard 7526: Stencil and Misprinted Board Cleaning Handbook - FREE DOWNLOAD 7801: Reflow Oven Process Control Standard 9201A: Surface Insulation Resistance Handbook 9202: Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemic 9203: Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle 9252A: Requirements for Electrical Testing of Unpopulated Printed Boards 9641: High Temperature Printed Board Flatness Guideline 9691A: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Te 9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments 9702: IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects 9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability 9704A: Printed Circuit Assembly Strain Gage Test Guideline 9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder 9707: Spherical Bend Test Method for Characterization of Board Level Interconnects 9708: Test Methods for Characterization of Printed Board Assembly Pad Cratering 9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards A-600H: Acceptability of Printed Boards A-610F: Acceptability of Electronics Assembly A-620B: Requirements and Acceptance for Cable and Wire Harness Assemblies C-406: Design & Application Guidelines for Surface Mount Connectors CA-821: General Requirements for Thermally Conductive Adhesives CC-830B: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assembl CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies CM-770E: Component Mounting Guidelines for Printed Boards D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies D-325A: Documentation Requirements for Printed Boards D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Asse D-422: Design Guide for Press Fit Rigid Printed Board Back Planes DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards DR-572A: Drilling Guidelines for Printed Boards FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Pr HDBK-005: Guide to Solder Paste Assessment HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, T J-STD-003C-WAM1: Solderability Tests for Printed Boards J-STD-004B: Requirements for Soldering Fluxes J-STD-005A: Requirements for Soldering Pastes J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices J-STD-026: Semiconductor Design Standard for Flip Chip Applications J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations J-STD-028: Performance Standard for Construction of Flip Chip and Chip Scale Bumps J-STD-030A: Selection and Application of Board Level Underfill Materials J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Device J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes MC-790: Guidelines for Multichip Module Technology Utilization ML-960: Qualification and Performance Specification for Mass Lamination Panels for Multilayer print MS-810: Guidelines for High Volume Microsection QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards S-816: SMT Process Guideline & Checklist SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting SM-784: Guidelines for Chip-on-Board Technology Implementation SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments SM-817A: General Requirements for Dielectric Surface Mount Adhesives SM-840E: Qualification and Performance Specifiation of Permanent Solder Mask and Flexible Cover Mat TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology TR-486: Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress TR-579: Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs TR-583: An In-Depth Look At Ionic Cleanliness Testing WP/TR-584A: IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Prin WP-008: Setting Up Ion Chromatography Capability
IPC-7351 - GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD - INCLUDES CD-ROM; SUBSCRIPTION CUSTOMERS CAN OBTAIN ONE COMPLIMENTARY COPY FROM IHS BY CONTACTING IHS CUSTOMER CARE AT +1 800 IHS-CARE (+1 800 447-2273) OR VISIT WWW.IHS.COM/CUSTOMERCARE; INCLUDES ACCESS TO ADDITIONAL CONTENT Organization: IPC
Date: 2010-06-01
Description: *Base Material – The insulating material upon which a conductive pattern may be formed.

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