Find the standard you are looking for at Engineering360. Documents are available for purchase from the IHS Standards Store.

1 - 7 of 7 results

IPC - IPC-HDBK-005 - GUIDE TO SOLDER PASTE ASSESSMENT Organization: IPC
Date: 2006-01-01
Description: The solder paste selected and the assembly process used will need to form solder connections that meet the requirements of industry standards such as J-STD-001 and/or IPC-A-610.
ECIA - EIA J-STD-001 - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES Organization: ECIA
Date: 2000-03-01
Description: When IPC/EIA J-STD-001 is cited or required by contract, the requirements of IPC-A-610 do not apply unless separately or specifically required. When IPC-A-610 is cited along with IPC/EIA J-STD-001, the order of precedence is to be defined in the procurement documents.
IPC - J-STD-001 HUNGARIAN - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES - HUNGARIAN Organization: IPC
Date: 2010-04-01
Description: For a more complete understanding of this document's recommendations and requirements, one may use this document in conjunction with IPC-HDBK-001, IPC-A-610 and IPC-HDBK-610. Purpose This standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies.
IPC - J-STD-001F REDLINE - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES - REDLINE COMPARISON OF REVISION E TO F Organization: IPC
Date: 2014-07-01
Description: For a more complete understanding of this document’s recommendations and requirements, one may use this document in conjunction with IPC-HDBK-001 and IPC-A-610. Purpose This standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies.
DS/EN 61191-2 - PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES Organization: DS
Date: 2013-10-09
Description: This edition includes the following significant technical changes with respect to the previous edition: - IPC-A-610 on workmanship has been included as a normative reference; - some of the terminology used in the document has been updated; - references to IEC standards have been corrected; - the use of lead-free solder paste and plating are addressed.
DS/EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES Organization: DS
Date: 2013-09-30
Description: This edition includes the following significant technical changes with respect to the previous edition: - reference standard IEC 61192-1 has been replaced by IPC-A-610; - some of the terminology has been updated; - references to IEC standards have been corrected; - the use of lead-free alloys in the assembly have been added.
IPC - J-STD-001 ITALIAN - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES Organization: IPC
Date: 2005-02-01
Description: Per una più esauriente comprensione delle raccomandazioni e dei requisiti contenuti in questo documento si può utilizzare anche l' IPC-HDBK-001, IPC-A-610 e IPC-HDBK-610. Quando lo J-STD-001 viene citato o richiesto per contratto i requisiti contenuti in IPC-A-610 non vengono applicati, a meno che non venga specificato e richiesto separatamente.

1 - 7 of 7 results