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This document describes manufacturing solder process limits that components subjected to IPC-9501, IPC-9503, IPC-9504 and J-STD-020 would survive. It does not include optimum conditions for assembly, but rather guides to assure components are not damaged. This document...
INTRODUCTION What does good solderability mean? Solderability has been defined to varying levels of detail depending on the observer's immediate perspective. The fundamental definition from which they develop, however, s that good solderability means the ability of a base...
FOREWORD The material published in this document is a compilation of contributions from members of several comnittees coordinated by the Soldering Solderability Specification Task Group. The objective of this document is to provide a checklist of causes and recommended corrective...
This Addendum provides requirements to be used in addition to, and in some cases, in place of, those published in J-STD-001G to ensure the reliability of soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments in space and military...
This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a material quality control document and is not intended to relate directly to the material's performance in the...
"An Introduction to Soldering" By R.J. Klein Wassink, Phillips Center for Manufacturing Technology, Eindoven, The Netherlands This article reviews various aspects of soldering as they relate to printed wiring assemblies. It describes soldering for electronic boards and...
This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. This standard may be used for quality control and procurement purposes. Purpose The purpose of this standard is to classify and characterize tin/lead...
Introduction At a meeting in February of 1989, the Institute for Interconnecting and Packaging Electronics Circuits (IPC) and the Electronic Industries Association (EIA) agreed to co-author a joint solderability test method. At subsequent joint meetings, many of the test method...
Purpose The purpose of this handbook is to provide additional supporting information for IPC-SM-840 regarding solder mask types, processes, characteristics and properties in order to assist with the correct selection and use of the most appropriate material for the intended...
INTRODUCTION This document is intended to serve as a user's guide for the manipulation of data contained in spreadsheet format that supports the concepts and methodology for developing surface mount land patterns that are identified in IPC-SM-782, "Surface Mount Design and Land Pattern...
IPC-C-1000 is a hardcopy compilation of IPC documents that includes all of the C-10X segment collections, plus selected additional documents. Documents were reviewed and recommended for inclusion by IPC's technical staff. These IPC documents can be viewed individually through...
This standard is a collection of visual quality acceptability criteria for solder paste printing. Purpose The purpose of this guideline document is to support the user in the visual evaluation of the solder paste printing process, which makes subsequent process optimizing possible....
Contains information related to soldering processes, and solder joint performance and reliability. Covers soldering fundamentals, technology, materials, substrate materials, fluxes, pastes, assembly processes, inspection, and environment. Covers today's advanced joining...
This standard prescribes general requirements for highquality soldering of electronic interconnections. (Processes are restricted to those soldering alloys having liquidus temperatures below 427°C [800°F].) Purpose. This standard defmes the approved materials, methods, and inspection...
