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SAE USCAR-40 - LEAD-FREE SOLDER VALIDATION TEST PLAN Organization: SAE
Date: 2011-04-01
Description: This guideline is applicable to existing lead solder production products that will change to lead-free solder processes to meet the ELV Directive 2000/53/EC Annex II, exemption 8B requirements.
WILEY - LEAD-FREE SOLDERS: MATERI - LEAD-FREE SOLDERS: MATERIALS RELIABILITY FOR ELECTRONICS Organization: WILEY
Date: 2012-01-01
Description: Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers: Phase diagrams and alloy development Effect of minor alloying additions Composite approaches including nanoscale reinforcements Mechanical issues affecting reliability Reliability under impact loading Thermomechanical fatigue Chemical issues affecting reliability Whisker growth Electromigration Thermomigration Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.
SAE USCAR40-1 - LEAD-FREE SOLDER VALIDATION TEST PLAN Organization: SAE
Date: 2015-04-01
Description: This guideline is applicable to existing lead solder production products that will change to lead-free solder processes to meet the ELV Directive 2000/53/EC Annex II, exemption 8B requirements.
GMNA - 9981999 - PREMIXED LEAD FREE TINNING SOLDER - ISSUE 7; DO NOT USE ON NEW PROGRAMS; NO REPLACEMENT Organization: GMNA
Date: 2002-12-01
Description: This specification covers a premixed lead free tinning solder compound. This material consists of finely powdered lead free tinning solder suspended in a liquid flux used for the purpose of simultaneously cleaning and tinning welded body joints prior to filling with body solder.
IEC/PAS 62647-3 - PROCESS MANAGEMENT FOR AVIONICS – AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER – PART 3: PERFORMANCE TESTING FOR SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES - EDITION 1.0 Organization: IEC
Date: 2011-07-01
Description: This PAS may be used for products in all stages of the transition to Lead-free (Pb-free) solder, including: • Products that have been designed and qualified with traditional Tin-Lead electronic components, materials, and assembly processes, and are being re-qualified with use of Lead-free (Pb-free) components • Products with Tin-Lead designs transitioning to Lead-free (Pb-free) solder; and • Products newly-designed with Lead-free (Pb-free) solder. For programs that were designed with Tin-Lead solder, and are currently not using any Leadfree (Pb-free) solder, the traditional methods may be used.
IEC/PAS 62647-1 - PROCESS MANAGEMENT FOR AVIONICS – AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER – PART 1: LEAD-FREE MANAGEMENT - EDITION 1.0 Organization: IEC
Date: 2011-06-01
Description: This PAS defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that Aerospace and High Performance (AHP) electronic systems containing Pb-free solder, piece parts, and boards will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance.
ARINC 671 - GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR Organization: ARINC
Date: 2006-03-15
Description: This report is focused on managing the maintenance and repair of soldered assemblies during the transition to lead-free technology. The terms lead-based and lead-free refer to alloys used in soldered assemblies.
JSA - JIS Z 3198-1 - TEST METHODS FOR LEAD-FREE SOLDERS - PART 1: METHODS FOR MEASURING OF MELTING TEMPERATURE RANGES Organization: JSA
Date: 2014-06-20
Description: This Standard specifies the methods for measuring of melting temperature ranges of lead-free solders (hereafter referred to as "solder alloys") that are mainly used for wiring of electric, electrical and communication equipment, and for other apparatus, as well as connecting components.
ASTM STP1530 - LEAD-FREE SOLDERS Organization: ASTM
IEC/TR 60068-3-12 - ENVIRONMENTAL TESTING – PART 3-12: SUPPORTING DOCUMENTATION AND GUIDANCE – METHOD TO EVALUATE A POSSIBLE LEAD-FREE SOLDER REFLOW TEMPERATURE PROFILE - EDITION 1.0 Organization: IEC
Date: 2007-03-01
Description: This part of IEC 60068 serves as a Technical Report and presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. This process covers a great variety of electronic products, including a large range of package sizes (molded active electronic components, passive components and electromechanical components).
IEC TR 60068-3-12 - ENVIRONMENTAL TESTING - PART 3-12: SUPPORTING DOCUMENTATION AND GUIDANCE - METHOD TO EVALUATE A POSSIBLE LEAD-FREE SOLDER REFLOW TEMPERATURE PROFILE - EDITION 2.0 Organization: IEC
Date: 2014-10-01
Description: This part of IEC 60068, which is a technical report, presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. This process covers a great variety of electronic products, including a large range of package sizes (e.g. molded active electronic components, passive components and electromechanical components).
ASM LEAD-FREE SOLD INTERC - LEAD-FREE SOLDER INTERCONNECT RELIABILITY Organization: ASM
Date: 2005-01-01
IEC/TS 62647-1 - PROCESS MANAGEMENT FOR AVIONICS – AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER – PART 1: PREPARATION FOR A LEAD-FREE CONTROL PLAN - EDITION 1.0 Organization: IEC
Date: 2012-08-01
Description: This part of the IEC/TS 62647 series defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that ADHP electronic systems containing Pb-free solder, piece parts, and PWBs will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance.
IEC/PAS 62647-21 - PROCESS MANAGEMENT FOR AVIONICS – AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER – PART 21: PROGRAM MANAGEMENT – SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS - EDITION 1.0 Organization: IEC
Date: 2011-07-01
Description: The industry conversion to Pb-free solder technology may affect an aerospace program in one or both of the following ways: 1) if the program is required to implement Pb-free technology (contract requirement, environmental regulation, etc), then the Program Manager/lead systems engineer will need to assess the impact of in-house transition with respect to design (performance of products using Pb-free) and process (processes to build Pb-free products); 2) if the program purchases COTS (Commercial-off-the-Shelf) items for its products/systems, then there is a very good chance that these items will contain Pb-free solder or Pb-free finishes on parts, printed wiring boards (PWBs), printed circuit boards (PCB), or circuit cards assemblies (CCA).
IEC/TS 62647-21 - PROCESS MANAGEMENT FOR AVIONICS – AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER – PART 21: PROGRAM MANAGEMENT – SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS - EDITION 1.0 Organization: IEC
Date: 2013-07-01
Description: The industry conversion to Pb-free solder technology may affect an ADHP program in one or both of the following ways: 1) if the program is required to implement Pb-free technology (contract requirement, environmental regulation, etc), then the program manager/lead systems engineer will need to assess the impact of in-house transition with respect to design (performance of products using Pb-free) and process (processes to build Pb-free products); 2) if the program purchases COTS (commercial-off-the-shelf) items for its products/systems, then there is a very good chance that these items will contain Pb-free solder or Pb-free finishes on parts, printed wiring boards (PWBs), printed circuit boards (PCB), or circuit cards assemblies (CCA).
CEI EN 62739-1 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING Organization: CEI
Date: 2014-04-01
Description: This part of the IEC 62739 series provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
IEC 62739-1 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY – PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING - EDITION 1.0 Organization: IEC
Date: 2013-06-01
Description: This part of the IEC 62739 series provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
CENELEC - EN 62739-1 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING Organization: CENELEC
Date: 2013-08-01
Description: This part of the IEC 62739 series provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
DS/EN 62739-1 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING Organization: DS
Date: 2013-09-30
Description: IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
IEC 62739-3 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY – PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS - EDITION 1.0 Organization: IEC
Date: 2017-01-01
Description: This part of IEC 62739 describes the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

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