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DS/EN 60970 - Insulating liquids - Methods for counting and sizing particles
October 11, 2007 - DS

This standard describes the sampling procedures and methods for the determination of particle concentration and size distribution. Three methods are specified. One uses an automatic particle size analyser, working on the light interruption principle. The other two use an optical...

IEC 60970 - Insulating liquids – Methods for counting and sizing particles
July 1, 2007 - IEC

This standard describes the sampling procedures and methods for the determination of particle concentration and size distribution. Three methods are specified. One uses an automatic particle size analyser, working on the light interruption principle. The other two use an optical...

DS/EN 50353 - Insulating oil - Determination of fibre contamination by the counting method using a microscope
April 16, 2002 - DS

This European Standard specifies two methods for determining the fibre contamination of mineral insultaing oil used in electrotechnical equipment, based on filtering a sample of oil and examining and counting the number of fibres on the surface of the filter using an optical microscope.

ASTM F584 - Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
January 1, 2006 - ASTM

This practice covers conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid microelectronic connections. This practice specifies the recommended lighting, magnification, and...

ASTM F584-06 - Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
January 1, 2006 - ASTM International

1.1 This practice covers conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid microelectronic connections. 1.2 This practice specifies the recommended lighting, magnification, and...

ASTM F584-06e1 - Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire (Withdrawn 2015)
January 1, 2006 - ASTM International

1.1 This practice covers conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid microelectronic connections. 1.2 This practice specifies the recommended lighting, magnification, and...

ASTM F584-87(2005) - Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
May 1, 2005 - ASTM International

1.1 This practice covers conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid microelectronic connections. 1.2 This practice specifies the recommended lighting, magnification, and...

ASTM F584-87(1999) - Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
June 10, 1999 - ASTM International

1.1 This practice covers conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid microelectronic connections. 1.2 This practice specifies the recommended lighting, magnification, and...

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