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DOD - DESC-DWG-81019 - MICROCIRCUITS, DIGITAL, CMOS, QUAD D LATCH, MONOLITHIC SILICON Organization: DOD
Date: 1984-04-11
Description: The complete part number shall be as shown in the following example: The device type shall identify the circuit function as follows: Device type Generic number Circuit 01 4042B Quad D Latch The case outline shall be as designated in appendix C of MIL-M-38510, and as follows: Outline letter Case outline E D-2 (16-lead, ¼″ × ⅞″ dual-in-line package) Supply voltage - - - - - - - - - - - - - - - - - −0.5 V to +18 V Input voltage range- - - - - - - - - - - - - - - −0.5 to VDD +0.5 V Storage temperature range- - - - - - - - - - - - −65°C to +150°C Maximum power dissipation, PD- - - - - - - - - - 500 mW u>1/ Lead temperature (soldering, 10 seconds) - - - - +300°C Thermal resistance, junction to case (θJC) - - - 50°C/W Junction temperature (TJ)- - - - - - - - - - - - +175°C Supply voltage - - - - - - - - - - - - - - - - - +3 V to 15 V Case operating temperature range (TC)- - - - - - −55°C to +125°C
DLA - SMD-5962-88655 - MICROCIRCUIT, DIGITAL, FAST, CMOS, OCTAL D-TYPE, FLIP-FLOP, MONOLITHIC SILICON Organization: DLA
Date: 1989-05-30
Description: The complete part number shall be as shown in the following example: The device types shall identify the circuit function as follows: Device type Generic number Circuit function 01 54FCT534 Octal D-type flip-flops, with three-state outputs 02 54FCT534A Octal D-type flip-flops, with three-state outputs The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows: u>Outline letteru> Case outline R D-8 (20-lead, 1.060" × .310" × .200"), dual-in-line package S F-9 (20-lead, .540" × .300" × .100"), flat package 2 C-2 (20-terminal, .358" × .358" × .100"), square chip carrier package Supply voltage range - - - - - - - - - - - - - - - - −0.5 V dc to +6.0 V dc Input voltage range - - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc Output voltage range - - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc DC input diode current (IIK) - - - - - - - - - - - - −20 mA DC output diode current (IOK) - - - - - - - - - - - −50 mA DC output current - - - - - - - - - - - - - - - - - ±100 mA Maximum power dissipation (PD) 2/ - - - - - - - - - 500 mW Thermal resistance, junction-to-case (θJC) - - - - - See MIL-M-38510, appendix C Storage temperature range - - - - - - - - - - - - - −65°C to +150°C Junction temperature (TJ) - - - - - - - - - - - - - +175°C Lead temperature (soldering, 10 seconds) - - - - - - +300°C Supply voltage range (VCC) - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Maximum low level input voltage (VIL) - - - - - - - 0.8 V dc Minimum high level input voltage (VIH) - - - - - - - 2.0 V dc Case operating temperature range (TC) - - - - - - - −55°C to +125°C
DLA - SMD-5962-91605 - MICROCIRCUITS, DIGITAL, ADVANCED CMOS, PARALLEL D REGISTER WITH ENABLE, MONOLITHIC SILICON Organization: DLA
Date: 1992-04-17
Description: Supply voltage range - - - - - - - - - - - - - - - - −0.5 V dc to +6.0 V dc DC input voltage range- - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc DC output voltage range - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc Input clamp diode current - - - - - - - - - - - - - - ±20 mA Output clamp diode current- - - - - - - - - - - - - - ±20 mA DC output current (per output pin)- - - - - - - - - - ±50 mA DC VCC or GND current (per output pin)- - - - - - - - ±50 mA Storage temperature range - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD)- - - - - - - - - - - - 500 mW Lead temperature (soldering, 10 seconds)- - - - - - - +300°C Thermal resistance, junction-to-case(ΘJC) - - - - - - See MIL-M-38510, appendix C Junction temperature (TJ) u>2u>/ - - - - - - - - - - - - +175°C Supply voltage range (VCC) 3/ - - - - - - - - - - - - +3.0 V dc to +5.5 V dc Input voltage range - - - - - - - - - - - - - - - - - 0.0 V dc to VCC Output voltage range - - - - - - - - - - - - - - - - 0.0 V dc to VCC Case operating temperature range(TC)- - - - - - - - - −55°C to +125°C Input rise or fall times: VCC = 3.0 V to 5.5 V - - - - - - - - - - - - - - - 0 to 8 ns/V Minimum setup time, data (Dn) to clock (CP), (ts1): TC = +25°C, VCC = 3.0 V - - - - - - - - - - - - - - 4.0 ns TC = −55°C, +125°C, VCC = 3.0 V - - - - - - - - - - 4.0 ns TC = +25°C, VCC = 4.5 V - - - - - - - - - - - - - - 4.0 ns TC = −55°C, +125°C, VCC = 4.5 V - - - - - - - - - - 4.0 ns Minimum hold time, Dn to CP, (th1): TC = +25°C, VCC = 3.0 V - - - - - - - - - - - - - - 4.0 ns TC = −55°C, +125°C, VCC = 3.0 V - - - - - - - - - - 4.0 ns TC = +25°C, VCC = 4.5 V - - - - - - - - - - - - - - 4.0 ns TC = −55°C, +125°C, VCC = 4.5 V - - - - - - - - - - 4.0 ns Minimum setup time, clock enable ([E bar]) to CP, (ts2): TC = +25°C, VCC = 3.0 V - - - - - - - - - - - - - - 2.5 ns TC = −55°C, +125°C, VCC = 3.0 V - - - - - - - - - - 2.5 ns TC = +25°C, VCC = 4.5 V - - - - - - - - - - - - - - 2.5 ns TC = −55°C, +125°C, VCC = 4.5 V - - - - - - - - - - 2.5 ns Minimum hold time, [E bar] to CP, (th2): TC = +25°C, VCC = 3.0 V - - - - - - - - - - - - - - 4.0 ns TC = −55°C, +125°C, VCC = 3.0 V - - - - - - - - - - 4.0 ns TC = +25°C, VCC = 4.5 V - - - - - - - - - - - - - - 4.0 ns TC = −55°C, +125°C, VCC = 4.5 V - - - - - - - - - - 4.0 ns Minimum clock frequency (fMAX): TC = +25°C, VCC = 3.0 V - - - - - - - - - - - - - - 95 MHz TC = −55°C, +125°C, VCC = 3.0 V - - - - - - - - - - 95 MHz TC = +25°C, VCC = 4.5 V - - - - - - - - - - - - - - 95 MHz TC = −55°C, +125°C, VCC = 4.5 V - - - - - - - - - - 95 MHz Minimum CP high, low pulse width, : TC = +25°C, VCC = 3.0 V - - - - - - - - - - - - - - 5.0 ns TC = −55°C, +125°C, VCC = 3.0 V - - - - - - - - - - 6.5 ns TC = +25°C, VCC = 4.5 V - - - - - - - - - - - - - - 5.0 ns TC = −55°C, +125°C, VCC = 4.5 V - - - - - - - - - - 6.5 ns Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - XX percent 4/
DLA - SMD-5962-93026 - MICROCIRCUIT, DIGITAL, FAST CMOS, OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CURRENT LIMITING RESISTORS AND THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS AND LIMITED OUTPUT VOLTAGE SWING, MONOLITHIC SILICON Organization: DLA
Date: 1995-11-28
Description: The device type(s) shall identify the circuit function as follows: Device class Generic number Circuit function 01 54FCT2374T Octal edge-triggered D-type flip-flop with current limiting resistors and three-state outputs, TTL compatible inputs and limited output voltage swing 02 54FCT2374AT Octal edge-triggered D-type flip-flop with current limiting resistors and three-state outputs, TTL compatible inputs and limited output voltage swing 03 54FCT2374CT Octal edge-triggered D-type flip-flop with current limiting resistors and three-state outputs, TTL compatible inputs and limited output voltage swing The device class designator shall be a single letter identifying the product assurance level as follows: u>Device classu> u>Device requirements documentationu> M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535 The case outline(s) shall be as designated in MIL-STD-1835, and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Leadless chip carrier The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V.
FORD - S-M99D4670-A - SAFETY SUN VISOR Organization: FORD
Date: 1994-01-01
Description: SCOPE The material defined by t h i s s p e c i f i c a t i o n i s a rt c o n s i s t i n g of PU foam, vinyl s h e e t , m e t a l s u p p o r t s a n d accessories.
DS - DSF/EN 60061-1/FPRA54 - LAMP CAPS AND HOLDERS TOGETHER WITH GAUGES FOR THE CONTROL OF INTERCHANGEABILITY AND SAFETY - PART 1: LAMP CAPS Organization: DS
Description: Consolidated edition incorporating the sheets of the third edition (1969) plus supplements A, B, C, D, E, F, G, H, J, K, L, M, N, P, Q R, S, T and U valid on 1996-12-31.
NAVY - OPNAV 5442.4M CH-1 - (OP-515) AIRCRAFT MATERIAL CONDITION DEFINITIONS, MISSION-ESSENTIAL SUBSYSTEMS MATRICES (MESMS), AND MISSION DESCRIPTIONS CHG NOT 1 - 07/01/92 Organization: NAVY
Date: 1990-10-17
Description: Mission capable goals by aircraft T/M/S.
JEDEC - JEDEC JEP 170 - GUIDELINES FOR VISUAL INSPECTION AND CONTROL OF FLIP CHIP TYPE COMPONENTS (FCXGA) Organization: JEDEC
Date: 2013-01-01
Description: Offic in FCxGA c vide illustrati disruptive of q n that can be u cial criteria fo components t ion on other d quality or reli utilized to ide or product acc that can adve defects that m ability to cus entify these d ceptance shou ersely may be tomer defects uld be
DLA - SMD-5962-88613 REV B - MICROCIRCUIT, DIGITAL, CMOS, 16-BIT ERROR DETECTION AND CORRECTION UNIT, MONOLITHIC SILICON Organization: DLA
Date: 1991-11-25
Description: The complete part number shall be as shown in the following example: The device types shall identify the circuit function as follows: Device type Generic number Circuit function Detect time Correct time 01 39C60A 16-bit EDCU 24 ns 35 ns 02 39C60 16-bit EDCU 36 ns 73 ns 03 29C60A 16-bit EDCU 24 ns 35 ns The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows: Outline letter Case outline T See figure 1 (48-lead, 1.730" × .410" × .190"), dual-in-line package U C-6 (52 terminal, .761" × .761" × .120"), square chip carrier package X D-14 (48-lead, 2.435" × .620" × .225"), dual-in-line package Y See figure 1 (48-lead, 1.235" × .660" × .060"), flat package Z See figure 1 (52 terminal, .761" × .761" × .075"), square chip carrier package Voltage on any pin relative to ground- - - - - - - −0.5 V dc to +7.0 V dc DC output current into outputs - - - - - - - - - - 30 mA Storage temperature range- - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD) - - - - - - - - - - 1.0 W 1/ Lead temperature (soldering, 10 seconds) - - - - - +300°C Thermal resistance, junction-to-case (θJC): Cases T, Y, Z - - - - - - - - - - - - - - - - - 30°C/W u>2u>/ Cases X and U - - - - - - - - - - - - - - - - - See MIL-M-38510, appendix C.
DOD - SMD 5962-88676 - MICROCIRCUITS, MEMORY, DIGITAL, CMOS 2K X 8 EEPROM, MONOLITHIC SILICON Organization: DOD
Date: 2011-04-01
Description: The complete part number shall be as shown in the following example: The device types shall identify the circuit function as follows: Device Generic Circuit Access Write End of write type number function time speed Write mode indicator Endurance 01 (see 6.4) 2K × 8 EEPROM 90 ns 1.0 ms byte [D bar][A bar][T bar][A bar] polling 10,000 cycles 02 (See 6.4) 2K × 8 EEPROM 70 ns 1.0 ms byte [D bar][A bar][T bar][A bar] polling 10,000 cycles 03 (see 6.4) 2K × 8 EEPROM 55 ns 1.0 ms byte [D bar][A bar][T bar][A bar] polling 10,000 cycles The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows: Outline letter Case outline J D-3 (24-lead, 1.290" × .610" × .225"), dual-in-line package L D-9 (24-lead, 1.280" × .310" × .200"), dual-in-line package X C-12 (32-terminal, .560" × .458" × .120"), rectangular chip carrier package Supply voltage range (VCC) - - - - - - - - - - - - −0.3 V dc to +6.25 V dc Storage temperature range- - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD) - - - - - - - - - - 1.0 W Lead temperature (soldering, 10 seconds) - - - - - +300°C Junction temperature (TJ) u>2u>/ - - - - - - - - - - - +175°C Thermal resistance, junction-to-case (θJC) - - - - See MIL-M-38510, appendix C Input voltage range (VIL, VIH) - - - - - - - - - - −0.3 V dc to +6.25 V dc Data retention - - - - - - - - - - - - - - - - - - 10 years (minimum) Endurance- - - - - - - - - - - - - - - - - - - - - 10,000 cycles (minimum) Chip clear voltage (VH)- - - - - - - - - - - - - - 12.0 V dc Supply voltage range (VCC) - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Case operating temperature range (Tc)- - - - - - - - −55°C to +125°C Input voltage, low range (VIL) - - - - - - - - - - - −0.1 V dc to +0.8 V dc Input voltage, high range (VIH)- - - - - - - - - - - +2.0 V dc to VCC +0.3 V dc
DLA - SMD-5962-87653 REV A - MICROCIRCUIT, MICROPROCESSOR, COMPATIBLE REAL-TIME CLOCK, CMOS MONOLITHIC SILICON Organization: DLA
Date: 1991-10-21
Description: The complete part number shall be as shown in the following example: The device type shall identify the circuit function as follows: Device type Generic number Circuit function 01 ICM7170 Microprocessor compatible real-time clock The case outline shall be as designated in appendix C of MIL-M-38510, and as follows: u>Outline letteru> Case outline J D-3 (24-lead, ½" × 1-¼"), dual-in-line package Supply voltage (VCC) - - - - - - - - - - - - - - - - - - - - +8.0 V dc Power dissipation (PD) - - - - - - - - - - - - - - - - - - - 500 mW 1/ Input voltage (any terminal) - - - - - - - - - - - - - - - - VCC +0.3 V dc to VSS −0.3 V dc Storage temperature range (TS) - - - - - - - - - - - - - - - −65°C to +150°C Thermal resistance, junction to-case (θJC): Case J - - - - - - - - - - - - - - - - - - - - - - - - - - See MIL-M-38510, appendix C Lead temperature (soldering, 10 seconds) - - - - - - - - - - +300°C Case operating temperature range (TC) - - - - - - - - - - - −55°C to +125°C Supply voltage (VCC) - - - - - - - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc
DLA - DESC-DWG-76015 REV E - MICROCIRCUIT, DIGITAL, LOW POWER SCHOTTKY TTL, COUNTER, MONOLITHIC SILICON Organization: DLA
Date: 1986-01-15
Description: The complete part number shall be as shown in the following example: The device type shall identify the circuit function as follows: Device type Generic number Circuit 01 54LS197 50/30-MHz presettable decade or binary counter The case outline shall be as designated in appendix C of MIL-M-38510, and as follows: Outline letter Case outline C D-1 (14-lead, ¼″ × ¾″), dual-in-line package D F-2 (14-lead, ¼″ × ⅜″), flat-package Supply voltage range - - - - - - - - - - - - - - −0.5 to +7.0 V dc Input voltage range- - - - - - - - - - - - - - - −1.5 V dc at −18 mA to 5.5 V dc Storage temperature range- - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD) u>1u>/ - - - - - - - 149 mW Lead temperature (soldering 10 seconds)- - - - - +300°C Thermal resistance, junction to case (θJC) - - - See MIL-M-38510, appendix C Junction temperature (TJ)- - - - - - - - - - - - +175°C Supply voltage (VCC) - - - - - - - - - - - - - - 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) - - - - - 2.0 V dc Maximum low level input voltage (VIL)- - - - - - 0.7 V dc Case operating temperature range (TC)- - - - - - −55°C to +125°C
DLA - DESC-DWG-76004 REV E - MICROCIRCUITS, DIGITAL, LOW POWER SCHOTTKY TTL, POSITIVE NAND GATES, MONOLITHIC SILICON Organization: DLA
Date: 1986-01-23
Description: The case outlines shall be as designated in MIL-M-38510, appendix C and as follows: Outline letter Case outline C D-1 (14-lead, ¼″ × ¾″), dual-in-line package D F-2 (14-lead, ¼″ × ⅜″), flat package Supply voltage range - - - - - - - - - - - - - - - −0.5 V dc to 7.0 V dc Input voltage range- - - - - - - - - - - - - - - - −1.5 V dc at −18 mA to 5.5 V dc Storage temperature range- - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD) u>1u>/- - - - - - - - - 77 mW Lead temperature (soldering, 10 seconds) - - - - - +300°C Thermal resistance, junction-to-case (θJC):- - - - (See MIL-M-38510, appendix C) Junction temperature (TJ)- - - - - - - - - - - - - +175°C Supply voltage (VCC) - - - - - - - - - - - - - - - 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) - - - - - - 1.9 V dc Maximum low level input voltage (VIL)- - - - - - - 0.5 V dc Case operating temperature range (TC)- - - - - - - −55°C to +125°C
DLA - SMD-5962-85503 REV A - MICROCIRCUITS, DIGITAL 16-BIT BIPOLAR MICROCONTROLLER, MONOLITHIC SILICON Organization: DLA
Date: 1987-05-18
Description: The complete part number shall be as shown in the following example: The device type shall identify the circuit function as follows: Device type Generic number Circuit function 01 8×320 16-bit bipolar microcontroller The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows: Outline letter Case outline Q D-5 (40-lead, 9/16" × 2-1/16"), dual-in-line package U C-5 (44-terminal, .650" × .650"), square chip carrier package Supply voltage range - - - - - - - - - - - - - - - - - - - −0.3 V dc to +7.0 V dc Input voltage- - - - - - - - - - - - - - - - - - - - - - - −0.3 V dc to +5.5 V dc Storage temperature range- - - - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation, (PD) u>1u>/ - - - - - - - - - - - - 1.5 W Lead temperature (soldering, 5 seconds)- - - - - - - - - - +270°C Junction temperature (TJ)- - - - - - - - - - - - - - - - - +150°C Thermal resistance, junction-to-case (θJC): Case Q - - - - - - - - - - - - - - - - - - - - - - - - - See MIL-M-38510, appendix C Case U - - - - - - - - - - - - - - - - - - - - - - - - - 25°C/W Supply voltage (VCC) - - - - - - - - - - - - - - - - - - - - - - 5.0 V dc ±10% Case operating temperature range (TC)- - - - - - - - - - - - - - −55°C to +125°C Minimum high level input voltage (logic inputs)- - - - - - - - - 2.0 V dc Maximum low level input voltage (logic inputs) - - - - - - - - - 0.8 V dc Minimum high level output voltage- - - - - - - - - - - - - - - - 2.4 V dc Maximum low level output voltage - - - - - - - - - - - - - - - - 0.5 V dc Maximum frequency of operation - - - - - - - - - - - - - - - - - 8.0 MHz
DLA - SMD-5962-88572 REV B - MICROCIRCUIT, DIGITAL, NMOS INTERRUPT GENERATOR, MONOLITHIC SILICON Organization: DLA
Date: 1991-11-07
Description: The complete part number shall be as shown in the following example: The device type shall identify the circuit function as follows: Device type Generic number Circuit function 01 68154 Interrupt generator The case outline shall be as designated in appendix C of MIL-M-38510, and as follows: Outline letter Case outline Q D-5 (40-lead, 2.096" × .620" × .225") dual-in-line package Supply voltage range - - - - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc Input voltage range - - - - - - - - - - - - - - - - - - −0.5 V dc to +5.5 V dc Voltage applied to output in off-state - - - - - - - - - −0.5 V dc to +5.5 V dc Storage temperature range - - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD)u>1u>/ - - - - - - - - - - - - - 1.2 W Lead temperature (soldering, 5 seconds) - - - - - - - - - +300°C Junction temperature (TJ) - - - - - - - - - - - - - - - - +175°C Thermal resistance, junction-to-case (θJC) - - - - - - - See MIL-M-38510, appendix C Supply voltage range (VCC) - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc High level input voltage (VIH)- - - - - - - - - - - - 2.0 V to VCC Low level input voltage (VIL) - - - - - - - - - - - - 0.8 V dc ([L bar][D bar][T bar][A bar][C bar][K bar]) low level output current - - - - - - - - - - 20 mA Low level output current (all other outputs) - - - - 8.0 mA High level output current - - - - - - - - - - - - - - −400 mA Case operating temperature range (TC) - - - - - - - - −55°C to +125°C
DLA - DESC-DWG-78011 REV E - MICROCIRCUIT, DIGITAL, LOW-POWER SCHOTTKY, TTL, OCTAL FLIP-FLOP, MONOLITHIC SILICON Organization: DLA
Date: 1987-12-07
Description: The complete part number shall be as shown in the following example: The device type shall identify the circuit function as follows: Device type Generic number Circuit function 01 54LS374 Octal D-type positive, edge-triggered flip-flop with three-state outputs The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows: Outline letter Case outline R D-8 (20-lead, ¼″ × 1-1/16″), dual-in-line package S F-9 (20-lead, ¼″ × ½″), flat package 2 C-2 (20-terminal, .350″ × .350″), square chip carrier package Supply voltage range - - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc Input voltage range - - - - - - - - - - - - - - - - - −1.5 V dc at −18 mA to 5.5 V dc Storage temperature - - - - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD) u>1u>/ - - - - - - - - - 31 mW Lead temperature (soldering, 10 seconds) - - - - - - +300°C Thermal resistance, junction-to-case (θJC): - - - - - See MIL-M-38510, appendix C Junction temperature (TJ) - - - - - - - - - - - - - - +175°C Supply voltage range (VCC) - - - - - - - - - - - - - 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) - - - - - - - 2.0 V dc Maximum low level input voltage (VIL) - - - - - - - - 0.7 V dc Case operating temperature range (TC) - - - - - - - - −55°C to +125°C High level output current (IOH) - - - - - - - - - - - −1 mA Low level output current (IOL) - - - - - - - - - - - 12 mA Width of clock pulse (TW) - - - - - - - - - - - - - - 15 ns minimum Data input Set-up time (Tsu) - - - - - - - - - - - - - - - - - 20 ns minimum Data hold time (Th) - - - - - - - - - - - - - - - - 0 ns minimum Clock frequency (Fclock)- - - - - - - - - - - - - - - 0 to 35 MHz
DLA - DESC-DWG-78016 REV D - MICROCIRCUITS, DIGITAL, 4K SCHOTTKY BIPOLAR PROM, MONOLITHIC SILICON Organization: DLA
Date: 1988-01-22
Description: . × 0.100″, MAX), square leadless chip carrier package Supply voltage range - - - - - - - - - - - - - - - −0.5 V dc to 7.0 V dc Input voltage range- - - - - - - - - - - - - - - - −1.5 V dc to 5.5 V dc Storage temperature range- - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD) u>1u>/- - - - - - - - - 1.02 W Lead temperature (soldering, 10 seconds) - - - - - +300°C Thermal resistance, junction-to-case (θJC) 2/- - - (See MIL-M-38510, appendix C) Maximum junction temperature (TJ)- - - - - - - - - +175°C Output sink current - - - - - - - - - - - - - - - 100 mA Supply voltage range (VCC) - - - - - - - - - - - - 4.5 V dc minimum to 5.5 V dc maximum Case operating temperature range (TC)- - - - - - - −55°C to +125°C Minimum high level input voltage (VIH) - - - - - - 2.0 V dc Maximum low level input voltage (VIL)- - - - - - - 0.8 V dc
DLA - DESC-DWG-76012 REV D - MICROCIRCUITS, DIGITAL, LOW POWER SCHOTTKY TTL, LATCH, MONOLITHIC SILICON Organization: DLA
Date: 1985-12-10
Description: The complete part number shall be as shown in the following example: The device type shall identify the circuit function as follows: Device type Generic number Circuit 01 54LS75 4-bit Bistable latch The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows: Outline letter Case outline E D-2 (16-lead, ¼″ × ⅞″), dual-in-line package F F-5 (16-lead, ¼″ × ⅜″), flat package Supply voltage range - - - - - - - - - - - - - −0.5 to 7.0 V dc Input voltage range- - - - - - - - - - - - - - −1.5 V dc at −18 mA to 5.5 V dc Storage temperature range- - - - - - - - - - - −65°C to +150°C Maximum power dissipation, (PD) u>1u>/- - - - - - 66 mW Lead temperature (soldering, 10 seconds) - - - +300°C Thermal resistance, junction-to-case (θJC) - - See MIL-M-38510, appendix C Junction temperature (TJ)- - - - - - - - - - - +175°C Supply voltage (VCC) - - - - - - - - - - - - - 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) - - - - 2.0 V dc Maximum low level input voltage (VIL)- - - - - 0.7 V dc Case operating temperature range (TC)- - - - - −55°C to +125°C
DLA - DESC-DWG-76045 REV B - MICROCIRCUITS, DIGITAL, LOW POWER SCHOTTKY TTL, DECODER, MONOLITHIC SILICON Organization: DLA
Date: 1986-01-15
Description: The complete part number shall be as shown in the following example: The device type shall identify the circuit function as follows: Device type Generic number Circuit 01 54LS47 Single 4 to 7 line decoder with open collector outputs The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows: Outline letter Case outline E D-2 (16-lead, ¼″ × ⅞″), dual-in-line package F F-5 (16-lead, ¼″ × ⅜″), flat package Supply voltage range - - - - - - - - - - - - - - −0.5 to 7.0 V dc Input voltage range- - - - - - - - - - - - - - - −1.5 V dc at −18 mA to 5.5 V dc Storage temperature range- - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD) u>1u>/- - - - - - - - 71.5 mW Lead temperature (soldering, 10 seconds) - - - - +300°C Thermal resistance, junction-to-case (OJC) - - - See MIL-M-38510, appendix C Junction temperature (TJ)- - - - - - - - - - - - +175°C Supply voltage (VCC) - - - - - - - - - - - - - - 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) - - - - - 2.0 V dc Maximum low level input voltage (VIL)- - - - - - 0.7 V dc Case operating temperature range (TC)- - - - - - −55°C to +125°C
DLA - DESC-DWG-76040 REV C - MICROCIRCUITS, DIGITAL, SCHOTTKY TTL, SHIFT REGISTERS, MONOLITHIC SILICON Organization: DLA
Date: 1986-03-25
Description: The complete part number shall be as shown in the following example: The device type shall identify the circuit function as follows: Device type Generic number Circuit 01 54S194 4 bit bi-directional shift register The case outlines shall be as designated in MIL-M-38510, appendix C and as follows: Outline letter Case outline E D-2 (16-lead, ¼″ × ⅞″), dual-in-line package F F-5 (16-lead, ¼″ × ⅜″), flat package Supply voltage range - - - - - - - - - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc Input voltage range- - - - - - - - - - - - - - - - - - - - - - - - −1.2 V dc at −18 mA to 5.5 V dc Storage temperature range- - - - - - - - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD) u>1u>/ - - - - - - - - - - - - - 605 mW Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - - +300°C Thermal resistance, junction-to-case (θJC):- - - - - - See MIL-M-38510, appendix C Junction temperature (TJ) - - - - - - - - - - - - - - - - - +175°C Supply voltage (VCC) - - - - - - - - - - - - - - - - - - 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) - - - - - - - - - 2.0 V dc Maximum low level input voltage (VIL)- - - - - - - - - - 0.8 V dc Case operating temperature range (TC)- - - - - - - - - - −55°C to +125°C

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