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MSFC-STD-2903 REV B - MSFC TAILORING GUIDE FOR NASA-STD-8739.3, SOLDERED ELECTRICAL CONNECTIONS Organization: MSFC
Date: 2006-06-21
Description: This tailoring guide sets forth the Marshall Space Flight Center (MSFC) exceptions to the use of NASA-STD-8739.3, Soldered Electrical Connections, December 1997.
NASA - NASA-STD-8739.3 W/CHG 5 W/CANC NOTICE - SOLDERED ELECTRICAL CONNECTIONS Organization: NASA
Date: 2011-09-23
Description: Applicability This publication applies to NASA programs involving soldering connections for flight hardware, mission critical ground support equipment, and elements thereof, and wherever invoked contractually.
NASA - NASA-STD-8739.3 - SOLDERED ELECTRICAL CONNECTIONS Organization: NASA
Date: 2011-03-29
Description: Applicability This publication applies to NASA programs involving soldering connections for flight hardware, mission critical ground support equipment, and elements thereof, and wherever invoked contractually.
NASA - NHB 5300.4(3A-2) - REQUIREMENTS FOR SOLDERED ELECTRICAL CONNECTIONS Organization: NASA
Date: 1992-01-01
Description: APPLICABILITY AND SCOPE This publication is applicable to NASA programs involving solder connections for flight hardware, mission essential support equipment, and elements thereof.
NASA - NASA-STD-8739.2 W/CHG 2 W/CANC NOTICE - WORKMANSHIP STANDARD FOR SURFACE MOUNT TECHNOLOGY Organization: NASA
Date: 2011-03-29
Description: Applicability This publication is applicable to NASA Centers and programs utilizing SMT for flight hardware, mission critical ground support equipment, and elements thereof, and where invoked contractually.
NASA - NASA-STD-8739.2 - WORKMANSHIP STANDARD FOR SURFACE MOUNT TECHNOLOGY Organization: NASA
Date: 1999-08-31
Description: Applicability This publication is applicable to NASA Centers and programs utilizing SMT for flight hardware, mission critical ground support equipment, and elements thereof, and where invoked contractually.
DS/EN 50389 - SPACE PRODUCT ASSURANCE - WIRE-WRAPPING OF HIGH-RELIABILITY ELECTRICAL CONNECTIONS Organization: DS
Date: 2005-10-28
Description: This type of connection is similar to "Class A preferred" or "modified" connection detailed in MIL-STD-1130, and NASA NHB 5300.4(3H). Only tested and qualified wire-wrapped connections are covered by this standard, which lists four wire sizes from 24 AWG to 30 AWG, and three terminal post sizes up to 1,78 mm maximum diagonal.
DSF/FPREN 16602-70-30 - SPACE PRODUCT ASSURANCE - WIRE WRAPPING OF HIGH-RELIABILITY ELECTRICAL CONNECTIONS Organization: DS
Description: This type of connection is similar to "Class A preferred" or "modified" connection detailed in MIL STD 1130, and NASA NHB 5300.4(3H). Only previously tested and qualified wire­wrapped connections are covered by this Standard, which includes four wire sizes from 24 AWG to 30 AWG, and three terminal post sizes up to 1,78 mm maximum diagonal.
DIN EN 16602-70-30 - SPACE PRODUCT ASSURANCE - WIRE WRAPPING OF HIGH-RELIABILITY ELECTRICAL CONNECTIONS; ENGLISH VERSION EN 16602-70-30:2014 Organization: DIN
Date: 2015-07-01
Description: This type of connection is similar to "Class A preferred" or "modified" connection detailed in MIL-STD-1130, and NASA NHB 5300.4(3H). Only previously tested and qualified wirewrapped connections are covered by this Standard, which includes four wire sizes from 24 AWG to 30 AWG, and three terminal post sizes up to 1,78 mm maximum diagonal.
NBN - EN 16602-70-30 - SPACE PRODUCT ASSURANCE - WIRE WRAPPING OF HIGH-RELIABILITY ELECTRICAL CONNECTIONS Organization: NBN
Date: 2014-11-28
Description: This type of connection is similar to “Class A preferred” or “modified” connection detailed in MIL STD 1130, and NASA NHB 5300.4(3H).Only previously tested and qualified wire­wrapped connections are covered by this Standard, which includes four wire sizes from 24 AWGto 30 AWG, and three terminal post sizes up to 1,78 mm maximum diagonal.
NBN - EN 16602-70-30 - ASSURANCE PRODUIT DES PROJETS SPATIAUX - ENVELOPPE DE FILS POUR CONNEXION ÉLECTRIQUE À FIABILITÉ ÉLEVÉE Organization: NBN
Date: 2014-11-28
Description: This type of connection is similar to “Class A preferred” or “modified” connection detailed in MIL STD 1130, and NASA NHB 5300.4(3H).Only previously tested and qualified wire­wrapped connections are covered by this Standard, which includes four wire sizes from 24 AWGto 30 AWG, and three terminal post sizes up to 1,78 mm maximum diagonal.
NASA - NASA STD 7003 - PYROSHOCK TEST CRITERIA Organization: NASA
Date: 1999-05-18
Description: Purpose. The objective of this NASA Technical Standard is to provide a consistent methodology for developing pyroshock test criteria for NASA spacecraft, payload, and launch vehicle hardware during the development, qualification, flight acceptance, and/or protoflight test phases of the verification process.
NASA - NASA-LLIS-0604 - LESSONS LEARNED – MICROCHIP SUSCEPTIBILITY TO IONIZING RADIATION EMITTED BY ENVIRONMENT, MATERIALS USED IN PRODUCTION AND PROCESSING OF COMPUTER HARDWARE Organization: NASA
Date: 1998-11-11
Description: Two different JSC engineers have indicated that these radiation issues can cause concerns for NASA systems. The article is quoted verbatim. (from New Scientist/Reuters) Microchips are growing smaller, but their diminishing size exacts a price.

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