Find the standard you are looking for at Engineering360. Documents are available for purchase from the IHS Standards Store.

1 - 20 of 5,436 results

IEEE 256 - SEMICONDUCTOR DIODES Organization: IEEE
Date: 1963-12-01
Description: This Standard recommends and describes methods of measurement of the important electrical characteristics of semiconductor diodes. For the purpose of this Standard, a semiconductor diode is defined1 as: "A semiconductor device having two terminals and exhibiting a nonlinear voltage—current characteristic; in more restricted usage, a semiconductor device which has the asymmetrical voltage—current characteristic exemplified by a single p-n junction."
DNVGL-CP-0395 - SEMICONDUCTOR CONVERTERS Organization: DNVGL
Date: 2015-12-01
Description: This CP gives a description of the procedures and requirements related to documentation, design and type testing applicable for TA of semiconductor converters. This CP does not set the design requirements to the semiconductor converters.
NAVY - MIL-HDBK-215 - SELECTED SEMICONDUCTOR CIRCUITS Organization: NAVY
Date: 1960-06-15
Description: This appendix covers the abbreviations and symbols for use with semiconductor devices.
JEDEC JESD 14 - SEMICONDUCTOR POWER CONTROL MODULES Organization: JEDEC
Date: 1986-11-01
Description: Semiconductor Power Control Modules (SPCM) are modules consisting of thyristors or transistors, or both, as the primary controlling elements.
MCGRAW - SEMICONDUCTOR MANUFACTURI - SEMICONDUCTOR MANUFACTURING HANDBOOK Organization: MCGRAW
Date: 2005-01-01
Description: This handbook will provide engineers with the principles, applications, and solutions needed to design and manage semiconductor manufacturing operations. Consolidating the many complex fields of semiconductor fundamentals and manufacturing into one volume by deploying a team of world class specialists, it allows the quick look up of specific manufacturing reference data across many subdisciplines.
WILEY - COMPOUND SEMICONDUCTOR DE - COMPOUND SEMICONDUCTOR DEVICES Organization: WILEY
Date: 1998-01-01
Description: It may be surprising to some how little the descriptions of the processing depends on the fundamental physics of semiconductors. The properties of the semiconductor determine what is to be done in the manufacturing process, but not how it is to be done.
NPFC - MIL-DTL-19491 - SEMICONDUCTOR DEVICES, PACKAGING OF Organization: NPFC
Date: 2014-08-19
Description: This specification covers the requirements for the preservation, packing, and container marking of semiconductor devices such as transistors and diodes (FSC 5961).
IET - DISTRIBUTED FEEDBACK SEMI - DISTRIBUTED FEEDBACK SEMICONDUCTOR LASERS Organization: IET
Date: 1998-01-01
Description: The book has 8 chapters that are divided into parts. The first chapter is about semiconductor-diode laser and its design. The second chapter is about gain, loss and spontaneous emissions of semiconductor lasers.
WSPC - DILTD MAG SEMICONDS - DILUTED MAGNETIC SEMICONDUCTORS Organization: WSPC
Date: 1991-10-31
Description: This review volume presents both basic and applied aspects of diluted magnetic semiconductors (DMS). The term DMS applies generally to semiconductors in which a fraction of its constituent ions are replaced by magnetic ions.
WSPC - MDRN SEMICOND QUAN PHYS - MODERN SEMICONDUCTOR QUANTUM PHYSICS Organization: WSPC
Date: 1995-02-28
Description: Modern Semiconductor Quantum Physics has the following constituents: (1) energy band theory: pseudopotential method (empirical and ab initio); density functional theory; quasi-particles; LCAO method; k.p method; spin-orbit splitting; effect mass and Luttinger parameters; strain effects and deformation potentials; temperature effects. (2) Optical properties: absorption and exciton effect; modulation spectroscopy; photo luminescence and photo luminescence excitation; Raman scattering and polaritons; photoionization. (3) Defects and Impurities: effective mass theory and shallow impurity states; deep state cluster method, super cell method,Green's function method; carrier recombination kinetics; trapping transient measurements; electron spin resonance; electron lattice interaction and lattice relaxation effects; multi-phonon nonradiative recombination; negative U center, DX center and EL2 Defects. (4) Semiconductor surfaces: two dimensional periodicity and surface reconstruction; surface electronic states; photo-electron spectroscopy; LEED, STM and other experimental methods. (5) Low-dimensional structures: Heterojunctions, quantum wells; superlattices, quantum-confined Stark effect and Wannier-Stark ladder effects; resonant tunneling, quantum Hall effect, quantum wires and quantum dots.
SAE/TP - 2006-01-3033 - HIGH POWER SEMICONDUCTOR SWITCHING Organization: SAE/TP
Date: 2006-11-07
Description: This was the case for essentially all (if not all) complex mobile Electrical Power Distribution Systems, including those employed both in marine and aviation systems. High power, semiconductor switching has now evolved to the point that it is expected to provide new standards based upon semiconductor technology.
WILEY - ULSI SEMICONDUCTOR TECHNO - ULSI SEMICONDUCTOR TECHNOLOGY ATLAS Organization: WILEY
Date: 2004-01-01
Description: More than 1,100 TEM images illustrate the science of ULSI The natural outgrowth of VLSI (Very Large Scale Integration), Ultra Large Scale Integration (ULSI) refers to semiconductor chips with more than 10 million devices per chip.
WSPC - SEMI QUANT DOTS - SEMICONDUCTOR QUANTUM DOTS Organization: WSPC
Date: 1993-05-28
Description: Semiconductor Quantum Dots presents an overview of the background and recent developments in the rapidly growing field of ultrasmall semiconductor microcrystallites, in which the carrier confinement is sufficiently strong to allow only quantized states of the electrons and holes.
GMW16552 - SEMICONDUCTOR CHANGE PROCESS SPECIFICATION - ENGLISH; ISSUE 1 Organization: GMW
Date: 2011-03-01
Description: This standard defines the GM Supplier Hardware Change Management Process for Semiconductor Part Changes. This process is the means by which the Electrical Component/Subsystem Supplier shall propose changes directly to GM, or to GM and GM's Integration Supplier when there is an Integration Supplier, due to Unexpected Part Shortages, part "end of life", part modifications, etc.
IEC 60747-14-3 - SEMICONDUCTOR DEVICES – PART 14-3: SEMICONDUCTOR SENSORS – PRESSURE SENSORS - EDITION 2.0 Organization: IEC
Date: 2009-04-01
Description: This part of IEC 60747 specifies requirements for semiconductor pressure sensors measuring absolute, gauge or differential pressures.
IEC 60747-14-4 - SEMICONDUCTOR DEVICES – DISCRETE DEVICES – PART 14-4: SEMICONDUCTOR ACCELEROMETERS - EDITION 1.0 Organization: IEC
Date: 2011-01-01
Description: This standard applies not only to typical semiconductor accelerometers with built-in electric circuits, but also to semiconductor accelerometers accompanied by external circuits.
CEI EN 60747-15 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES Organization: CEI
Date: 2012-10-01
Description: This part of IEC 60747 gives the requirements for isolated power semiconductor devices excluding devices with incorporated control circuits.
CENELEC - EN 60747-15 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES Organization: CENELEC
Date: 2012-03-01
Description: This part of IEC 60747 gives the requirements for isolated power semiconductor devices excluding devices with incorporated control circuits.
IEC 60747-15 - SEMICONDUCTOR DEVICES – DISCRETE DEVICES – PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES - EDITION 2.0 Organization: IEC
Date: 2010-12-01
Description: This part of IEC 60747 gives the requirements for isolated power semiconductor devices excluding devices with incorporated control circuits.
BSI - BS QC 750000 - DISCRETE SEMICONDUCTOR SERVICES: SECTIONAL SPECIFICATION - AMD 7208: OCTOBER 15, 1992 Organization: BSI
Date: 1986-12-31
Description: Procedures to be followed with discrete semiconductor devices (excluding optoelectronic devices); the possible group conditions for structurally similar devices; the requirements for quality conformance inspection and the various steps for screening.

1 - 20 of 5,436 results