Semiconductor Standards

015570-000000-000000 1 Scope 1.1 These requirements apply to semiconductor devices of the isolated-mounting type - thyristors, transistors, diodes, and the like, and hybrid modules consisting of combinations of these devices. 1.2 The term isolation, as used in this standard, refers to the...

4.1 This guide is intended to help analysts in the semiconductor industry. Examples of the usefulness of anion monitoring include: (1) determining when ion-exchange resin beds (in water-purification systems) need to be regenerated, and (2) ensuring that anion levels are low enough to allow...

4.1 PFAS are widely used in commercial and industrial applications worldwide (see Fig. 1). PFAS are of concern due to their documented persistence and their studied impacts on human health and the environmental. While there is no comprehensive source of information on the many individual PFAS...

5.1 Gamma-ray spectrometry is of use in identifying radionuclides and in making quantitative measurements. Use of a semiconductor detector is necessary for high-resolution measurements. 5.2 Variation of the physical geometry of the sample and its relationship with the detector will produce...

5.1 Silicon (Si), a metalloid, is the second most abundant element in the earth's crust. Various forms of silica (silicon dioxide SiO2) are found in quartz, sand, and rocks. The degradation of these rocks results in silica found in natural waters. Silica in natural waters can be found as ionic...

4.1 PFAS are widely used in commercial and industrial applications worldwide (see Fig. 1). PFAS are of concern due to their documented persistence and their studied impacts on human health and the environmental. While there is no comprehensive source of information on the many individual PFAS...

1.1 This guide covers the selection and use of neutron-activation detector materials to be employed in neutron spectra adjustment techniques used for radiation-hardness testing of electronic semiconductor devices. Sensors are described that have been used at many radiation hardness-testing...

609470-000040-000020 1 Scope This standard applies to a.c. semiconductor motor controllers and starters, which may include a series mechanical switching device, intended to be connected to circuits, the rated voltage of which does not exceed 1 000 V a.c. This standard characterizes a.c....

4.1 A variety of products and materials are irradiated with X-radiation to modify their characteristics and improve the economic value or to reduce their microbial population for health-related purposes. Dosimetry requirements might vary depending on the type and end use of the product. Some...

5.1 This guide describes an approach to validate a cleaning system for a medical device. It is based on the manufacturer's accurate and comprehensive understanding of their internal manufacturing and cleaning processes. 5.2 This guide is not intended to provide a detailed plan or road map, but will...

1.1 This guide provides illustrations of radiographs of semiconductors and related devices. Low powered transistors (through the TO-11 case configuration), diodes, low-power rectifiers, power devices, and integrated circuits are illustrated with common assembly features. Particular areas of...

002480-000130-000000 1 Scope 1.1 This Part is intended to be read together with the Standard for Low-Voltage Fuses - Part 1: General Requirements, hereafter referred to as Part 1. The titles of the Clauses in this Part correspond to the similarly titled Clauses in Part 1. The requirements of Part 1...

1.1 This guide covers procedures for determining the energy-differential fluence spectra of neutrons used in radiation-hardness testing of electronic semiconductor devices. The types of neutron sources specifically covered by this guide are fission or degraded energy fission sources used in...

1.1 This practice describes a procedure for characterizing particle irradiations of materials in terms of non-ionizing energy loss (NIEL). NIEL is used in published literature to characterize both charged and neutral particle irradiations. 1.2 Although the methods described in this practice apply...

1.1 This practice2 covers procedures for testing devices that are sealed prior to testing, such as semiconductors, hermetically enclosed relays, pyrotechnic devices, etc., for leakage through the walls of the enclosure. They may be used with various degrees of sensitivity (depending on the...

609470-000050-000010 1 Scope and object This part of IEC 60947 applies to control circuit devices and switching elements intended for controlling, signalling, interlocking, etc., of switchgear and controlgear. It applies to control circuit devices having a rated voltage not exceeding 1 000 V a.c....