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ASME PTC 19.2 - PRESSURE MEASUREMENT INSTRUMENTS AND APPARATUS SUPPLEMENT Organization: ASME
Date: 2010-10-29
Description: Information on pressure-measuring devices that are not normally used in field environments is given in the Nonmandatory Appendices A (Piston Gauges), B (Manometers), and C [Low-Absolute-Pressure (Vacuum) Instruments].
DIN EN 15001-1 - GAS INFRASTRUCTURE - GAS INSTALLATION PIPEWORK WITH AN OPERATING PRESSURE GREATER THAN 0,5 BAR FOR INDUSTRIAL INSTALLATIONS AND GREATER THAN 5 BAR FOR INDUSTRIAL AND NON-INDUSTRIAL INSTALLATIONS - PART 1: DETAILED FUNCTIONAL REQUIREMENTS FOR DESIGN, MATERIALS, CONSTRUCTION, INSPECTION AND TESTING Organization: DIN
Date: 2011-02-01
Description: Also excluded are LPG installations and sections of LPG installations operating at vapour pressure in the liquid state (e.g. between the storage vessel and any pressure regulator). In this standard, all pressures are gauge pressures unless otherwise stated. This standard has been harmonised to address the essential safety requirements of the Pressure Equipment Directive (PED, 97/23/EC) relevant for the joining of gas installation pipework (assemblies) falling within the scope of the PED.
BSI - BS EN 15001-1 - GAS INFRASTRUCTURE - GAS INSTALLATION PIPEWORK WITH AN OPERATING PRESSURE GREATER THAN 0,5 BAR FOR INDUSTRIAL INSTALLATIONS AND GREATER THAN 5 BAR FOR INDUSTRIAL AND NON-INDUSTRIAL INSTALLATIONS PART 1: DETAILED FUNCTIONAL REQUIREMENTS FOR DESIGN, MATERIALS, CONSTRUCTION, INSPECTION AND TESTING Organization: BSI
Date: 2009-10-31
Description: Also excluded are LPG installations and sections of LPG installations operating at vapour pressure in the liquid state (e.g. between the storage vessel and any pressure regulator). In this standard, all pressures are gauge pressures unless otherwise stated. This standard has been harmonised to address the essential safety requirements of the Pressure Equipment Directive (PED, 97/23/EC) relevant for the joining of gas installation pipework (assemblies) falling within the scope of the PED.
SAE J1394 - METRIC NONMETALLIC AIR BRAKE SYSTEM TUBING Organization: SAE
Date: 2013-06-01
Description: It is not intended to cover tubing for any portion of the system that operates below -40 ° C (-40 OF), above +93 °C (+200 OF), above a maximum working gage pressure of 1.0 MPa (150 psi), or in an area subject to attack by battery acid.
SAE J844 - NONMETALLIC AIR BRAKE SYSTEM TUBING Organization: SAE
Date: 2012-12-01
Description: It is not intended to cover tubing for any portion of the system which operates below -40 °C, above +93 °C, above a maximum working gage pressure of 1.0 MPa, or in an area subject to attack by battery acid.
DS/EN 1776 - GAS INFRASTRUCTURE - GAS MEASURING SYSTEMS - FUNCTIONAL REQUIREMENTS Organization: DS
Date: 2016-01-15
Description: Unless otherwise specified all pressures used in this European Standard are gauge pressures. For associated pressure regulating systems the requirements of EN 12186 and/or EN 12279 apply.
NBN - EN 1776 - GAS INFRASTRUCTURE - GAS MEASURING SYSTEMS - FUNCTIONAL REQUIREMENTS Organization: NBN
Date: 2016-01-29
Description: Unless otherwise specified all pressures used in this European Standard are gauge pressures.For associated pressure regulating systems the requirements of EN 12186 and/or EN 12279 apply.
NBN - EN 1776 - INFRASTRUCTURES GAZIÈRES - SYSTÈMES DE MESURE DE GAZ - PRESCRIPTIONS FONCTIONNELLES Organization: NBN
Date: 2016-01-29
Description: Unless otherwise specified all pressures used in this European Standard are gauge pressures.For associated pressure regulating systems the requirements of EN 12186 and/or EN 12279 apply.
NBN - EN 1776 - GAS INFRASTRUCTURE - GAS MEASURING SYSTEMS - FUNCTIONAL REQUIREMENTS Organization: NBN
Date: 2016-01-29
Description: Unless otherwise specified all pressures used in this European Standard are gauge pressures.For associated pressure regulating systems the requirements of EN 12186 and/or EN 12279 apply.
DIN EN 1776 - GAS INFRASTRUCTURE - GAS MEASURING SYSTEMS - FUNCTIONAL REQUIREMENTS Organization: DIN
Date: 2016-05-01
Description: Unless otherwise specified all pressures used in this European Standard are gauge pressures. For associated pressure regulating systems the requirements of EN 12186 and/or EN 12279 apply.
CEN - EN 1776 - GAS INFRASTRUCTURE - GAS MEASURING SYSTEMS - FUNCTIONAL REQUIREMENTS Organization: CEN
Date: 2015-12-01
Description: Unless otherwise specified all pressures used in this European Standard are gauge pressures. For associated pressure regulating systems the requirements of EN 12186 and/or EN 12279 apply.
IPC-C-1000 - IPC ESSENTIAL DOCUMENT COLLECTION FOR BOARD DESIGN, ASSEMBLY AND MANUFACTURE - TO PURCHASE HARDCOPY COMPILATION, CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE. STANDARDS FROM THIS COMPILATION ARE AVAILABLE AS INDIVIDUAL DOCUMENTS IN IHS STANDARDS EXPERT. SEE DETAILS FOR ADDITIONAL INFORMATION. Organization: IPC
Date: 2008-06-01
Description: 1071A: Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing 1601: Printed Board Handling and Storage Guidelines 2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards 2152: Standard for Determining Current Carrying Capacity in Printed Board Design 2221B: Generic Standard on Printed Board Design 2222A: Sectional Design Standard for Rigid Organic Printed Boards 2223C: Sectional Design Standard for Flexible Printed Boards 2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies 2226: Sectional Design Standard for High Density Interconnect (HDI) Boards 2251: Design Guide for the Packaging of High Speed Electronic Circuits 2252: Design Guide for RF/Microwave Circuit Boards 2316: Design Guide for Embedded Passive Device Printed Boards 2611: Generic Requirements for Electronic Product Documentation 2612: Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descript 2612-1: Sectional Requirements for Electronic Diagramming Symbol Generation Methodology 2614: Sectional Requirements for Board Fabrication Documentation 2615: Printed Board Dimensions and Tolerances 3406: Guidelines for Electrically Conductive Surface Mount Adhesives 3408: General Requirements for Anisotropically Conductive Adhesives Films 4101D: Specification for Base Materials for Rigid and Multilayer Printed Boards 4103A-WAM1: Specification for Base Materials for High Speed/High Frequency Applications 4104: Specification for High Density Interconnect (HDI) and Microvia Materials 4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boar 4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications 4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat 4202A: Flexible Base Dielectrics for Use in Flexible Printed Circuitry 4203A: Cover and Bonding Material for Flexible Printed Circuitry 4204A-WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry 4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement 4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards 4552-WAM1-2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit 4553A: Specification for Immersion Silver Plating for Printed Boards 4554: Specification for Immersion Tin Plating for Printed Circuit Boards 4556: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating fo 4562A: Metal Foil for Printed Board Applications 4563: Resin Coated Copper Foil for Printed Boards Guideline 4761: Design Guide for Protection of Printed Board Via Structures 4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend 4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed 4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printe 5701: Users Guide for Cleanliness of Unpopulated Printed Boards 5702: Guidelines for OEMs in Determining Accept Levels of Cleanliness of Unpopulated Printed Boards 5704: Cleanliness Requirements for Unpopulated Printed Boards 6011: Generic Performance Specification for Printed Boards 6012C: Qualification and Performance Specification for Rigid Printed Boards 6013C: Qualification and Performance Specification for Flexible Printed Boards 6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive De 6018B: Qualification and Performance Specification for High Frequency (Microwave) Printed Boards 7092: Design and Assembly Process Implementation for Embedded Components 7093: Design and Assembly Process Implementation for Bottom Termination Components 7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components 7095C: Design and Assembly Process Implementation for BGAs 7351B: Generic Requirements for Surface Mount Design and Land Pattern Standard 7526: Stencil and Misprinted Board Cleaning Handbook - FREE DOWNLOAD 7801: Reflow Oven Process Control Standard 9201A: Surface Insulation Resistance Handbook 9202: Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemic 9203: Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle 9252A: Requirements for Electrical Testing of Unpopulated Printed Boards 9641: High Temperature Printed Board Flatness Guideline 9691A: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Te 9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments 9702: IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects 9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability 9704A: Printed Circuit Assembly Strain Gage Test Guideline 9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder 9707: Spherical Bend Test Method for Characterization of Board Level Interconnects 9708: Test Methods for Characterization of Printed Board Assembly Pad Cratering 9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards A-600H: Acceptability of Printed Boards A-610F: Acceptability of Electronics Assembly A-620B: Requirements and Acceptance for Cable and Wire Harness Assemblies C-406: Design & Application Guidelines for Surface Mount Connectors CA-821: General Requirements for Thermally Conductive Adhesives CC-830B: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assembl CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies CM-770E: Component Mounting Guidelines for Printed Boards D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies D-325A: Documentation Requirements for Printed Boards D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Asse D-422: Design Guide for Press Fit Rigid Printed Board Back Planes DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards DR-572A: Drilling Guidelines for Printed Boards FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Pr HDBK-005: Guide to Solder Paste Assessment HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, T J-STD-003C-WAM1: Solderability Tests for Printed Boards J-STD-004B: Requirements for Soldering Fluxes J-STD-005A: Requirements for Soldering Pastes J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices J-STD-026: Semiconductor Design Standard for Flip Chip Applications J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations J-STD-028: Performance Standard for Construction of Flip Chip and Chip Scale Bumps J-STD-030A: Selection and Application of Board Level Underfill Materials J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Device J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes MC-790: Guidelines for Multichip Module Technology Utilization ML-960: Qualification and Performance Specification for Mass Lamination Panels for Multilayer print MS-810: Guidelines for High Volume Microsection QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards S-816: SMT Process Guideline & Checklist SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting SM-784: Guidelines for Chip-on-Board Technology Implementation SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments SM-817A: General Requirements for Dielectric Surface Mount Adhesives SM-840E: Qualification and Performance Specifiation of Permanent Solder Mask and Flexible Cover Mat TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology TR-486: Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress TR-579: Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs TR-583: An In-Depth Look At Ionic Cleanliness Testing WP/TR-584A: IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Prin WP-008: Setting Up Ion Chromatography Capability

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