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ASHRAE 90453 - THERMAL GUIDELINES FOR DATA PROCESSING ENVIRONMENTS - THIRD EDITION Organization: ASHRAE
Date: 2012-01-01
Description: This need was recognized by an industry consortium in 1999 that began a grassroots effort to provide a power density road map and to work toward standardizing power and cooling of the equipment for seamless integration into the data center. The Industry Thermal Consortium produced the first project of heat density trends.
ASHRAE 90577 - THERMAL GUIDELINES FOR DATA PROCESSING ENVIRONMENTS - FOURTH EDITION Organization: ASHRAE
Date: 2015-01-01
Description: This need was recognized by an industry consortium in 1999 that began a grassroots effort to provide a power density road map and to work toward standardizing power and cooling of the equipment for seamless integration into the data center. The Industry Thermal Consortium produced the first project of heat density trends.
ASHRAE 90443 - THERMAL GUIDELINES FOR DATA PROCESSING ENVIRONMENTS - SECOND EDITION Organization: ASHRAE
Date: 2009-01-01
Description: Unless otherwise stated, the thermal guidelines in this document refer to data center and other data processing environments.
SAE/TP - 2006-01-2111 - INTERFACING STRUCTURAL AND THERMAL TOOLS FOR THERMO-ELASTIC DISTORTION ANALYSIS Organization: SAE/TP
Date: 2006-07-17
Description: The aim of the presented activities is to provide a direct interface between neighbored disciplines as well as to improve the overall process of thermal distortion analysis by the provision of semi-automated calculation routines to replace time consuming hand calculations.
SAE/TP - 2006-01-2044 - GOCE INSTRUMENT THERMAL CONTROL Organization: SAE/TP
Date: 2006-07-17
Description: The temperature stability of the Core is done by a very stable active thermal control system and the passive use of the thermal heat capacity A second part is the Electronic Subsystem with the Front End Electronic Units (FEEU) and the Interface Unit Electronic (IUE). This second part of the Gradiometer is also thermally controlled by an active thermal control associated to a radiator.
ARINC 601 - CONTROL/DISPLAY INTERFACES Organization: ARINC
Date: 1981-02-10
Description: BASIC DESIGN STANDARDS for avionic equipment and its installation to assure suitable thermal interfaces (Chapter 2). B. DESIGN CRITERIA AND GUIDANCE TO provide further details concerning the equipment and installations (Chapter 3).
SAE/TP - 2007-01-3166 - THERMAL BALANCE TEST OF THE EUTEF PAYLOAD Organization: SAE/TP
Date: 2007-07-09
Description: The test has been performed with EuTEF Flight Model (FM) on the Passive Attach System to have representative thermal flight-like interfaces. Simulation of close-to-real flight environmental heat loads have been accomplished in a vacuum chamber (at INTESPACE, Toulouse-F) by means of a solar beam and a spin table suitably oriented to simulate a critical identified orbit, among all the possible on the ISS.
IEEE 1596 - STANDARD FOR SCALABLE COHERENT INTERFACE (SCI) - IEEE COMPUTER SOCIETY DOCUMENT Organization: IEEE
Date: 1992-03-19
Description: The CSR Architecture has become a unifying force for the latest generation of buses, encouraging VME and MULTIBUS® II users to use the CSR architecture as they interface to Futurebus+, thus facilitating a future interface to SCI as system requirements grow.
ASTM E2585 - STANDARD PRACTICE FOR THERMAL DIFFUSIVITY BY THE FLASH METHOD Organization: ASTM
Date: 2009-03-15
Description: Since the magnitude of porosity, pore shapes, and parameters of pore distribution influence the behavior of the thermal diffusivity, extreme caution must be exercised when analyzing data. Special caution is advised when other properties, such as thermal conductivity, are derived from thermal diffusivity obtained by this method.
SAE/TP - 2007-01-3028 - PROGRAMMABLE THERMOSTATS FOR MPLM SHELL HEATER CONTROL ULF1.1 THERMAL PERFORMANCES Organization: SAE/TP
Date: 2007-07-09
Description: Each thermostat has programmable temperature set points and control spans. The data acquisition system uses a standard RS-485 serial interface communications cable to provide digital control capability.
AIAA S-133-4 - SPACE PLUG-AND-PLAY ARCHITECTURE STANDARD PHYSICAL INTERFACE Organization: AIAA
Date: 2013-01-01
Description: Mechanical, thermal and electrical connector interface requirements are contained in this document.
MSFC-RQMT-2804 REV A - PROTEIN CRYSTAL GROWTH (PCG) SINGLE LOCKER THERMAL ENCLOSURE SYSTEM (STES) VERIFICATION REQUIREMENTS Organization: MSFC
Date: 2001-11-06
Description: In order to satisfy these requirements, this document addresses the following disciplines: electrical, electromagnetic, command and data handling, environmental, mechanical, structural, thermal, materials, human factors, performance, safety (including fire detection and suppression), and Ground Support Equipment (GSE).
SAE/TP - 2008-01-1992 - CUT RESISTANCE ANALYSIS OF GLOVE THERMAL MICROMETEOROID GARMENT MATERIALS FOR CONSTELLATION SPACE SUIT SYSTEMS DESIGN CONSIDERATIONS Organization: SAE/TP
Date: 2008-06-29
Description: During STS-116 extravehicular activity (EVA), a crewmember received a cut in the Glove Thermal Micrometeoroid Garment (TMG) as a result of contact with an unknown, external sharp object that did not meet sharp edge requirements.
DLA - SMD-5962-88675 - MICROCIRCUITS, DIGITAL, FAST CMOS, 8-BIT NONINVERTING BUS INTERFACE LATCH, TTL COMPATIBLE, MONOLITHIC SILICON Organization: DLA
Date: 1988-09-06
Description: . × .090"), flat package L D-9 (24-lead, 1.280" ×.310" × .200"), dual-in-line package 3 C-4 (28-terminal, .460" × .460" × .100"), square chip carrier package Supply voltage range (VCC) - - - - - - - - - - - - - - - - −0.5 V dc to +6.0 V dc Input voltage range - - - - - - - - - - - - - - - - - - - - −0.5 V dc to VCC +0.5 V dc Output voltage range - - - - - - - - - - - - - - - - - - - −0.5 V dc to VCC +0.5 V dc DC input diode current (IIK) - - - - - - - - - - - - - - - ±20mA DC output diode current (IOK) - - - - - - - - - - - - - - - ±50 mA DC output current - - - - - - - - - - - - - - - - - - - - - ±100mA Maximum power dissipation (PD) 2/ - - - - - - - - - - - - - - 500 mW Thermal resistance, junction-to-case (θJC): Cases K, L, and 3 - - - - - - - - - - - - - - - - - - - - See MIL-M-38510, appendix C Storage temperature range - - - - - - - - - - - - - - - - - −65°C to +150°C Junction temperature (TJ) - - - - - - - - - - - - - - - - - +175°C Lead temperature (soldering, 10 seconds)- - - - - - - - - - +300°C Supply voltage (VCC) - - - - - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Maximum logic low voltage (VIL) - - - - - - - - - - - - 0.8 V dc Minimum logic high voltage (VIH) - - - - - - - - - - - - 2.0 V dc Case operating temperature range (TC)- - - - - - - - - - −55°C to +125°C Minimum setup time, data to LE (ts): Device type 01 - - - - - - - - - - - - - - - - - - - - 2.5 ns Device type 02 - - - - - - - - - - - - - - - - - - - - 2.5 ns Minimum hold time, data to LE (th): Device type 01 - - - - - - - - - - - - - - - - - - - - 3.0 ns Device type 02 - - - - - - - - - - - - - - - - - - - - 2.5 ns Maximum preset recovery time, low to high (trem): Device type 01 - - - - - - - - - - - - - - - - - - - - 17.0 ns Device type 02 - - - - - - - - - - - - - - - - - - - - 13.0 ns Maximum clear recovery time, low to high (trem): Device type 01 - - - - - - - - - - - - - - - - - - - - 17.0 ns Device type 02 - - - - - - - - - - - - - - - - - - - - 10.0 ns Minimum LE pulse width, high (tw): Device type 01 - - - - - - - - - - - - - - - - - - - - 6.0 ns Device type 02 - - - - - - - - - - - - - - - - - - - - 4.0 ns Minimum preset pulse width, low (tw): Device type 01 - - - - - - - - - - - - - - - - - - - - 9.0 ns Device type 02 - - - - - - - - - - - - - - - - - - - - 4.0 ns Minimum clear pulse width, low (tw): Device type 01 - - - - - - - - - - - - - - - - - - - - 9.0 ns Device type 02 - - - - - - - - - - - - - - - - - - - - 4.0 ns
DLA - SMD-5962-88674 - MICROCIRCUITS, DIGITAL, FAST CMOS, 8-BIT, NONINVERTING , BUS INTERFACE REGISTERS, TTL COMPATIBLE, MONOLITHIC SILICON Organization: DLA
Date: 1988-09-15
Description: The complete part number shall be as shown in the following example: The device types shall identify the circuit function as follows: Device type Generic number Circuit function 01 54FCT825A 8-bit, non-inverting, bus interface registers, TTL compatible 02 54FCT825B 8-bit, non-inverting, bus interface registers, TTL compatible The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows: Outline letter Case outline K F-6 (24-lead, .640" × .420" × .090) flat package L D-9 (24-lead, 1.280" × .310" × .200") dual-in-line package 3 C-4 (28-terminal, .460" × .460" × .100") square chip carrier package Supply voltage (VCC) - - - - - - - - - - - - - - - - −0.5 V dc to +6.0 V dc Input voltage range - - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc Output voltage range - - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc DC input diode current (IIK) - - - - - - - - - - - - ±20 mA DC output diode current (IOK) - - - - - - - - - - - ±50 mA DC output current - - - - - - - - - - - - - - - - - ±100 mA Maximum power dissipation (PD) 2/ - - - - - - - - - 500 mW Thermal resistance. junction-to-case (θJC): Cases K, L, and 3 - - - - - - - - - - - - - - - - See MIL-M-38510, appendix C Storage temperature range - - - - - - - - - - - - - −65°C to +150° C Junction temperature (TJ) - - - - - - - - - - - - - +175°C Lead temperature (soldering, 10 seconds) - - - - - - +300°C Supply voltage (VCC) - - - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Maximum logic low voltage (VIL) - - - - - - - - - - 0.8 V dc Minimum logic high voltage (VIH) - - - - - - - - - - 2.0 V dc Case operating temperature range (TC) - - - - - - - −55°C to +125°C Minimum setup time, Data to CP (ts): Device type 01 - - - - - - - - - - - - - - - - - - 4.0 ns Device type 02 - - - - - - - - - - - - - - - - - - 3.0 ns Minimum hold time, Data to CP (th): Device type 01 - - - - - - - - - - - - - - - - - - 2.0 ns Device type 02 - - - - - - - - - - - - - - - - - - 1.5 ns Minimum setup time, [E bar][N bar] to CP (ts): Device type 01 - - - - - - - - - - - - - - - - - - 4.0 ns Device type 02 - - - - - - - - - - - - - - - - - - 3.0 ns Minimum hold time, [E bar][N bar] to CP (th): Device type 01 - - - - - - - - - - - - - - - - - - 2.0 ns Device type 02 - - - - - - - - - - - - - - - - - - 0.0 ns Minimum [C bar][L bar][R bar] recovery time, low to high (trem): Device type 01 - - - - - - - - - - - - - - - - - - 7.0 ns Device type 02 - - - - - - - - - - - - - - - - - - 6.0 ns Minimum CP width, low or high (tW): Device type 01 - - - - - - - - - - - - - - - - - - 7.0 ns Device type 02 - - - - - - - - - - - - - - - - - - 6.0 ns Minimum [C bar][L bar][R bar] pulse width, low (tW): Device type 01 - - - - - - - - - - - - - - - - - - 7.0 ns Device type 02 - - - - - - - - - - - - - - - - - - 6.0 ns
DS/ISO 10368 - FREIGHT THERMAL CONTAINERS - REMOTE CONDITION MONITORING Organization: DS
Date: 2006-04-25
Description: This International Standard establishes the information and interfaces required to permit complyingcentral monitoring and control systems employed by one carrier or terminal to interface andcommunicate with complying remote communication devices of differing manufacture andconfiguration used by other carriers and terminals.
ARINC 408A - AIR TRANSPORT INDICATOR CASES AND MOUNTING Organization: ARINC
Date: 1976-12-15
Description: This document provides 1) dimensional and thermal data for aircraft indicators and 2) thermal interface data between the indicators and their operating environment.
NEMA - C12.18 - PROTOCOL SPECIFICATION FOR ANSI TYPE 2 OPTICAL PORT Organization: NEMA
Date: 2006-05-02
Description: The NEMA Smart Meter Package provides the requirements and guidance on electricity metering, watt hour meter sockets, device data tables, meter interfacing to data communication networks and type 2 optical ports.
NEMA - ANSI C12.11 - FOR INSTRUMENT TRANSFORMERS FOR REVENUE METERING 10KV BIL THROUGH 350 KV BIL (0.6 KV NSV THROUGH 69 KV NSV) Organization: NEMA
Date: 2007-01-01
Description: The NEMA Smart Meter Package provides the requirements and guidance on electricity metering, watt hour meter sockets, device data tables, meter interfacing to data communication networks and type 2 optical ports.
MSFC-HDBK-3051 REV A - MICROGRAVITY SCIENCE GLOVEBOX (MSG) CAPABILITIES MANUAL Organization: MSFC
Date: 2002-10-16
Description: The manual includes information in the following areas: general system description, mechanical and electrical interfaces, power, video, command and data, thermal conditioning, vacuum resource and exhaust, Nitrogen, experiment material handling, working envelopes and MSG outfitting equipment.

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