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ARINC 601 - CONTROL/DISPLAY INTERFACES Organization: ARINC
Date: 1981-02-10
Description: BASIC DESIGN STANDARDS for avionic equipment and its installation to assure suitable thermal interfaces (Chapter 2). B. DESIGN CRITERIA AND GUIDANCE TO provide further details concerning the equipment and installations (Chapter 3).
IEEE 1596 - STANDARD FOR SCALABLE COHERENT INTERFACE (SCI) - IEEE COMPUTER SOCIETY DOCUMENT Organization: IEEE
Date: 1992-03-19
Description: The CSR Architecture has become a unifying force for the latest generation of buses, encouraging VME and MULTIBUS® II users to use the CSR architecture as they interface to Futurebus+, thus facilitating a future interface to SCI as system requirements grow.
WRC BUL 456 - HEAT EXCHANGER FLOW CHARACTERIZATION—HXFLOW SOFTWARE: THEORY DOCUMENT AND USERS MANUAL - TO PURCHASE CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE Organization: WRC
Date: 2000-11-01
Description: • 30 degree, 45 degree, 60 degree and 90 degree tube layout • Single and Double segmental baffles • Impingement Plate included in the model • All data input using a Graphical User Interface, where the user is guided by numerous on-screen sketches • Capability to revise the grid density used for the solution process • Both parallel-to and cross-flow velocity distribution along any tube in the tube bundle • Graphical and numerical display of the results
ASTM E2585 - STANDARD PRACTICE FOR THERMAL DIFFUSIVITY BY THE FLASH METHOD Organization: ASTM
Date: 2009-03-15
Description: This practice covers practical details associated with the determination of the thermal diffusivity of primarily homogeneous isotropic solid materials. Thermal diffusivity values ranging from 10-7 to 10-3m 2/s are readily measurable by this from about 75 to 2800 K.
SAE/TP - 2008-01-2074 - CHARACTERIZATION OF THERMAL SYSTEM PERFORMANCE FOR CONTROL APPLICATIONS USING TMG FINITE ELEMENT SIMULATION Organization: SAE/TP
Date: 2008-06-29
Description: In order to determine the frequency response of several sample thermal systems, finite element models were constructed using IDEAS, and their thermal behavior was analyzed using the TMG thermal solver. A custom user-defined subroutine was written to interface with the TMG solver and generate Bode plots (frequency response curves).
ASTM F1982 - STANDARD TEST METHODS FOR ANALYZING ORGANIC CONTAMINANTS ON SILICON WAFER SURFACES BY THERMAL DESORPTION GAS CHROMATOGRAPHY Organization: ASTM
Date: 1999-06-10
Description: 1.6 Safety precautions must be followed when handling organic solvents and compounds, hot materials subjected to propane flame, the propane flame itself, wafer thermal desorption systems, rapid thermal annealer, or a high temperature furnace.
TSE - TS EN 253 - PREINSULATED BONDED PIPE SYSTEMS FOR UNDERGROUND HOT WATER NETWORKS-PIPE ASSEMBLY OF STEEL SERVICE PIPES, POLYURETHANE THERMAL INSULATION AND OUTER CASING OF POLYETHYLENE Organization: TSE
Date: 1996-09-03
Description: This standard; defines terms of interest to the users of wall coverings that are suplied in roll form for hanging on to walls and ceilings by means of an adhesive covering the whole of the interface between the wallcovering and the support
MSFC-HDBK-3051 REV A - MICROGRAVITY SCIENCE GLOVEBOX (MSG) CAPABILITIES MANUAL Organization: MSFC
Date: 2002-10-16
Description: The manual includes information in the following areas: general system description, mechanical and electrical interfaces, power, video, command and data, thermal conditioning, vacuum resource and exhaust, Nitrogen, experiment material handling, working envelopes and MSG outfitting equipment.
SAE/TP - 2009-01-2533 - ALSSAT DEVELOPMENT STATUS Organization: SAE/TP
Date: 2009-07-12
Description: The latest ALSSAT related publication in ICES 2004 detailed the development status of ALSSAT including the completion of all six ELS subsystems (ELSS), namely, the Air Management Subsystem, Biomass Subsystem, Food Management Subsystem, Solid Waste Management Subsystem, the Water Management Subsystem, and the Thermal Control Subsystem as well as two external interfaces, including the Extravehicular Activity and Human Accommodations.
ASTM E1677 - STANDARD SPECIFICATION FOR AIR BARRIER (AB) MATERIAL OR SYSTEM FOR LOW-RISE FRAMED BUILDING WALLS Organization: ASTM
Date: 2011-09-01
Description: No standardized test has been developed that adequately identifies all of the influencing factors and measures the impact of this effect on the wall's thermal performance. The specifications in this standard are not intended to be utilized for energy load calculations and are not based on an expected level of energy consumption.
SAE/TP - 2006-01-2050 - THE PERSONAL COMPUTER TRANSPORT ANALYZER PROGRAM Organization: SAE/TP
Date: 2006-07-17
Description: It was decided that the most effective way to achieve a user-friendly interface was to develop a C++ object-oriented Windows language (heat and mass) transport phenomena analysis program.
ASTM F1269 - STANDARD TEST METHODS FOR DESTRUCTIVE SHEAR TESTING OF BALL BONDS Organization: ASTM
Date: 2013-01-01
Description: These test methods cover tests to determine the shear strength of a series of ball bonds made by either thermosonic or thermal compression techniques using either gold or copper wires.
BRE FB42 - U-VALUE CONVENTIONS IN PRACTICE WORKED EXAMPLES USING BR 443 Organization: BRE
Date: 2012-01-01
Description: INTRODUCTION With the development of energy calculation tools such as the Standard Assessment Procedure (SAP)[1] and the Simplified Building Energy Model (SBEM together with its user interface iSBEM)[2], which support the national building regulations for conservation of fuel and power[3–5], as well as the production of Energy Performance Certificates, there is a need for the industry to calculate U-values and thermal mass values reliably for a range of construction types.
IEEE 1156.2 - ENVIRONMENTAL SPECIFICATIONS FOR COMPUTER SYSTEMS - IEEE COMPUTER SOCIETY Organization: IEEE
Date: 1996-06-20
Description: For example, the modules are conduction or convection cooled and a system-level thermal "model" is required to determine the relationship and compatibility between the module's heat sink and the system-level cooling medium.
IEEE 1156.1 - MICROCOMPUTER ENVIRONMENTAL SPECIFICATION FOR COMPUTER MODULES - IEEE COMPUTER SOCIETY; STABILIZED: 19 MARCH 2009 Organization: IEEE
Date: 1993-01-01
Description: For example, in some applications, the modules are conduction cooled and a system-level thermal "model" is required to determine the relationship between the module's heat sink and the system-level cooling medium.
ASTM E2582 - STANDARD PRACTICE FOR INFRARED FLASH THERMOGRAPHY OF COMPOSITE PANELS AND REPAIR PATCHES USED IN AEROSPACE APPLICATIONS Organization: ASTM
Date: 2007-07-01
Description: Excessively thick samples, or samples with low thermal diffusivities, require long acquisition periods and yield weak signals approaching background and noise levels, and may be impractical for this technique.
ASTM F2166 - STANDARD PRACTICES FOR MONITORING NON-CONTACT DIELECTRIC CHARACTERIZATION SYSTEMS THROUGH USE OF SPECIAL REFERENCE WAFERS Organization: ASTM
Date: 2002-01-10
Description: These practices describe the use of wafers with special electrical and physical characteristics for controlling and monitoring performance of non-contact dielectric characterization systems (NCDCS) that employ corona. Thermally oxidized wafers are not sufficient for this purpose because of parametric drift due to temperature-bias stressing and exposure to the atmosphere.
ASTM D149 - STANDARD TEST METHOD FOR DIELECTRIC BREAKDOWN VOLTAGE AND DIELECTRIC STRENGTH OF SOLID ELECTRICAL INSULATING MATERIALS AT COMMERCIAL POWER FREQUENCIES Organization: ASTM
Date: 2009-10-01
Description: This test method is not intended for use in determining intrinsic dielectric strength, direct-voltage dielectric strength, or thermal failure under electrical stress (see Test Method D3151).
IPC-2152 - STANDARD FOR DETERMINING CURRENT CARRYING CAPACITY IN PRINTED BOARD DESIGN Organization: IPC
Date: 2009-08-01
Description: Thermal Resistance The resistance of a material to the passage of thermal energy, usually measured in degrees °C/W.
ASTM D4545 - STANDARD PRACTICE FOR DETERMINING THE INTEGRITY OF FACTORY SEAMS USED IN JOINING MANUFACTURED FLEXIBLE SHEET GEOMEMBRANES Organization: ASTM
Date: 1986-03-03
Description: 1.2 The types of factory seams covered by this practice include the following: 1.2.1 Thermally Bonded Seams: 1.2.1.1 Dielectric--A dielectric seam is produced by clamping two lapped sheets of polymeric membrane between two conductive bars and applying an electric current to the bars, thus producing a field that generates friction heat at the interface between the two sheets to melt the surfaces.

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