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DS/EN 62047-2 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 2: TENSILE TESTING METHOD OF THIN FILM MATERIALS Organization: DS
Date: 2006-12-19
Description: This International Standard specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 ìm, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices.
IEC 62047-2 - SEMICONDUCTOR DEVICES – MICRO-ELECTROMECHANICAL DEVICES – PART 2: TENSILE TESTING METHOD OF THIN FILM MATERIALS - EDITION 1.0 Organization: IEC
Date: 2006-08-01
Description: This International Standard specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 μm, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices.
CENELEC - EN 62047-6 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 6: AXIAL FATIGUE TESTING METHODS OF THIN FILM MATERIALS Organization: CENELEC
Date: 2010-03-01
Description: This International Standard specifies the method for axial tensile–tensile force fatigue testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 μm and 10 μm under constant force range or constant displacement range.
DS/EN 62047-18 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS Organization: DS
Date: 2013-10-08
Description: IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre.
DS/EN 62047-6 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 6: AXIAL FATIGUE TESTING METHODS OF THIN FILM MATERIALS Organization: DS
Date: 2010-04-09
Description: IEC 62047-6:2009 specifies the method for axial tensile-tensile force fatigue testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 µm and 10 µm under constant force range or constant displacement range.
IEC 62047-18 - SEMICONDUCTOR DEVICES – MICRO-ELECTROMECHANICAL DEVICES – PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS - EDITION 1.0 Organization: IEC
Date: 2013-07-01
Description: This part of IEC 62047 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 μm and 10 μm.
CEI EN 62047-18 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS Organization: CEI
Date: 2014-04-01
Description: This part of IEC 62047 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 μm and 10 μm.
CENELEC - EN 62047-18 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS Organization: CENELEC
Date: 2013-09-01
Description: This part of IEC 62047 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 μm and 10 μm.
DIN EN 62047-18 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BENDING TEST METHODS OF THIN FILM MATERIALS (IEC 47F/76/CD:2011) Organization: DIN
Date: 2011-06-01
Description: This international standard specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0.1 μm and 10 μm.
CENELEC - EN 62047-3 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING Organization: CENELEC
Date: 2006-09-01
Description: This International Standard specifies a standard test piece, which is used to guarantee the propriety and accuracy of a tensile testing system for thin film materials with length and width under 1 mm and thickness under 10 µm, which are main structural materials for microelectromechanical systems (MEMS), micromachines and similar devices.
IEC 62047-3 - SEMICONDUCTOR DEVICES – MICRO-ELECTROMECHANICAL DEVICES – PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING - EDITION 1.0 Organization: IEC
Date: 2006-08-01
Description: This International Standard specifies a standard test piece, which is used to guarantee the propriety and accuracy of a tensile testing system for thin film materials with length and width under 1 mm and thickness under 10 µm, which are main structural materials for microelectromechanical systems (MEMS), micromachines and similar devices.
DS/EN 62047-3 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING Organization: DS
Date: 2006-12-19
Description: This International Standard specifies a standard test piece, which is used to guarantee thepropriety and accuracy of a tensile testing system for thin film materials with length and widthunder 1 mm and thickness under 10 µm, which are main structural materials for microelectromechanical systems (MEMS), micromachines and similar devices.
UL 61646 - UL STANDARD FOR SAFETY THIN-FILM TERRESTRIAL PHOTOVOLTAIC (PV) MODULES – DESIGN QUALIFICATION AND TYPE APPROVAL - FIRST EDITION Organization: UL
Date: 2012-01-25
Description: Scope and object This International Standard lays down requirements for the design qualification and type approval of terrestrial, thin-film photovoltaic modules suitable for long-term operation in general open-air climates as defined in IEC 60721-2-1.
BSI - BS EN 61646 - THIN-FILM TERRESTRIAL PHOTOVOLTAIC (PV) MODULES - DESIGN QUALIFICATION AND TYPE APPROVAL - CORR: AUGUST 31, 2009 Organization: BSI
Date: 2009-07-31
Description: Scope and object This International Standard lays down requirements for the design qualification and type approval of terrestrial, thin-film photovoltaic modules suitable for long-term operation in general open-air climates as defined in IEC 60721-2-1.
DS/EN 61646 - THIN-FILM TERRESTRIAL PHOTOVOLTAIC (PV) MODULES - DESIGN QUALIFICATION AND TYPE APPROVAL Organization: DS
Date: 2008-10-31
Description: This International Standard lays down requirements for the design qualification and type approval of terrestrial, thin-film photovoltaic modules suitable for long-term operation in general open-air climates as defined in IEC 60721-2-1.
CEI EN 61646 - THIN-FILM TERRESTRIAL PHOTOVOLTAIC (PV) MODULES - DESIGN QUALIFICATION AND TYPE APPROVAL Organization: CEI
Date: 2012-10-01
Description: Scope and object This International Standard lays down requirements for the design qualification and type approval of terrestrial, thin-film photovoltaic modules suitable for long-term operation in general open-air climates as defined in IEC 60721-2-1.
WSPC - PHYS TECH THN FILMS IWTF 2003 - PHYSICS AND TECHNOLOGY OF THIN FILMS, IWTF 2003 PROCEEDINGS OF THE INTERNATIONAL WORKSHOP Organization: WSPC
Date: 2004-06-08
Description: Thin films science and technology plays an important role in the high-tech industries. Thin film technology has been developed primarily for the need of the integrated circuit industry.
TTP - ADVANCES ON MATERIALS ENG - ADVANCES ON MATERIALS ENGINEERING Organization: TTP
Date: 2013-11-07
Description: The 46 papers are grouped as follows: Chapter 1: Reinforced Materials, Structural Materials and Engineering; Chapter 2: Concrete and Cement, Mortars; Chapter 3: Materials Processing Technology; Chapter 4: Energy, Electric and Optics Materials; Chapter 5: Nanomaterials and Nanotechnologies; Chapter 6: Bio- and Environment Materials; Chapter 7: Thin Films; Chapter 8: Polymers, Alloys and Other Materials Technologies.
TTP - KEY ENGE MATE III - KEY ENGINEERING MATERIALS III Organization: TTP
Date: 2013-07-13
Description: The 85 papers are grouped as follows: Chapter 1: Novel Composite Materials and their Characterization; Chapter 2: Advances in Materials Technology; Chapter 3: Developments in Magnetic Materials, Electrical Composites, Thin Films and ZnO Technology; Chapter 4: More Studies on Nano Materials, Nano Composites and Nano Technology; Chapter 5: Developments in Biocomposites, Bioethanol and Green Materials; Chapter 6: Lightweight Foamed Concrete, Foamed Greencrete, Cement Syntactic Foam; Chapter 7: Chemical Engineering, Corrosion, Geochemistry and Geotextile; Chapter 8: Advances in Manufacturing Techniques; Chapter 9: Wastewater Treatment and Biotechnology; Chapter 10: Analysis of Composite Structures and Other Miscellaneous Researches.
TTP - APPLIED PHYSICS AND MATER - APPLIED PHYSICS AND MATERIAL APPLICATIONS Organization: TTP
Date: 2013-10-25
Description: Contributed by scientists working in physics, engineering, materials science, chemistry, and other areas mainly in Asia, papers relate to applied physics, materials sciences, and applications, including the preparation, characterization, properties, performance, photocatalytic activities, effects, synthesis, design, measurement, temperature, luminescence, fabrication, thermal conductivity, and other aspects of glasses, ceramics, thin films, composites, rubber, and compounds.

1 - 20 of 46 results