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SAE AS7112/6 - NATIONAL AEROSPACE AND DEFENSE CONTRACTORS ACCREDITATION PROGRAM TITANIUM 3AL-2.5V ALLOY, SEAMLESS HYDRAULIC TUBING MANUFACTURING REQUIREMENTS Organization: SAE
Date: 2004-03-01
Description: In addition to the requirements specified in AS 7112, the requirements specified herein shall apply to suppliers seeking Nadcap Fluid System accreditation for manufacturing titanium 3AI-2.5V alloy, seamless hydraulic tubing. The corresponding PRI Audit Criteria (AC) is to be applied to ensure the tubing is manufactured to the applicable specification(s) and standard(s).
PACKT - CREATING MBL APPS APPCELE - CREATING MOBILE APPS WITH APPCELERATOR TITANIUM Organization: PACKT
Date: 2013-10-25
Description: Creating Mobile Apps with Appcelerator Titanium provides a hands-on approach and working examples on creating apps and games as well as embedding them onto a social networking website.
SAE/TP - 2007-01-3839 - ADVANCED LOW-COST TITANIUM-ALLOY MATERIALS FOR AEROSPACE FASTENER APPLICATIONS Organization: SAE/TP
Date: 2007-09-17
Description: A new, potentially lower-cost approach for the production of advanced titanium and titanium-alloy materials has been demonstrated using cryogenic technology.
DLA - MIL-M-38510/505C - MICROCIRCUITS, DIGITAL, BIPOLAR PROGRAMMABLE LOGIC, MONOLITHIC SILICON Organization: DLA
Date: 2006-01-24
Description: This specification covers the detail requirements for monolithic silicon, bipolar, programmable logic microcircuits which employ titanium tungsten resistors as the fusible link or programming element.
DLA - MIL-M-38510/504B - MICROCIRCUITS, DIGITAL, BIPOLAR PROGRAMMABLE LOGIC, MONOLITHIC SILICON Organization: DLA
Date: 2005-10-28
Description: This specification covers the detail requirements for monolithic silicon, bipolar, programmable logic microcircuits which employ titanium tungsten (TiW) resistors as the fusible link or programming element.
NASA - MSFC-STD-557 - THREADED FASTENERS, 6A1-4V TITANIUM ALLOY, USAGE CRITERIA FOR SPACECRAFT APPLICATIONS Organization: NASA
Date: 2005-02-01
Description: This standard establishes criteria for use of 6Al-4V titanium alloy threaded fastener systems for spacecraft and associated equipment.
MSFC-STD-557 REV B - THREADED FASTENERS, TITANIUM ALLOYS, USAGE CRITERIA FOR LAUNCH VEHICLES AND SPACECRAFT APPLICATIONS Organization: MSFC
Date: 2012-02-15
Description: This standard establishes criteria for use of 6Al-4V titanium alloy threaded fastener systems for spacecraft and associated equipment.
NPFC - MIL-M-38510/208 - MICROCIRCUIT, DIGITAL, 4096-BIT SCHOTTKY, BIPOLAR, PROGRAMMABLE READ-ONLY MEMORY (PROM), MONOLITHIC SILICON Organization: NPFC
Date: 2013-08-21
Description: This specification covers the detail requirements for monolithic silicon, programmable read-only memory (PROM) microcircuits which employ thin film nichrome (NiCr) resistors, titanium-tungsten (TiW), or zapped vertical emitter (ZVE) as the fusible link or programming element.
NPFC - MIL-M-38510/210 - MICROCIRCUIT, DIGITAL, 16,384 BIT SCHOTTKY, BIPOLAR, PROGRAMMABLE READ-ONLY MEMORY (PROM), MONOLITHIC SILICON Organization: NPFC
Date: 2013-06-19
Description: This specification covers the detail requirements for monolithic silicon, programmable read-only memory (PROM) microcircuits which employ thin film nichrome (NiCr) resistors, platinum-silicide, tungsten (W), titanium-tungsten (TiW) or zapped vertical emitter as the fusible link or programming element.
NPFC - MIL-M-38510/209 - MICROCIRCUIT, DIGITAL, 8192-BIT, SCHOTTKY, BIPOLAR, PROGRAMMABLE READ-ONLY MEMORY (PROM), MONOLITHIC SILICON Organization: NPFC
Date: 2014-04-21
Description: This specification covers the detail requirements for monolithic silicon, PROM microcircuits which employ thin film nichrome (NiCr) resistors, zapped vertical emitter, tungsten (W), titanium tungsten (TiW), or platinum silicide as the fusible link or programming element. Two product assurance class and a choice of case outlines and lead finishes are provided for each type and are reflected in the complete part number.
NPFC - MIL-M-38510/211 - MICROCIRCUITS, DIGITAL, 32,768 BIT SCHOTTKY, BIPOLAR, PROGRAMMABLE READ-ONLY MEMORY (PROM), MONOLITHIC SILICON Organization: NPFC
Date: 2012-04-13
Description: This specification covers the detail requirements for monolithic silicon, PROM microcircuits which employ thin film nichrome resistors (NiCr), titanium-tungsten (TiW), or zapped vertical emitter as the fusible link or programming element.
SAE/TP - 2008-01-2149 - BETA-TITANIUM ALLOY THERMAL PROTECTION SYSTEM FOR RE-ENTRY VEHICLES Organization: SAE/TP
Date: 2008-06-29
Description: From the early beginning of space programs metallic Thermal Protection Systems (TPS) have been considered as promising technology to protect space vehicles against the severe aerodynamic heating encountered during re-entry into earth's atmosphere.
DLA - DESC-DWG-81036 REV J - MICROCIRCUITS, MEMORY, PROGRAMMABLE LOGIC, MONOLITHIC SILICON Organization: DLA
Date: 1989-12-04
Description: The complete part number shall be as shown in the following example: The device types shall identify the circuit function as follows: Device type Generic number Circuit function 01, 07, 11 PAL16L8, L8A, L8A-2 16-input 8-output AND-OR invert gate array 02, 08, 12 PAL16R8, R8A, R8A-2 16-input 8-output registered AND-OR gate array 03, 09, 13 PAL16R6, R6A, R6A-2 16-input 6-output registered AND-OR gate array 04, 10, 14 PAL16R4, R4A, R4A-2 16-input 4-output registered AND-OR gate array 05 PAL16X4 16-input 4-output registered AND-OR exclusive OR gate array 06 PAL16A4 16-input 4-output registered and-carry-or exclusive OR gate array The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows: Outline letter Case outline R D-8 (20-lead, 1.060″ ×.310″ ×.200″), dual-in-line package S F-9 (20-lead, .540″ × .300 × .100″), flat package 1/ 2 C-2 (20-terminal, .358″ × .100″), square chip carrier package Supply voltage (platinum-silicide) - - - - - - - - - - - −0.5 to +7.0 V dc Supply voltage (titanium-tungsten) - - - - - - - - - - - −0.5 to +12.0 V dc Input voltage range- - - - - - - - - - - - - - - - - - - −0.5 to +5.5 V dc Storage temperature range- - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - - +260°C Thermal resistance, junction-to-case (θJC) 2/ - - - - - See MIL-M-38510, appendix C Output voltage applied - - - - - - - - - - - - - - - - - −0.5 V to VCC maximum dc 3/ Output sink current- - - - - - - - - - - - - - - - - - - 100 mA Maximum power dissipation (PD) 4/ Device types 01, 02, 03, 04, 05, and 06- - - - - - - - 2.0 W Device types 07, 08, 09, and 10- - - - - - - - - - - - 1.0 W Device types 11, 12, 13, and 14- - - - - - - - - - - - .5 W Maximum junction temperature (TJ)- - - - - - - - - - - - +175°C Supply voltage - - - - - - - - - - - - - - - - - - - - - 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage - - - - - - - - - - - - 2.0 V dc Maximum low level input voltage - - - - - - - - - - - - 0.8 V dc Case operating temperature range (TC) - - - - - - - - - −55°C to +125°C
SAE/TP - 2011-01-2570 - DEVELOPMENT OF A NUTATION DAMPER RESERVOIR MECHANISM Organization: SAE/TP
Date: 2011-10-18
Description: The passive damper is fully filled with a custom-blended silicone and comprised of 1-inch titanium tubing formed into a racetrack shape measuring approximately 35 inches wide and 27 inches high.
ESDU 85031 - CRACK RESISTANCE CURVES. Organization: ESDU
Date: 1995-11-01
Description: ESDU 85031 provides R-curves for several aluminium, steel and titanium aerospace sheet materials in SI and British (lbf, in) units on transparencies for overlaying on plots of stress intensity factor against crack length appropriate to the user's structure (matching blank grids are provided to draw those curves).
SAE/TP - 2011-01-2535 - SOLUTION FOR AUTOMATED FRAME DRILLING AND FASTENING SYSTEM USING AN 840D CONTROLLED STANDARD ROBOT Organization: SAE/TP
Date: 2011-10-18
Description: As one answer of these questions, a new innovative robot cell has been developed for drilling and fastener insertion in the inner structure of aircraft parts consisting of composite, titanium and aluminum. The new robot cell is based on a scalable 840D system configuration.
SAE/TP - 2007-01-3927 - REDUCING DESIGN TIME, PART COST, AND MANUFACTURING RISK ON NEW AIRPLANE PROJECTS USING INTELLIGENT SOFTWARE SOLUTIONS Organization: SAE/TP
Date: 2007-09-17
Description: Boeing Commercial Airplanes used a unique knowledgebased software solution to analyze one of the most complicated jetliner parts: the titanium part joining the wing to the aircraft body. This part is costly to design and manufacture, and it presents project risks since the company previously made similar parts from aluminum.
NASA-STD-5009 - NONDESTRUCTIVE EVALUATION REQUIREMENTS FOR FRACTURE CRITICAL METALLIC COMPONENTS Organization: NASA
Date: 2008-04-07
Description: Tailoring for application to a specific program or project shall be formally documented as part of program or project requirements and approved by the Technical Authority.
ESDU 03004 - FOULING IN COOLING SYSTEMS USING SEAWATER. Organization: ESDU
Date: 2003-02-01
Description: Practical guidance on the all-important matter of materials selection is then provided which underpin the recent shift towards the use of titanium rather than copper alloys. System design considerations to handle and minimise seawater fouling are reviewed, such as the effect of enhancement on one side of a heat exchanger on the parameters that control fouling (that is, velocity and temperature) on the other side of the exchanger.
API PUBL 948 - A STUDY OF VARIABLES THAT AFFECT THE CORROSION OF SOUR WATER STRIPPERS Organization: API
Date: 1996-05-01
Description: These would disappear on flushing out and opening the condensers in line with a similar problem noted on page 14 of the report. clearly, questions as to the exact mechanism of sour water stripped corrosion have not been totally resolved. However, it is generally agreed that titanium tubes provide a satisfactory solution to the problem.

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