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IPC-TM-650 2.4.14.1 - SOLDERABILITY, WAVE SOLDER METHOD Organization: IPC
Date: 1979-03-01
Description: This document is intended to provide a recommended test method, which may be used by both vendor and user to determine solderability of PWBs, with or without surface coatings, which will be soldered by wave soldering machine methods or other soldering devices.
SAE ARP1332 - WAVE SOLDERING PROCEDURE Organization: SAE
Date: 2013-08-01
Description: The purpose of this recommended practice is to provide recommendations concerning the procedure for wave soldering.  The detailed recommendations are based on manufacturing experience and laboratory experiments.
IPC-TR-460 - TROUBLE SHOOTING CHECKLIST FOR WAVE SOLDERING OF PRINTED WIRING BOARDS Organization: IPC
Date: 1984-02-01
Description: The objective of this document is to provide a checklist of causes and recommended corrective actions for various process problems encountered during the wave soldering of printed wiring board assemblies. These problems may or may not be yielding recults defined as rejectable by applicable specifications.
IPC-DVD-47 - WAVE SOLDERING Organization: IPC
DS/EN 14612 - SPACE PRODUCT ASSURANCE - VERIFICATION AND APPROVAL OF AUTOMATIC MACHINE WAVE SOLDERING Organization: DS
Date: 2003-11-12
Description: This specification defines the basic requirements for the verification and approval of automatic machine wave soldering for use in spacecraft hardware. The process requirements for wave soldering of double-sided and multilayer boards are also defined.
NBN - EN 14612 - SPACE PRODUCT ASSURANCE - VERIFICATION AND APPROVAL OF AUTOMATIC MACHINE WAVE SOLDERING Organization: NBN
Date: 2003-09-30
Description: This specification defines the basic requirements for the verification and approval of automatic machine wave soldering for use in spacecraft hardware. The process requirements for wave soldering of double-sided and multilayer boards are also defined.
NBN - EN 14612 - SPACE PRODUCT ASSURANCE - VERIFICATION AND APPROVAL OF AUTOMATIC MACHINE WAVE SOLDERING Organization: NBN
Date: 2003-09-30
Description: This specification defines the basic requirements for the verification and approval of automatic machine wave soldering for use in spacecraft hardware. The process requirements for wave soldering of double-sided and multilayer boards are also defined.
DSF/FPREN 16602-70-07 - SPACE PRODUCT ASSURANCE - VERIFICATION AND APPROVAL OF AUTOMATIC MACHINE WAVE SOLDERING Organization: DS
Description: This specification defines the basic requirements for the verification and approval of automatic machine wave soldering for use in spacecraft hardware. The process requirements for wave soldering of double-sided and multilayer boards are also defined.
CEN - EN 16602-70-07 - SPACE PRODUCT ASSURANCE - VERIFICATION AND APPROVAL OF AUTOMATIC MACHINE WAVE SOLDERING Organization: CEN
Date: 2014-10-01
Description: This specification defines the basic requirements for the verification and approval of automatic machine wave soldering for use in spacecraft hardware. The process requirements for wave soldering of doublesided and multilayer boards are also defined.
NBN - EN 16602-70-07 - SPACE PRODUCT ASSURANCE - VERIFICATION AND APPROVAL OF AUTOMATIC MACHINE WAVE SOLDERING Organization: NBN
Date: 2014-11-28
Description: This specification defines the basic requirements for the verification and approval of automatic machine wave soldering for use in spacecraft hardware. The process requirements for wave soldering of double‐sided and multilayer boards are also defined.
NPFC - DI-T-5451 - WAVE SOLDER BATH ANALYSIS Organization: NPFC
DIN EN 16602-70-07 - SPACE PRODUCT ASSURANCE - VERIFICATION AND APPROVAL OF AUTOMATIC MACHINE WAVE SOLDERING; ENGLISH VERSION EN 16602-70-07:2014 Organization: DIN
Date: 2015-01-01
Description: This specification defines the basic requirements for the verification and approval of automatic machine wave soldering for use in spacecraft hardware. The process requirements for wave soldering of doublesided and multilayer boards are also defined.
DS/EN 62739-1 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING Organization: DS
Date: 2013-09-30
Description: IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
IEC 62739-1 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY – PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING - EDITION 1.0 Organization: IEC
Date: 2013-06-01
Description: This part of the IEC 62739 series provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
CENELEC - EN 62739-1 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING Organization: CENELEC
Date: 2013-08-01
Description: This part of the IEC 62739 series provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
CEI EN 62739-1 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING Organization: CEI
Date: 2014-04-01
Description: This part of the IEC 62739 series provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
IEC 62739-3 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY – PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS - EDITION 1.0 Organization: IEC
Date: 2017-01-01
Description: This part of IEC 62739 describes the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
CENELEC - EN 62739-2 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 2: EROSION TEST METHOD FOR METAL MATERIALS WITH SURFACE PROCESSING Organization: CENELEC
Date: 2016-10-01
Description: This part of IEC 62739 provides an evaluating test method for the erosion of the metallic materials with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
DS/EN 62739-2 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY – PART 2: EROSION TEST METHOD FOR METAL MATERIALS WITH SURFACE PROCESSING Organization: DS
Date: 2016-10-11
Description: IEC 62739-2:2016 provides an evaluating test method for the erosion of the metallic materials with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
IEC 62739-2 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY – PART 2: EROSION TEST METHOD FOR METAL MATERIALS WITH SURFACE PROCESSING - EDITION 1.0 Organization: IEC
Date: 2016-07-01
Description: This part of IEC 62739 provides an evaluating test method for the erosion of the metallic materials with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

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