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The purpose of this recommended practice is to provide recommendations concerning the procedure for wave soldering.
The purpose of this recommended practice is to provide recommendations concerning the procedure for wave soldering.
The purpose of this recommended practice is to provide recommendations concerning the procedure for wave soldering.
This document is intended to provide a recommended test method, which may be used by both vendor and user to determine solderability of PWBs, with or without surface coatings, which will be soldered by wave soldering machine methods or other soldering devices. The...
FOREWORD The material published in this document is a compilation of contributions from members of several comnittees coordinated by the Soldering Solderability Specification Task Group. The objective of this document is to provide a checklist of causes and recommended corrective...
This specification defines the basic requirements for the verification and approval of automatic machine wave soldering for use in spacecraft hardware. The process requirements for wave soldering of double-sided and multilayer boards are also defined.
This specification defines the basic requirements for the verification and approval of automatic machine wave soldering for use in spacecraft hardware. The process requirements for wave soldering of doublesided and multilayer boards are also defined. This standard may be...
This part of IEC 62739 describes the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which...
This part of IEC 62739 describes the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which...
This part of the IEC 62739 series provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten...
IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
This part of the IEC 62739 series provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten...
This part of IEC 62739 provides an evaluating test method for the erosion of the metallic materials with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder. It...
IEC 62739-3:2017(E) describes the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and...
IEC 62739-2:2016 provides an evaluating test method for the erosion of the metallic materials with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder. It aims at...
