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BSI - BS 3821-2 - HARDMETAL DIES AND ASSOCIATED HARDMETAL TOOLS PART 2: AS-SINTERED PELLETS AND FINISHED DIES FOR DRAWING ROUND WIRE Organization: BSI
Date: 1974-07-29
Description: Shows the dimensions of as-sintered pellets and finished hardmetal dies and certain quality aspects of finished dies for drawing ferrous and non-ferrous round wire.
BSI - BS 3821-1 - HARDMETAL DIES AND ASSOCIATED HARDMETAL TOOLS PART 1: DESIGNATION AND MARKING OF AS-SINTERED PELLETS AND FINISHED DIES Organization: BSI
Date: 1974-07-29
Description: Specifies a designation system for pellets and finished dies for drawing wire, bar and tube and illustrates how the cases of finished dies are to be marked.
SAE AS5259 - CRIMPING TOOL AND ACCESSORIES, ELECTRICAL, SIZE 8 TO 700 KCMIL, GENERAL PURPOSE USE, DIE AND DIELESS Organization: SAE
Date: 2008-09-01
Description: This specification covers design requirements, performance requirements, and methods of procurement for tools and associated accessories used to crimp wire barrels of aircraft electrical wiring components including ferrules, terminals, splices and connector contacts on wire/cable sizes 8 to 700 KCMIL.
DIN ISO 513 - CLASSIFICATION AND APPLICATION OF HARD CUTTING MATERIALS FOR METAL REMOVAL WITH DEFINED CUTTING EDGES - DESIGNATION OF THE MAIN GROUPS AND GROUPS OF APPLICATION (ISO 513:2012) Organization: DIN
Date: 2014-05-01
Description: It is not applicable to other uses (mining and other percussion tools, wire drawing dies, tools operating by deformation of the metal and comparator contact tips, etc.).
ISO 513 - CLASSIFICATION AND APPLICATION OF HARD CUTTING MATERIALS FOR METAL REMOVAL WITH DEFINED CUTTING EDGES - DESIGNATION OF THE MAIN GROUPS AND GROUPS OF APPLICATION - FOURTH EDITION Organization: ISO
Date: 2012-11-01
Description: It is not applicable to other uses (mining and other percussion tools, wire drawing dies, tools operating by deformation of the metal and comparator contact tips, etc.).
IPC-CM-770 - GUIDELINES FOR PRINTED BOARD COMPONENT MOUNTING Organization: IPC
Date: 2004-01-01
Description: Ball Bond* – The welded connection of a bond wire to the bond pad of an integrated circuit die. The bond wire is melted to form a ball and the ball is bonded by use of thermo-compression or thermosonic techniques.
IPC-7351 - GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD - INCLUDES CD-ROM; SUBSCRIPTION CUSTOMERS CAN OBTAIN ONE COMPLIMENTARY COPY FROM IHS BY CONTACTING IHS CUSTOMER CARE AT +1 800 IHS-CARE (+1 800 447-2273) OR VISIT WWW.IHS.COM/CUSTOMERCARE; INCLUDES ACCESS TO ADDITIONAL CONTENT Organization: IPC
Date: 2010-06-01
Description: *Chip Carrier – A low-profile, usually square, surface-mount component semiconductor package whose die cavity or die mounting area is a large fraction of the package size and whose external connections are usually on all four sides of the package.

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