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BSI - BS 9526 N0001 - SPECIFICATION FOR MULTI-CONTACT EDGE SOCKET ELECTRICAL CONNECTORS - SINGLE OR DOUBLE SIDED, CLOSED ENDED, REPLACEABLE CONTACTS, THROUGH-BOARD SOLDER OR WIRE WRAP TERMINATIONS - FULL ASSESSMENT LEVEL Organization: BSI
Date: 1978-02-15
Description: Environmental classification 55/125/21.
BSI - BS 9526 N0003 - DETAIL SPECIFICATION FOR MULTI-CONTACT EDGE SOCKET ELECTRICAL CONNECTORS. SINGLE OR DOUBLE SIDED, OPEN ENDED, GUIDE KEY LOCATION, REPLACEABLE CONTACTS, THROUGH-BOARD SOLDER OR WIRE WRAP TERMINATIONS. FULL ASSESSMENT LEVEL Organization: BSI
Date: 1979-10-15
Description: Specifies connectors with 2.54 mm contact spacing and open ends. Intended for use with single or double sided printed boards of 1.42 mm to 1.80 mm thickness.
BSI - BS 9526 N0002 - SPECIFICATION FOR MULTI-CONTACT EDGE SOCKET ELECTRICAL CONNECTORS - SINGLE OR DOUBLE SIDED, OPEN ENDED, METAL FIXING FLANGES, GUIDE KEY LOCATION, REPLACEABLE CONTACTS, THROUGH-BOARD SOLDER OR WIRE WRAP TERMINATIONS - FULL ASSESSMENT LEVEL Organization: BSI
Date: 1979-02-15
Description: 2.54 mm contact spacing, metal fixing flanges fitted for use with single or double sided printed boards of 1.42 mm to 1.80 mm thickness. Environmental category 55/125/21.
UL 2734 OUTLINE - UL OUTLINE FOR INVESTIGATION CONNECTORS FOR USE WITH ON-BOARD ELECTRICAL VEHICLE (EV) CHARGING SYSTEMS - ISSUE 3 Organization: UL
Date: 2015-02-27
Description: This outline covers connectors of an on-board electric vehicle (EV) charging system. Connectors are intended to interconnect both communication and power circuit conductors rated up to 30 amperes and up to 600 volts ac or dc, within an on-board vehicle charging system.
NPFC - DSCC-DWG-89065 - GENERAL SPECIFICATION FOR HIGH PERFORMANCE, HIGH DENSITY, TWO PIECE PRINTED CIRCUIT BOARD CONNECTOR Organization: NPFC
Date: 2003-10-01
Description: This drawing outlines the general requirements for families of high density/high performance two piece electrical connectors, intended for printed circuit board attachment and connection, utilizing through hole (solder and compliant pin), surface mount, or wire harness termination techniques.
IPC-CM-770 - GUIDELINES FOR PRINTED BOARD COMPONENT MOUNTING Organization: IPC
Date: 2004-01-01
Description: Controlled Collapse Bonding (CCB) – A bonding technique that makes termination by reflowing the solder bump on a chip and connecting it to the land on the printed board.Controlled Collapse Soldering* – A technique for soldering a component (i.e., flip chip, chip scale package, BGA) to a substrate, where the component connection surface tension forces of the liquid solder supports the weight of the component and controls the height of the joint.
IPC-C-1000 - IPC ESSENTIAL DOCUMENT COLLECTION FOR BOARD DESIGN, ASSEMBLY AND MANUFACTURE - TO PURCHASE HARDCOPY COMPILATION, CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE. STANDARDS FROM THIS COMPILATION ARE AVAILABLE AS INDIVIDUAL DOCUMENTS IN IHS STANDARDS EXPERT. SEE DETAILS FOR ADDITIONAL INFORMATION. Organization: IPC
Date: 2008-06-01
Description: 1071A: Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing 1601: Printed Board Handling and Storage Guidelines 2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards 2152: Standard for Determining Current Carrying Capacity in Printed Board Design 2221B: Generic Standard on Printed Board Design 2222A: Sectional Design Standard for Rigid Organic Printed Boards 2223C: Sectional Design Standard for Flexible Printed Boards 2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies 2226: Sectional Design Standard for High Density Interconnect (HDI) Boards 2251: Design Guide for the Packaging of High Speed Electronic Circuits 2252: Design Guide for RF/Microwave Circuit Boards 2316: Design Guide for Embedded Passive Device Printed Boards 2611: Generic Requirements for Electronic Product Documentation 2612: Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descript 2612-1: Sectional Requirements for Electronic Diagramming Symbol Generation Methodology 2614: Sectional Requirements for Board Fabrication Documentation 2615: Printed Board Dimensions and Tolerances 3406: Guidelines for Electrically Conductive Surface Mount Adhesives 3408: General Requirements for Anisotropically Conductive Adhesives Films 4101D: Specification for Base Materials for Rigid and Multilayer Printed Boards 4103A-WAM1: Specification for Base Materials for High Speed/High Frequency Applications 4104: Specification for High Density Interconnect (HDI) and Microvia Materials 4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boar 4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications 4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat 4202A: Flexible Base Dielectrics for Use in Flexible Printed Circuitry 4203A: Cover and Bonding Material for Flexible Printed Circuitry 4204A-WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry 4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement 4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards 4552-WAM1-2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit 4553A: Specification for Immersion Silver Plating for Printed Boards 4554: Specification for Immersion Tin Plating for Printed Circuit Boards 4556: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating fo 4562A: Metal Foil for Printed Board Applications 4563: Resin Coated Copper Foil for Printed Boards Guideline 4761: Design Guide for Protection of Printed Board Via Structures 4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend 4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed 4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printe 5701: Users Guide for Cleanliness of Unpopulated Printed Boards 5702: Guidelines for OEMs in Determining Accept Levels of Cleanliness of Unpopulated Printed Boards 5704: Cleanliness Requirements for Unpopulated Printed Boards 6011: Generic Performance Specification for Printed Boards 6012C: Qualification and Performance Specification for Rigid Printed Boards 6013C: Qualification and Performance Specification for Flexible Printed Boards 6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive De 6018B: Qualification and Performance Specification for High Frequency (Microwave) Printed Boards 7092: Design and Assembly Process Implementation for Embedded Components 7093: Design and Assembly Process Implementation for Bottom Termination Components 7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components 7095C: Design and Assembly Process Implementation for BGAs 7351B: Generic Requirements for Surface Mount Design and Land Pattern Standard 7526: Stencil and Misprinted Board Cleaning Handbook - FREE DOWNLOAD 7801: Reflow Oven Process Control Standard 9201A: Surface Insulation Resistance Handbook 9202: Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemic 9203: Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle 9252A: Requirements for Electrical Testing of Unpopulated Printed Boards 9641: High Temperature Printed Board Flatness Guideline 9691A: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Te 9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments 9702: IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects 9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability 9704A: Printed Circuit Assembly Strain Gage Test Guideline 9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder 9707: Spherical Bend Test Method for Characterization of Board Level Interconnects 9708: Test Methods for Characterization of Printed Board Assembly Pad Cratering 9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards A-600H: Acceptability of Printed Boards A-610F: Acceptability of Electronics Assembly A-620B: Requirements and Acceptance for Cable and Wire Harness Assemblies C-406: Design & Application Guidelines for Surface Mount Connectors CA-821: General Requirements for Thermally Conductive Adhesives CC-830B: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assembl CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies CM-770E: Component Mounting Guidelines for Printed Boards D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies D-325A: Documentation Requirements for Printed Boards D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Asse D-422: Design Guide for Press Fit Rigid Printed Board Back Planes DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards DR-572A: Drilling Guidelines for Printed Boards FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Pr HDBK-005: Guide to Solder Paste Assessment HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, T J-STD-003C-WAM1: Solderability Tests for Printed Boards J-STD-004B: Requirements for Soldering Fluxes J-STD-005A: Requirements for Soldering Pastes J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices J-STD-026: Semiconductor Design Standard for Flip Chip Applications J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations J-STD-028: Performance Standard for Construction of Flip Chip and Chip Scale Bumps J-STD-030A: Selection and Application of Board Level Underfill Materials J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Device J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes MC-790: Guidelines for Multichip Module Technology Utilization ML-960: Qualification and Performance Specification for Mass Lamination Panels for Multilayer print MS-810: Guidelines for High Volume Microsection QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards S-816: SMT Process Guideline & Checklist SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting SM-784: Guidelines for Chip-on-Board Technology Implementation SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments SM-817A: General Requirements for Dielectric Surface Mount Adhesives SM-840E: Qualification and Performance Specifiation of Permanent Solder Mask and Flexible Cover Mat TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology TR-486: Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress TR-579: Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs TR-583: An In-Depth Look At Ionic Cleanliness Testing WP/TR-584A: IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Prin WP-008: Setting Up Ion Chromatography Capability
DLA - DESC-DWG-91026 - CONNECTORS, ELECTRICAL, RECTANGULAR, POLARIZED SHELL, HIGH DENSITY, NANOMINIATURE, GENERAL REQUIREMENTS FOR Organization: DLA
Date: 1993-07-07
Description: Ancillary hardware, when specified on an individual requirements drawing, shall be specified in the following format: These connectors are designed for printed wiring board to printed wiring board, printed wiring board to cable, cable to panel, or cable to cable interconnections of miniaturized equipment sub-assemblies with low power requirements.
TIA-899 - ELECTRICAL CHARACTERISTICS OF MULTIPOINT-LOW-VOLTAGE DIFFERENTIAL SIGNALING (M-LVDS) INTERFACE CIRCUITS FOR MULTIPOINT DATA INTERCHANGE Organization: TIA
Date: 2002-03-01
Description: It is intended that this Standard will be referenced by other standards that specify the complete interface (i.e., connector, pin assignments, function) for applications where the electrical characteristics of a multipoint low-voltage differential interface circuit is required.
BRE DG456 - PREFABRICATED POWER CABLING FOR BUILDINGS; PROCURING, INSTALLING AND TESTING - K BROMLEY, H GRAVES AND L ROCHE Organization: BRE
Date: 2001-01-01
Description: The home run cable is wired conventionally to the main distribution board at the building's electrical supply inlet. Prefabricated extender cables are plugged into the MCH to feed power to luminaires, air conditioning units (eg variable air volume boxes or fan coil units) and socket outlets through prefabricated ‘T' connectors, electronic control modules or additional zone cable hubs.
DS/EN 61851-1 - ELECTRIC VEHICLE CONDUCTIVE CHARGING SYSTEM - PART 1: GENERAL REQUIREMENTS Organization: DS
Date: 2011-10-05
Description: IEC 61851-1:2010 applies to on-board and off-board equipment for charging electric road vehicles at standard a.c. supply voltages (as per IEC 60038) up to 1 000 V and at d.c. voltages up to 1 500 V, and for providing electrical power for any additional services on the vehicle if required when connected to the supply network.
SNZ AS/NZS IEC 60947.7.4 - LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR PART 7.4: ANCILLARY EQUIPMENT-PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS Organization: SNZ
Date: 2015-06-29
Description: Mounting and fixing on the printed circuit board is made by soldering, press-in or equivalent methods to provide electrical and mechanical connection between copper conductors and the printed circuit board. This standard applies to PCB terminal blocks intended to connect copper conductors, with or without special preparation, having a cross-section between 0,05 mm2 and 300 mm2 (AWG 30/600 kcmil), intended to be used in circuits of a rated voltage not exceeding 1 000 V a.c. up to 1 000 Hz or 1 500 V d.c.
CEI EN 60947-7-4 - LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR PART 7-4: ANCILLARY EQUIPMENT - PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS Organization: CEI
Date: 2014-07-01
Description: Mounting and fixing on the printed circuit board is made by soldering, press-in or equivalent methods to provide electrical and mechanical connection between copper conductors and the printed circuit board. This standard applies to PCB terminal blocks intended to connect copper conductors, with or without special preparation, having a cross-section between 0,05 mm2 and 300 mm2 (AWG 30/600 kcmil), intended to be used in circuits of a rated voltage not exceeding 1 000 V a.c. up to 1 000 Hz or 1 500 V d.c.
CENELEC - EN 60947-7-4 - LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS Organization: CENELEC
Date: 2013-10-01
Description: Mounting and fixing on the printed circuit board is made by soldering, press-in or equivalent methods to provide electrical and mechanical connection between copper conductors and the printed circuit board. This standard applies to PCB terminal blocks intended to connect copper conductors, with or without special preparation, having a cross-section between 0,05 mm2 and 300 mm2 (AWG 30/600 kcmil), intended to be used in circuits of a rated voltage not exceeding 1 000 V a.c. up to 1 000 Hz or 1 500 V d.c.
IEC 60947-7-4 - LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR – PART 7-4: ANCILLARY EQUIPMENT – PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS - EDITION 1.0 Organization: IEC
Date: 2013-08-01
Description: Mounting and fixing on the printed circuit board is made by soldering, press-in or equivalent methods to provide electrical and mechanical connection between copper conductors and the printed circuit board. This standard applies to PCB terminal blocks intended to connect copper conductors, with or without special preparation, having a cross-section between 0,05 mm2 and 300 mm2 (AWG 30/600 kcmil), intended to be used in circuits of a rated voltage not exceeding 1 000 V a.c. up to 1 000 Hz or 1 500 V d.c.
IPC-C-103 - ELECTRONICS ASSEMBLY STANDARDS COLLECTION - TO PURCHASE HARDCOPY COMPILATION, CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE. STANDARDS FROM THIS COMPILATION ARE AVAILABLE AS INDIVIDUAL DOCUMENTS IN IHS STANDARDS EXPERT. SEE DETAILS FOR ADDITIONAL INFORMATION. Organization: IPC
Date: 2008-06-01
Description: 2611: Generic Requirements for Electronic Product Documentation 2612: Sectional Requirements for Electronic Diagramming Documentation (schematic and Logic Description) 2612-1: Sectional Requirements for Electronic diagramming Synbol Generation Methodology 3406: Guidelines for Electrically Conductive Surface Mount Adhesives 3408: General Requirements for anisotropically Conductive Adhesives Films 7095B: Design and Assembly Process Implementation for BGAs 7351B: Generic Requirements for Surface Mount Design and Land Pattern Standard 9202: Material and Process Characterization/Qualifiaation Test Protocol and Assessing Electrochemical 9203: Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle 9701A: Performance Test Methods and Qualification Requirements for Surface Mount Soulder Attachements 9702: IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects 9703: IPCJEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability 9704A: Printed Circuit Assembly Strain Gage Test Guideline 9707: Spherical Bend Test Method for Characterization of Board Level Interconnects 9708: Test Methods for Charaterization of Printed Board Assembly Pad Cratering A-610E: Acceptability of Electronic Assemblies A-620A: Requirements and Acceptance for Cable and Wire Harness Assemblies A-620AS: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A C-406: Design & Application Guidelines for Surface Mount Connectors CA-821: General Requirements for Thermally Conductive Adhesives CC-830B: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assembly CM-770E: Component Mounting Guidelines for Printed Boards D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assembly HDBK-001E: Handbook and Guide to Supplement J-STD-001 HDBK-005: Guide to Solder Paste Assessment JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies J-STD-002C: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires J-STD-003B: Solderability Tests for Printed Boards J-STD-004B: Requirements for Soldering Fluxes J-STD-005A: Requirements for Soldering Pastes J-STD-006B: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders J-STD-012: Implementation of Flip Chip & Chip Scale Technology J-STD-020D-1: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surf J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configureations J-STD-028: Performance Standard for Construction of Flip Chip and Chip Scale Bumps J-STD-030: Guideline for Selection and Application of Underfill Material for Flip Chip J-STD-033C: Handling, Packing, Shipping, and Use of Moisture/Reflow and/or Process Sensitie Components J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes MC-790: Guidelines for Multichip Module Technolgy Utilization S-816: SMT Process Guideline & Checklist SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting SM-784: Guidelines for Chip-on-Board Technoloty Implementation SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments SM-817: General Requiremnts for Dielectric Surface Mounting Adhesives T-50J: Terms and Definitions for Interconnecting and Packaging Electronic Circuits TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology
PACKT - INTERNET OF THINGS WITH - INTERNET OF THINGS WITH ARDUINO BLUEPRINTS Organization: PACKT
Date: 2015-10-27
Description: The hardware consists of a simple microcontroller, board, and chipset. It comes with a Java-based IDE to allow creators to program the board. Arduino is the ideal open hardware platform for experimenting with the world of the Internet of Things.
UL 2594 OUTLINE - OUTLINE OF INVESTIGATION FOR ELECTRIC VEHICLE SUPPLY EQUIPMENT - ISSUE 3 Organization: UL
Date: 2011-08-05
Description: EV Cables are covered by the Standard for Flexible Cords and Cables, UL 62, and the Reference Standard for Electrical Wires, Cables, and Flexible Cords, UL 1581. With reference to 1.2, this outline does not cover electric vehicle charging units.
IPC-7351 - GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD - INCLUDES CD-ROM; SUBSCRIPTION CUSTOMERS CAN OBTAIN ONE COMPLIMENTARY COPY FROM IHS BY CONTACTING IHS CUSTOMER CARE AT +1 800 IHS-CARE (+1 800 447-2273) OR VISIT WWW.IHS.COM/CUSTOMERCARE; INCLUDES ACCESS TO ADDITIONAL CONTENT Organization: IPC
Date: 2010-06-01
Description: *Through Connection – The electrical connection to connect conductor patterns on the front side through to the back side of a printed board.
CEI EN 62282-5-1 - FUEL CELL TECHNOLOGIES PART 5-1: PORTABLE FUEL CELL POWER SYSTEMS - SAFETY Organization: CEI
Date: 2013-07-01
Description: This standard does not apply to portable fuel cell power systems that are a) permanently connected (hard wired) to the electrical distribution system, b) permanently connected to a utility fuel distribution system, c) exporting power to the grid, d) for propulsion of road vehicles, e) intended to be used on board passenger aircraft.

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