loading
NAVISTAR TMS 6819 - Grease, Dielectric
June 1, 2008 - NAVISTAR

This specification covers the physical and chemical properties for dielectric grease including quality plan, source approval, quality control, and shipping and identification requirements. Restricted Chemical Substances Effective January 1, 2007, all product supplied to the requirements of...

GMKOREA EDS-M-6105 - Synthetic Dielectric Wadding
September 1, 2010 - GMKOREA

Introduction Note: Nothing in this standard supersedes applicable laws and regulations. Note: In the event of conflict between the Korean and English language, the Korean language shall take precedence. Purpose. This specification specifies the requirements of basic property for patterns and...

DELPHI DX900055 - DIELECTRIC EMBOSSING OF CARPET
June 1, 1999 - DELPHI-I

This procedure is used to determine the ability of carpet to be dielectrically embossed to vinyl coated foundation board.

DELPHI DX200300 - POLYESTER DIELECTRIC SIDEWALL PADDING
June 1, 1999 - DELPHI-I

1. SCOPE The padding covered by this specification shall be used between foundations and trim materials in dielectrically embossed assemblies.

IPC-TM-650 2.5.7 - Dielectric Withstanding Voltage, PCB
May 1, 2004 - IPC

The dielectric withstanding voltage test (also called high-potential, over potential, voltage breakdown, or dielectric strength test) consists of the application of a voltage higher than rated voltage for a specific time between mutually isolated portions of a PCB or between isolated...

DELPHI DX900034 - DIELECTRIC EMBOSSING OF PADDING
March 1, 2000 - DELPHI-I

This procedure is used to determine the ability of padding to be dielectrically embossed to sidewall panels and to retain the bond under service conditions.

DELPHI DX900060 - DIELECTRIC EMBOSSING OF VINYL
June 1, 1999 - DELPHI-I

This procedure is used to determine the ability of vinyl to be dielectrically embossed to sidewall panels and to retain the bond under service conditions.

DELPHI DX201800 - DIELECTRIC EMBOSSING SUBFOUNDATION BOARD
June 1, 1999 - DELPHI-I

1. SCOPE This specification covers the requirements of a waterproofed, homogeneous solid fiber sheet having a dielectrically active plastic film or coating on one facing. The sheet may be used as a trim subfoundation in conjunction with embossing processes using resin treated padding

DELPHI DX200400 - DIELECTRIC EMBOSSING PAD
June 1, 1999 - DELPHI-I

1. SCOPE This specification describes a pad used between foundation and trim materials and other applications for dielectric embossing. The padding shall be uniform and homogeneous throughout and shall not contain any resin segregations. Wrinkles on surface or within the padding are...

Advertisement