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This test method defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated and reflowed solder printed boards both prior to and after soldering), nonmelting metals, and printed board substrates.
This handbook addresses aqueous cleaning of electrical/ electronic parts and application tools after soldering. Purpose The content of this text is intended to provide a basic understanding of the subject and to serve as a guide to users or prospective users of aqueous cleaning technology,...
Specifies requirements for 37 soft solder alloys.
This guideline is applicable to existing lead solder production products that will change to lead-free solder processes to meet the ELV Directive 2000/53/EC Annex II, exemption 8B requirements. This guideline is applicable to similar products used by multiple OEM's that have the same...
This guideline is applicable to existing lead solder production products that will change to lead-free solder processes to meet the ELV Directive 2000/53/EC Annex II, exemption 8B requirements. This guideline is applicable to similar products used by multiple OEM's that have the same...
This International Standard specifies the requirements for chemical composition for soft solder alloys containing two or more of: - tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An indication of the forms generally available is also included.
This Standard for cast copper alloy solder joint pressure fittings designed for use with copper water tube establishes requirements for (a) pressure-temperature
This Japanese Industrial Standard specifies the methods for determination of alloy components (tin, silver, antimony, bismuth, copper, indium, zinc, nickel, germanium and lead) and of impurities (lead, silver, antimony, bismuth, copper, indium, zinc, nickel, iron, aluminium, arsenic, cadmium and...
This test method is used to determine whether solid state devices can withstand the effect of the temperature shock to which they will be subjected during soldering of their leads in a solderwave process and/or solder fountain (rework/replacement)
WARNING - National or regional regulations may limit the employment of certain alloys. This International Standard specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium....
