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IPC-9111 - Troubleshooting for Printed Board Assembly Processes
January 1, 2019 - IPC

Purpose and Format The purpose of this Handbook is to provide guidance in the form of troubleshooting examples, process cause and effect information and statistical methods for correcting problems in all areas relating to the design, manufacture, assembly, and test of printed wiring products. A...

IPC/JEDEC-9301 - Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability
December 1, 2018 - IPC

Introduction This document is an effort to standardize and document some of the basic tenets of a typical Finite Element Analysis (FEA) model. The intent of this document is to help educate new designers (and in some cases even experienced designers) on the basic information and best practices that...

IPC-CC-830 - Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
December 1, 2018 - IPC

This standard establishes qualification and conformance requirements for electrical insulating compounds (conformal coatings). It has been designed and constructed with the intent of obtaining maximum confidence in the materials with minimum test redundancy. This standard covers: • The...

IPC-WP-019 - An Overview on Global Change in Ionic Cleanliness Requirements
September 1, 2018 - IPC

Overview For many years, military (e.g., MIL-STD-2000) and commercial (e.g., IPC-J-STD-001) manufacturing standards have required manufactured circuit card assemblies (CCAs) to meet an ionic cleanliness requirement of 1.56 microgram (μg) of sodium chloride (NaCl) equivalence per square...

IPC-WP-019 SPANISH - An Overview on Global Change in Ionic Cleanliness Requirements
September 1, 2018 - IPC
A description is not available for this item.
IPC-WP-019 GERMAN - An Overview on Global Change in Ionic Cleanliness Requirements
September 1, 2018 - IPC
A description is not available for this item.
IPC PERM-WP-022 - Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow – Results of an Industry Round-Robin – Final Report
August 1, 2018 - IPC

The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take full advantage of this phenomenon, it is necessary to understand the conditions under which such coverage...

IPC-WP-024 - IPC White Paper on Reliability and Washability of Smart Textile Structures – Readiness for the Market
August 1, 2018 - IPC

Executive Summary The notion of smart materials was defined in Japan in 1989. The first textile material that, in retroaction, was labelled as a smart textile was silk thread having a shape memory. The discovery of shape memory materials in the 1960s and intelligent polymeric gels in the 1970s was,...

IPC-1791 - Trusted Electronic Designer, Fabricator and Assembler Requirements
August 1, 2018 - IPC

This standard provides minimum requirements, policies and procedures for printed board design, fabrication and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. These trusted sources shall ensure...

IPC-4204 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
August 1, 2018 - IPC

This standard establishes the classification system, the qualification and quality conformance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible printed boards. Classification System The system described in 1.1.1 through 1.1.2.7 identifies...

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