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IPC-7095 - Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
June 1, 2018 - IPC

This standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. Purpose The purpose of this standard is to...

IPC-WP-023 - IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance Via Chain Continuity Reflow Test: The Hidden Reliability Threat - Weak Microvia Interface
May 1, 2018 - IPC

Introduction The proliferation of copper-filled stacked microvias in printed boards has resulted in the identification of a hidden reliability threat - a weak interface between the microvia target pad and the electrolytic copper fill. When thermally stressed, the generally weak interface fractures....

IPC-1754 - Materials Declaration Standard for Aerospace and Defense
April 1, 2018 - IPC

This standard establishes the requirements for exchanging material and substance data for Products between suppliers and their customers for Aerospace and Defence (AD), Heavy Equipment (HE) and other industries. This standard covers the process for exchanging data on chemical substances...

J-STD-033 - Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
April 1, 2018 - IPC

This standard applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices and other moisture sensitive devices made with moisture-permeable materials (epoxies, silicones, etc.) that are exposed to the...

IPC-HDBK-620 - Handbook and Guide to IPC-D-620 and IPC/WHMA-A-620
April 1, 2018 - IPC

This Handbook is a companion reference to IPC-D-620 ''Design and Critical Process Requirements for Cable and Wiring Harnesses'' and IPC/WHMA-A-620 ''Requirements and Acceptance for Cable and Wire Harness Assemblies'' and is intended to provide supporting information, guidance,...

IPC-2292 - Design Standard for Printed Electronics on Flexible Substrates
March 1, 2018 - IPC

This standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on flexible substrates. Flexible substrates, as pertain to this standard, are materials or devices which have some amount of...

IPC-4203 - Cover and Bonding Material for Flexible Printed Circuitry
March 1, 2018 - IPC

This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, and supported or unsupported adhesive...

IPC/WHMA-A-620-S - Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C
March 1, 2018 - IPC

This Addendum provides additional requirements over those published in IPC/WHMA-A-620C to ensure the performance of cable and wire harness assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. Where content criteria are not...

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