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J-STD-001-S - Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies
March 1, 2018 - IPC

This Addendum provides requirements to be used in addition to, and in some cases, in place of, those published in J-STD-001G to ensure the reliability of soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments in space and military applications....

IPC/PERM-2901 - Pb-free Design & Assembly Implementation Guide
February 1, 2018 - IPC

The intent of this design guide is to assist design engineers in developing electronics that are completely Pb-free and meet the demanding requirements of ADHP systems and products. (For the present time, wiring/cabling is not included in the scope.) It is assumed that the design engineers using...

IPC-4591 - Requirements for Printed Electronics Functional Conductive Materials
January 1, 2018 - IPC

This standard establishes the classification system and the qualification and quality conformance requirements for functional conductive materials used in printed electronics applications. Purpose The purpose of this standard is to provide practitioners of printed electronics with the necessary...

IPC-7621 - Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
January 1, 2018 - IPC

Encapsulation, for the purpose of this document, is defined as a low pressure molded thermoplastic, e.g., polyamide, which is brought to a liquid state and injection molded and (rather quickly) returned to a temperature below its melting point, forming a durable yet pliable (rubbery-like) form. The...

IPC-6903 CHINESE - Terms and Definitions for the Design and Manufacture of Printed Electronics
January 1, 2018 - IPC
A description is not available for this item.
IPC-4591 CHINESE - Requirements for Printed Electronics Functional Conductive Materials
January 1, 2018 - IPC
A description is not available for this item.
IPC-DRM-SMT - Surface Mount Solder Joint Evaluation Training & Reference Guide
January 1, 2018 - IPC
A description is not available for this item.
IPC-DRM-PTH - Through-Hole Solder Joint Evaluation Training & Reference Guide
January 1, 2018 - IPC
A description is not available for this item.
IPC-7094 - Design and Assembly Process Implementation for Flip Chip and Die-Size Components
January 1, 2018 - IPC

This document describes the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly. The effect of bare-die or die-size components in a flip chip format has an impact on component characteristics and dictates the appropriate assembly methodology....

IPC-6903 - Terms and Definitions for the Design and Manufacture of Printed Electronics
January 1, 2018 - IPC

This standard provides industry-approved terms and definitions for the design and manufacture of printed electronics. Purpose The purpose of this standard is to provide the electronics industry with terms and definitions for specifying, designing and manufacturing printed electronics (additive...

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